Abstract: An image reading apparatus that reads an original document and transmits image data to a printing apparatus after writing the image data in a predetermined page description language, wherein the image reading apparatus reads the image data from the original document on a line-by-line basis; performs pattern recognition at the same time with the storing of the image data in a buffer; detects a copy-prohibited image by a matching processor; starts transmitting the image data to the printing apparatus upon completion of the storing of the image data of a predetermined number of lines in the buffer; and, when the copy-prohibited image is detected by the matching processor, discontinues the transmission processing, while simultaneously instructing to discontinue the print processing.

Abstract: In a printing system comprising an image reading apparatus and plural printers, the image reading apparatus holds functional characteristics information of the printers, selects a printer most suitable for printing the information that has been read based on the functional characteristics information of the printers, prepares print data by writing the information that has been read in a page description language which can be interpreted by the selected printer, and sends the print data to the selected printer. On receiving the print data, the selected printer interprets the page description language in the print data, and executes print processing.

Abstract: The present invention relates to a method of and an apparatus for packaging a semiconductor device and the like to package the semiconductor device and the like completely associated with resin.A process for packaging a semiconductor device and the like according to the present invention comprises the steps of providing a tablet of thermoplastic resin such as epoxy resin, weighing the tablet for upper and lower packages, preheating the upper and lower packages, then compression molding the packages in a package shape, coating the opposed surfaces to be bonded of the upper and lower packages with a fusible bonding agent such as thermoplastic resin and/or bonding agent, then interposing a chip of a semiconductor device and the like between the upper package and the lower package, heating the upper and lower packages while supplying nitrogen gas in a vacuum molding machine, bonding the upper and lower packages, and conducting an antioxidation of a metal portion.

Abstract: The invention proposes a device designed for separating IC lead frames, boards, etc., piece by piece, and loading them continuously, and composed of a work stocker which holds laminated work of strips; a work-pressing mechanism which continuously presses the work within the work stocker; a separating mechanism which strips away the laminated work piece by piece from the lowest part thereof; and a pusher mechanism which pushes outside the stripped work from the work stocker; and wherein the separating mechanism is installed with a detector which finds out double sheets of the strips and stops operation of the pusher; and the separator is installed at its work exit end with a positioning pin of go-in-and-out of a taper shape which positions end points of the work pushed out by the pusher.