Patents by Inventor Katsunori Ichino

Katsunori Ichino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10262880
    Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: April 16, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Derek W. Bassett, Wallace P. Printz, Joshua S. Hooge, Katsunori Ichino, Yuichi Terashita, Kousuke Yoshihara
  • Publication number: 20190076763
    Abstract: A treatment solution supply apparatus to supply a treatment solution to a treatment solution discharge unit via a supply path that is provided with a filter configured to remove foreign substances in the treatment solution and a tubephragm pump to send the treatment solution, the supply path has an opening/closing valve on an upstream side of the tubephragm pump and the filter, and a suck-back valve on a downstream side of the tubephragm pump and the filter, and includes a control unit to control at least the tubephragm pump, the opening/closing valve, and the suck-back valve, wherein the control unit performs: a control of stopping sending of the treatment solution from the tubephragm pump; and a control of suspending discharge of the treatment solution from the treatment solution discharge unit by operation of the suck-back valve, and then closing the opening/closing valve to stop the discharge.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 14, 2019
    Inventors: Katsunori ICHINO, Tsunenaga NAKASHIMA, Hideo FUNAKOSHI, Nobuaki MATSUOKA, Masayuki KAJIWARA
  • Patent number: 10201826
    Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: February 12, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Takayuki Ishii, Kouzou Kawahara, Daisuke Simokawa, Kazuyuki Tashiro
  • Patent number: 10022652
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 17, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20180093205
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: November 21, 2017
    Publication date: April 5, 2018
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Patent number: 9878267
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: January 30, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20170296944
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 19, 2017
    Inventors: Kousuke YOSHIHARA, Katsunori ICHINO, Toshinobu FURUSHO, Takashi SASA, Katsuhiro TSUCHIYA, Yuichi TERASHITA, Hirofumi TAKEGUCHI
  • Patent number: 9731226
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: August 15, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Patent number: 9613836
    Abstract: A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: April 4, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsunori Ichino, Kousuke Yoshihara, Yuichi Terashita
  • Publication number: 20150352587
    Abstract: Disclosed is a liquid coating method. The method executes processes of: coating a coating liquid in a spiral form on a surface of a substrate by ejecting the coating liquid from the ejection nozzle while moving the ejection nozzle in a predetermined direction between the rotary axis and a peripheral edge of the substrate during rotation of the substrate; making a linear velocity at an ejection position of the coating liquid from the ejection nozzle substantially constant by reducing a number of rotations of the substrate as the ejection position is positioned closer to the peripheral edge of the substrate; and making an ejection flow rate of the coating liquid ejected from the ejection nozzle substantially constant by changing a gap between the ejection port of the ejection nozzle and the surface of the substrate based on a flow rate of the coating liquid before ejection from the ejection nozzle.
    Type: Application
    Filed: June 3, 2015
    Publication date: December 10, 2015
    Inventors: Katsunori Ichino, Takayuki Ishii, Kouzou Kawahara, Daisuke Simokawa, Kazuyuki Tashiro
  • Patent number: 9165763
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: October 20, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
  • Publication number: 20150004311
    Abstract: A coating film forming apparatus includes: a substrate holding unit to horizontally hold a substrate; a rotating mechanism to rotate the substrate held by the substrate holding unit; a coating liquid supplying mechanism to supply coating liquid to form a coating film on the substrate; an annular member to rectify a gas stream above a periphery of the substrate when liquid film of the coating liquid is dried by rotation of the substrate, the annular member being provided above the periphery of the substrate and along a circumferential direction of the substrate so as to cover the periphery of the substrate; and a protrusion provided on an inner periphery of the annular member along circumferential direction of the annular member so as to protrude upward to reduce component of the gas stream flowing directly downward near an inner peripheral edge of the annular member.
    Type: Application
    Filed: June 19, 2014
    Publication date: January 1, 2015
    Inventors: Katsunori ICHINO, Kousuke YOSHIHARA, Yuichi TERASHITA
  • Publication number: 20150000517
    Abstract: A solution treatment apparatus connected to a supply nozzle that supplies a treatment solution to a substrate, includes: a supply pipeline connecting a treatment solution storage container and the supply nozzle; a filter apparatus provided in the supply pipeline; a pump on a secondary side of the filter apparatus; a circulation pipeline connecting a discharge side of the pump and an intake side of the filter apparatus; a supply control valve provided in the supply pipeline on a secondary side of the pump; a circulation control valve provided in the circulation pipeline; and a control unit, wherein the control unit opens the circulation control valve and drives the pump when supply of the treatment solution from the supply nozzle to the substrate is stopped by closing the supply control valve, to thereby circulate the treatment solution between the supply pipeline having the filter apparatus and the circulation pipeline.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 1, 2015
    Applicant: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino, Toshinobu Furusho, Takashi Sasa, Katsuhiro Tsuchiya, Yuichi Terashita, Hirofumi Takeguchi
  • Publication number: 20140235070
    Abstract: Techniques disclosed herein provide an apparatus and method of spin coating that inhibits the formation of wind marks and other defects from turbulent fluid-flow, thereby enabling higher rotational velocities and decreased drying times, while maintaining film uniformity. Techniques disclosed herein include a fluid-flow member, such as a ring or cover, positioned or suspended above the surface of a wafer or other substrate. The fluid-flow member has a radial curvature that prevents wind marks during rotation of a wafer during a coating and spin drying process.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 21, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Derek W. Bassett, Wallace P. Printz, Joshua S. Hooge, Katsunori Ichino, Yuichi Terashita, Kousuke Yoshihara
  • Patent number: 8691336
    Abstract: A coating treatment method includes: a first step of discharging a coating solution from a nozzle to a central portion of a substrate while acceleratingly rotating the substrate, to apply the coating solution over the substrate; a second step of then decelerating the rotation of the substrate and continuously rotating the substrate; and a third step of then accelerating the rotation of the substrate to dry the coating solution on the substrate. In the first step, the acceleration of the rotation of the substrate is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the substrate at all times.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Kousuke Yoshihara, Katsunori Ichino
  • Publication number: 20130295777
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 7, 2013
    Inventors: Katsunori ICHINO, Koji TAKAYANAGI, Tomohiro NODA
  • Patent number: 8501274
    Abstract: A substrate is rotated at a first rotation number (first step). The rotation of the substrate is decelerated to 1500 rpm that is a second rotation number and the substrate is rotated at the second rotation number for 0.5 seconds (second step). The rotation of the substrate is further decelerated to a third rotation number and the substrate is rotated at the third rotation number (third step). The rotation of the substrate is accelerated to a fourth rotation number and the substrate is rotated at the fourth rotation number (fourth step). A resist solution is continuously supplied to a center portion of the substrate from a middle of the first step to a middle of the third step.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: August 6, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Koji Takayanagi, Tomohiro Noda
  • Patent number: 8304018
    Abstract: There is provided a coating method which can efficiently apply a coating liquid, such as a liquid resist, to the entire surface of a wafer even when the coating liquid is supplied in a smaller amount than a conventional one, and can therefore reduce the consumption of the coating liquid. The coating method includes: a first step of rotating the substrate at a first rotating speed while supplying the coating liquid onto approximately the center of the rotating substrate; a second step of rotating the substrate at a second rotating speed which is lower than the first rotating speed; a third step of rotating the substrate at a third rotating speed which is higher than the second rotating speed; and a fourth step of rotating the substrate at a fourth rotating speed which is higher than the second rotating speed and lower than the third rotating speed.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: November 6, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Koji Takayanagi, Tomohiro Iseki, Katsunori Ichino, Kousuke Yoshihara
  • Publication number: 20110312190
    Abstract: A coating method based on such a technique includes a prewetting step of supplying a prewetting liquid to the center of a substrate (W) and rotating the substrate thereby spreading the prewetting liquid over the whole surface of a first substrate, and a coating film forming step of supplying a coating solution (e.g., a resist solution) to the substrate supplied with the prewetting liquid and drying the coating solution thereby forming a coating film on the surface of the first substrate. The prewetting liquid used is a mixed liquid obtained by mixing a solvent capable of dissolving components of the coating film (e.g., components of resist) and a high surface tension liquid having a surface tension higher than that of the solvent, the mixed liquid having a surface tension higher than that of the coating solution.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 22, 2011
    Applicant: Tokyo Electron Limited
    Inventors: Katsunori Ichino, Kentaro Yoshihara, Kousuke Yoshihara
  • Publication number: 20110250765
    Abstract: A coating treatment method includes: a first step of discharging a coating solution from a nozzle to a central portion of a substrate while acceleratingly rotating the substrate, to apply the coating solution over the substrate; a second step of then decelerating the rotation of the substrate and continuously rotating the substrate; and a third step of then accelerating the rotation of the substrate to dry the coating solution on the substrate. In the first step, the acceleration of the rotation of the substrate is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the substrate at all times.
    Type: Application
    Filed: March 23, 2011
    Publication date: October 13, 2011
    Applicant: Tokyo Electron Limited
    Inventors: Kousuke YOSHIHARA, Katsunori ICHINO