Patents by Inventor Katsuro Kawazoe

Katsuro Kawazoe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9055704
    Abstract: A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: June 9, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Kouji Kose, Kouta Togawa, Katsuro Kawazoe, Takayoshi Kojima
  • Publication number: 20120152457
    Abstract: A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 21, 2012
    Applicant: HITACHI, LTD.
    Inventors: Kouji Kose, Kouta Togawa, Katsuro Kawazoe, Takayoshi Kojima
  • Patent number: 7004760
    Abstract: A connector is used for connecting a plurality of first terminals formed on a first electronic part to a plurality of respective second terminals formed on a second electronic part. The connector comprises an intermediate basis material having a spring characteristic, a plurality of first electrically conductive members provided on a first surface of the intermediate basis material, a plurality of second electrically conductive members provided on a second surface of the intermediate basis material, and wiring for connecting each of the first electrically conductive members to a corresponding one of the second electrically conductive members. Such electrically-conductive members may be columnar, tubular, spherical, and the like, and of appropriate width, thickness and material with regard to the characteristic requirements of the intermediate basis material.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: February 28, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Katsuro Kawazoe, Takayuki Uda, Kouichi Yamamoto, Tsutomu Sakamoto, Maria Katsuki
  • Publication number: 20050020116
    Abstract: There is provided a connector used for connecting a plurality of first terminals formed on a first electronic part to a plurality of respective second terminals formed on a second electronic part. The connector comprises an intermediate basis material having a spring characteristic, a plurality of first electrically conductive members provided on a first surface of the intermediate basis material, a plurality of second electrically conductive members provided on a second surface of the intermediate basis material, and wiring for connecting each of the first electrically conductive members to corresponding one of the second electrically conductive members.
    Type: Application
    Filed: December 22, 2003
    Publication date: January 27, 2005
    Inventors: Katsuro Kawazoe, Takayuki Uda, Kouichi Yamamoto, Tsutomu Sakamoto, Maria Katsuki