Patents by Inventor Katsunori Haruna

Katsunori Haruna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5041508
    Abstract: An anaerobic composition comprising a polymerizable monomer having at least one ethylenic double bond, a free radical initiator and at least one azole compound.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: August 20, 1991
    Assignee: Three Bond Co., Ltd.
    Inventors: Katsunori Haruna, Shuji Mochizuki, Atsushi Okuma
  • Patent number: 4985523
    Abstract: An anaerobically curing adhesive sealing composition comprising (A) a mono(meth)acrylate monomer represented by formula (I) ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; and R.sub.2 represents ##STR2## and (B) a (meth)acrylate prepolymer having a urethane structure in the main chain thereof and having an average molecular weight of 10,000 or more and further containing (C) a (meth)acrylate prepolymer having a urethane structure in the main chain thereof and an average molecular weight of at most 5,000. The sealing composition exhibits, upon curing, excellent elasticity and properties to follow an adherend while retaining excellent resistance to oil and heat as possessed by acrylate type reactive sealing compositions.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: January 15, 1991
    Assignee: Three Bond Co., Ltd.
    Inventors: Shuji Mochizuki, Atsushi Okuma, Katsunori Haruna