Abstract: An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer 20 having an insulated substrate 21, two first conductor pads 22, two second conductor pads 23 and two conductor vias 24 connecting the first conductor pads 22 and second conductor pads 23; and a multilayer ceramic capacitor 10 having external electrodes 12 that are each connected to each first conductor pad 22 of the interposer 20 via solder SOL. Each conductor via 24 of the interposer 20 has a through hole 24a inside, and a void GA not filled with the solder SOL is present in each through hole 24a on the second conductor pad 23 side. The multilayer ceramic capacitor with interposer is capable of suppressing noise due to electrostriction.

Abstract: A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction.

Abstract: An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer 20 having an insulated substrate 21, two first conductor pads 22, two second conductor pads 23 and two conductor vias 24 connecting the first conductor pads 22 and second conductor pads 23; and a multilayer ceramic capacitor 10 having external electrodes 12 that are each connected to each first conductor pad 22 of the interposer 20 via solder SOL. Each conductor via 24 of the interposer 20 has a through hole 24a inside, and a void GA not filled with the solder SOL is present in each through hole 24a on the second conductor pad 23 side. The multilayer ceramic capacitor with interposer is capable of suppressing noise due to electrostriction.

Abstract: An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner.

Abstract: A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction.

Abstract: An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner.