Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.

Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.

Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.

Abstract: According to one embodiment, in a first imaging mode, an imaging mode control unit allows a second imaging optical system to function in an optical path between an imaging unit and a first imaging optical system and stops focus adjustment. In a second imaging mode, the imaging mode control unit stops the function of the second imaging optical system and allows the focus adjustment to be performed. The first imaging optical system takes in a light from an object to the imaging unit. The second imaging optical system forms an image piece in each pixel block.

Abstract: Certain embodiments provide a camera module including a blur correcting lens, a lens holder, a solid state imaging chip, and a distortion correction processing chip. The lens holder is arranged on a mounting substrate and includes the blur correcting lens inside the lens holder. The solid state imaging chip is arranged on the mounting substrate so as to be covered by the lens holder, and includes a logic circuit and a pixel unit having a plurality of pixels. The distortion correction processing chip is arranged on the mounting substrate inside the lens holder, and corrects an image signal output from the solid state imaging chip to correct distortion of the image formed by the image signal.

Abstract: According to one embodiment, a solid state imaging device has a color mixture correction circuit. The color mixture correction circuit is provided with an adjustment circuit. The adjustment circuit adjusts a relationship between a signal level and a wavelength of light of each color component from an image sensor based on a first correction coefficient. The first correction coefficient is a correction coefficient for color mixture correction. A second correction coefficient is a correction coefficient corresponding to a sensitivity difference among color pixels. The adjustment circuit adjusts the signal level of each of the color components based on the second correction coefficient, which has been read according to a distance from center of an image.

Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.

Abstract: According to one embodiment, an image stabilizer includes a lens drive controller. The lens drive controller performs a first control and a second control. The lens drive controller controls the driving of a correction lens according to the amount of shake in the first control. In the second control, the lens drive controller controls the driving of the correction lens so that a first area is in focus and a second area is not in focus.

Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.

Abstract: According to one embodiment, a solid-state imaging device includes an image sensor and a resolution reconstruction circuit. The image sensor captures an object image. The resolution reconstruction circuit performs a resolution reconstruction process on the object image. The resolution reconstruction circuit performs a filtering process as the resolution reconstruction process. A filter has a filter property of reducing a modulation transfer function relative to an ideal modulation transfer function in a frequency range of a frequency higher than a frequency set in advance.

Abstract: According to one embodiment, a solid-state imaging device includes a demosaic processing unit. A pixel block includes a red pixel, a blue pixel, a first green pixel, and a second green pixel. A first green component detected by the first green pixel and a second green component detected by the second green pixel are green components of the same wavelength region. The demosaic processing unit generates image signals of four components. The four components are a red component, a blue component, the first green component, and the second green component.

Abstract: An optical module comprises an apodizer includes a black resin layer having a concavity the diameter of which gradually changes in a direction light passes through the apodizer, and, provided in the concavity, a transparent resin layer having the same refractive index as the black resin layer, the black resin layer and the transparent resin layer having a total thickness of 0.001 to 0.10 mm, an input lens opposed to the black resin layer of the apodizer and an output lens opposed to the transparent resin layer of the apodizer.

Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.

Abstract: According to one embodiment, an image processing apparatus includes a refocus filter generating unit and a refocus image generating unit. The refocus image generating unit executes a filtering process using a refocus filter generated by the refocus filter generating unit. A filtering level of the refocus filter is adjusted according to a subject distance of a subject to be focused and sighted among a plurality of subjects projected in a first image and a second image.

Abstract: According to one embodiment, an optical system of electrical equipment includes an imaging optical system and an optical function complementary processing circuit. The imaging optical system captures light from a subject. The imaging optical system forms a subject image. The electrical equipment includes the imaging optical system, a solid state imaging device, and an image signal processing circuit. The solid state imaging device images the subject image. The solid state imaging device outputs an image signal. The image signal processing circuit executes processing of the image signal. The optical function complementary processing circuit is provided in a processing path between the solid state imaging device and the image signal processing circuit. The optical function complementary processing circuit executes processing for complementing functions of the imaging optical system regarding formation of the subject image.

Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.

Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.

Abstract: An optical module comprises an apodizer includes a black resin layer having a concavity the diameter of which gradually changes in a direction light passes through the apodizer, and, provided in the concavity, a transparent resin layer having the same refractive index as the black resin layer, the black resin layer and the transparent resin layer having a total thickness of 0.001 to 0.10 mm, an input lens opposed to the black resin layer of the apodizer and an output lens opposed to the transparent resin layer of the apodizer.

Abstract: According to one embodiment, in a first imaging mode, an imaging mode control unit allows a second imaging optical system to function in an optical path between an imaging unit and a first imaging optical system and stops focus adjustment. In a second imaging mode, the imaging mode control unit stops the function of the second imaging optical system and allows the focus adjustment to be performed. The first imaging optical system takes in a light from an object to the imaging unit. The second imaging optical system forms an image piece in each pixel block.

Abstract: According to one embodiment, a camera module includes an image sensor, a main lens system and a sublens group. The sublens group is provided in an optical path between the main lens system and the image sensor. The sublens group forms an image piece for every pixel block. The image piece corresponds to a part of a subject image. The sublens group is integrated with a support structure. The support structure serves to support the sublens group above the image sensor.