Abstract: A combined cycle power generating plant has a fluidized bed furnace and a heat exchanger disposed therein, a steam turbine which is driven by steam generated in the heat exchanger and a gas turbine which is driven by combustion gas generated in the fluidized bed furnace. If the output of the whole of the plant is increased, the pressure in the fluid bed furnace is increased by supplying water into the fluidized bed furnace and then the amount of steam generated in the heat exchanger is increased by elevating the height of the fluidized bed.

Abstract: An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.

Abstract: A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

Abstract: A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of the semiconductor elements to the cooling medium is provided near the cooling elements and between the thermal conductor and a channel plate mounted on the thermal conductor.