Abstract: A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.

Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent.

Abstract: A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.

Abstract: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover lay to cover the conductor circuit, the rigid and flexible substrates being connected to each other. As the insulative base material of the flexible substrate, there is adopted a bendable base material formed by impregnating a glass cloth with a resin and drying it. An conductor circuit is formed on one side of the flexible substrate while a dummy pattern is formed on the other side near a portion thereof where the flexible substrate is to be bent.

Abstract: In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads.

Abstract: A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.

Abstract: A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.

Abstract: In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can be prevented from being delayed, noises can be suppressed, and an excellent electrical connection and connection reliability be assured.

Abstract: In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can be prevented from being delayed, noises can be suppressed, and an excellent electrical connection and connection reliability be assured.

Abstract: A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.

Abstract: A test coupon is used to evaluate characteristics of multi-layer printed wiring boards. The coupon includes a multi-layer substrate which has at least first and second wiring layers. The first and second wiring layers are configured to correspond to a tested wiring layer and another wiring layer of the multi-layer printed wiring boards, respectively. Each of first and second through hole groups has a plurality of through holes which pass through the multi-layer substrate and which are arranged in an arranging direction. A first and second conductor patterns which are provided on the first and second wiring layers respectively extend substantially along the arranging direction.

Abstract: A test coupon is used to evaluate characteristics of multi-layer printed wiring boards. The coupon includes a multi-layer substrate which has at least first and second wiring layers. The first and second wiring layers are configured to correspond to a tested wiring layer and another wiring layer of the multi-layer printed wiring boards, respectively. Each of first and second through hole groups has a plurality of through holes which pass through the multi-layer substrate and which are arranged in an arranging direction. A first and second conductor patterns which are provided on the first and second wiring layers respectively extend substantially along the arranging direction.