Patents by Inventor Katsunori Ichino
Katsunori Ichino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094644Abstract: A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.Type: ApplicationFiled: September 12, 2023Publication date: March 21, 2024Inventors: Makoto OGATA, Katsuya HASHIMOTO, Katsunori ICHINO, Masataka TANAKA, Kazuya KUDO
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Patent number: 11587805Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.Type: GrantFiled: June 10, 2020Date of Patent: February 21, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Tomoki Okazawa, Katsunori Ichino, Masanobu Watanabe
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Publication number: 20210020464Abstract: A substrate processing apparatus includes a discharge part including a nozzle configured to discharge a processing liquid onto a substrate; a liquid feeder configured to feed the processing liquid to the discharge part; a replenishment part configured to replenish the liquid feeder with the processing liquid to be fed to the discharge part; a connector including a switching valve configured to open/close a flow path between the replenishment part and the liquid feeder; a filter configured to remove foreign matters contained in the processing liquid; a replenishment preparation part configured to open the switching valve after reducing a pressure difference between the inside of the replenishment part and the liquid feeder; and a replenishment controller configured to start replenishment of the processing liquid from the replenishment part to the liquid feeder in a state in which the switching valve is opened by the replenishment preparation part.Type: ApplicationFiled: July 16, 2020Publication date: January 21, 2021Inventors: Masayuki KAJIWARA, Katsunori ICHINO, Daisuke ISHIMARU, Takuya TAJIRI, Atsushi YAMAMOTO, Masato IMAMURA, Tomohiko MUTA, Tetsuro IRIYAMA, Takeaki SAKAMOTO, Hiroki OKAGUCHI, Kenji ADACHI
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Publication number: 20200395227Abstract: A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.Type: ApplicationFiled: June 10, 2020Publication date: December 17, 2020Inventors: Tomoki OKAZAWA, Katsunori ICHINO, Masanobu WATANABE
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Patent number: 10807027Abstract: A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.Type: GrantFiled: August 30, 2018Date of Patent: October 20, 2020Assignee: Tokyo Electron LimitedInventors: Katsunori Ichino, Tsunenaga Nakashima, Hideo Funakoshi, Nobuaki Matsuoka, Masayuki Kajiwara
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Patent number: 10262880Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.Type: GrantFiled: February 19, 2013Date of Patent: April 16, 2019Assignee: Tokyo Electron LimitedInventors: Derek W. Bassett, Wallace P. Printz, Joshua S. Hooge, Katsunori Ichino, Yuichi Terashita, Kousuke Yoshihara
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Publication number: 20190076763Abstract: A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.Type: ApplicationFiled: August 30, 2018Publication date: March 14, 2019Inventors: Katsunori ICHINO, Tsunenaga NAKASHIMA, Hideo FUNAKOSHI, Nobuaki MATSUOKA, Masayuki KAJIWARA
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Patent number: 10201826Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.Type: GrantFiled: June 3, 2015Date of Patent: February 12, 2019Assignee: Tokyo Electron LimitedInventors: Katsunori Ichino, Takayuki Ishii, Kouzou Kawahara, Daisuke Simokawa, Kazuyuki Tashiro
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Patent number: 10022652Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: November 21, 2017Date of Patent: July 17, 2018Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Publication number: 20180093205Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: ApplicationFiled: November 21, 2017Publication date: April 5, 2018Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Patent number: 9878267Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: June 30, 2017Date of Patent: January 30, 2018Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Publication number: 20170296944Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: ApplicationFiled: June 30, 2017Publication date: October 19, 2017Inventors: Kousuke YOSHIHARA, Katsunori ICHINO, Toshinobu FURUSHO, Takashi SASA, Katsuhiro TSUCHIYA, Yuichi TERASHITA, Hirofumi TAKEGUCHI
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Patent number: 9731226Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: GrantFiled: February 22, 2013Date of Patent: August 15, 2017Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Patent number: 9613836Abstract: A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.Type: GrantFiled: June 19, 2014Date of Patent: April 4, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Katsunori Ichino, Kousuke Yoshihara, Yuichi Terashita
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Publication number: 20150352587Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.Type: ApplicationFiled: June 3, 2015Publication date: December 10, 2015Inventors: Katsunori Ichino, Takayuki Ishii, Kouzou Kawahara, Daisuke Simokawa, Kazuyuki Tashiro
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Patent number: 9165763Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.Type: GrantFiled: July 3, 2013Date of Patent: October 20, 2015Assignee: Tokyo Electron LimitedInventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
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Publication number: 20150000517Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.Type: ApplicationFiled: February 22, 2013Publication date: January 1, 2015Applicant: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
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Publication number: 20150004311Abstract: A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.Type: ApplicationFiled: June 19, 2014Publication date: January 1, 2015Inventors: Katsunori ICHINO, Kousuke YOSHIHARA, Yuichi TERASHITA
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Publication number: 20140235070Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.Type: ApplicationFiled: February 19, 2013Publication date: August 21, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Derek W. Bassett, Wallace P. Printz, Joshua S. Hooge, Katsunori Ichino, Yuichi Terashita, Kousuke Yoshihara
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Patent number: 8691336Abstract: A coating treatment method includes: a first step of discharging a coating solution from a nozzle to a central portion of a substrate while acceleratingly rotating the substrate, to apply the coating solution over the substrate; a second step of then decelerating the rotation of the substrate and continuously rotating the substrate; and a third step of then accelerating the rotation of the substrate to dry the coating solution on the substrate. In the first step, the acceleration of the rotation of the substrate is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the substrate at all times.Type: GrantFiled: March 23, 2011Date of Patent: April 8, 2014Assignee: Tokyo Electron LimitedInventors: Kousuke Yoshihara, Katsunori Ichino