Abstract: A composite pigment containing a substrate particle and a pigment layer arranged on a surface of the substrate particle, wherein the pigment layer contains a pigment, a resin and a metal oxide, and the metal oxide contains at least one selected from the group consisting of a silicon oxide, a polysiloxane, and composites thereof.

Abstract: A press-through packaging material is disclosed including, in sequence, a substrate, an opaque underlayer laminated on at least a part of the surface of the substrate, and a printing layer that contains a colored metal pigment, and that is formed on at least a part of the surface of the opaque underlayer. The colored metal pigment includes a metal pigment, an amorphous silicon oxide film layer formed on the surface of the metal pigment, and metal particles supported on a part of or on the entire surface of the amorphous silicon oxide film layer, the opaque underlayer having a mass per unit area of 0.5 g/m2 or more and 3.0 g/m2 or less, and the printing layer having a mass per unit area of 1.0 g/m2 or more and 3.5 g/m2 or less.

Abstract: A black aluminum pigment comprises a flaky aluminum particle; and a coating film that covers the aluminum particle, the coating film comprises a titanium oxide layer and an amorphous silicon compound layer, the titanium oxide layer has a composition that satisfies TiOx (0.50?x?1.90), and the amorphous silicon compound layer is composed of at least one of silicon oxide, silicon hydroxide, and silicon hydrate.

Abstract: A main object of the present invention to provide a coated pigment that is composed of a composite particle comprising a silicon compound coated on the surface of a metal particle, and that can be dispersed with relatively few aggregates. The present invention relates to a coated pigment comprising a composite particle containing a metal particle and one or two or more coating layers on the surface of the metal particle, wherein (1) at least one of the coating layers is a silicon compound-containing layer, and (2) the proportion of aggregates formed by adhesion of at least four of the composite particles with each other is not more than 35% by number.

Abstract: A main object of the present invention to provide a coated pigment that is composed of a composite particle comprising a silicon compound coated on the surface of a metal particle, and that can be dispersed with relatively few aggregates. The present invention relates to a coated pigment comprising a composite particle containing a metal particle and one or two or more coating layers on the surface of the metal particle, wherein (1) at least one of the coating layers is a silicon compound-containing layer, and (2) the proportion of aggregates formed by adhesion of at least four of the composite particles with each other is not more than 35% by number.

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

Abstract: Provided are an electrically conductive paste composition capable of easily and inexpensively forming, on a variety of substrates or in electronic devices, an electrically conductive film such as electrodes and wires excellent in electrical conductivity, surface smoothness properties, and properties of adhesion with a base material; and an electrically conductive film formed by using the above-mentioned electrically conductive paste composition. The electrically conductive paste composition includes flaky aluminum particles as an electrically conductive powder, an average thickness of the flaky aluminum particles is less than or equal to 0.8 ?m, and a ratio of an oxygen content to a unit surface area of the flaky aluminum particles is less than or equal to 15 mg/m2.