Patents by Inventor Katsuro Nakamata

Katsuro Nakamata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100253448
    Abstract: A diplexer that can demultiplex and multiplex two signals having wide frequency bands, and a wireless communication module and a wireless communication apparatus using the same, are provided. A diplexer has a multilayer body including a first interlayer, a second interlayer and a third interlayer. On the first interlayer, first resonant electrodes are disposed in an interdigital form. On the second interlayer, a plurality of second resonant electrodes are disposed in an interdigital form. On the third interlayer, there are disposed an input coupling electrode that faces the input-stage first resonant electrode and the input-stage second resonant electrode in an interdigital form, a first output coupling electrode that faces the output-stage first resonant electrode in an interdigital form, and a second output coupling electrode that faces the output-stage second resonant electrode.
    Type: Application
    Filed: October 24, 2008
    Publication date: October 7, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Hiromichi Yoshikawa, Shinji Isoyama, Katsuro Nakamata
  • Publication number: 20100219915
    Abstract: An ultra-wideband bandpass filter having two adequately-wide pass bands, and a wireless communication module and a wireless communication apparatus which employ the bandpass filter are provided. In a bandpass filter, first resonant electrodes are arranged on a first interlayer of a multilayer body in an interdigital form; a plurality of second resonant electrodes are arranged on a second interlayer in an interdigital form; and an input coupling electrode and an output coupling electrode are arranged on a third interlayer located between the first interlayer and the second interlayer. The input coupling electrode faces an input-stage first resonant electrode and an input-stage second resonant electrode in an interdigital form. The output-coupling electrode faces an output-stage first resonant electrode and an output-stage second resonant electrode in an interdigital form.
    Type: Application
    Filed: August 29, 2008
    Publication date: September 2, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Hiromichi Yoshikawa, Shinji Isoyama, Katsuro Nakamata
  • Publication number: 20100033271
    Abstract: A bandpass filter for a wide frequency band such as UWB is disclosed. The bandpass filter comprises a laminate of a plurality of dielectric layers, a first ground electrode connected to a ground potential, a plurality of resonant electrodes in a first inter-layer and a plurality of coupling electrodes in a second inter-layer. A transmission characteristic of the bandpass filter having flat and low loss over the entire region of the broad pass band can be achieved.
    Type: Application
    Filed: October 16, 2009
    Publication date: February 11, 2010
    Applicant: KYOCERA CORPORATION
    Inventors: Hiroshi NINOMIYA, Katsuro NAKAMATA, Hiromichi YOSHIKAWA
  • Patent number: 7596357
    Abstract: The present invention provides a high-frequency switching circuit comprising: two or more high-frequency switches SW1 and SW2 provided correspondingly to a plurality of communication systems having mutually different frequency bands; and a control circuit DEC1 adapted to control the switching of the two or more high-frequency switches SW1 and SW2, in which a common antenna terminal ANT3 and common terminals ANT1 and ANT2 of the respective high-frequency switches SW1 and SW2 are connected via a matching circuit MAT1 having a filtering function capable of allowing passage of direct current. When one path of the high-frequency switch SW1 is turned on, the other paths of the high-frequency switch SW1 and all paths of the high-frequency switch SW2 can be turned off.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: September 29, 2009
    Assignee: Kyocera Corporation
    Inventors: Katsuro Nakamata, Hiroshi Ninomiya, Masafumi Horiuchi, Shinji Isoyama, Tooru Takahashi
  • Patent number: 7149496
    Abstract: A high-frequency module comprises: a diplexer connected to an antenna terminal for branching a plurality of transmission/reception systems different in pass band from one another; switch circuits for switching the transmission/reception systems to transmission systems and reception systems; power amplifiers for amplifying transmission signals in the pass bands of the transmission systems; and matching circuits for matching the impedances of the power amplifiers to one another. The power amplifiers and the switch circuits are respectively formed by high-frequency semiconductor integrated circuit elements, and these high-frequency semiconductor integrated circuit elements are mounted on the surface of the multi-layer substrate. The high-frequency module is reduced both in size and loss and increased in isolation in its entirety.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: December 12, 2006
    Assignee: Kyocera Corporation
    Inventors: Masafumi Horiuchi, Katsuro Nakamata, Hiroshi Ninomiya, Yasuhiko Fukuoka, Satoru Iwasaki, Kenta Fukuyama
  • Publication number: 20050197095
    Abstract: The present invention provides a high-frequency switching circuit comprising: two or more high-frequency switches SW1 and SW2 provided correspondingly to a plurality of communication systems having mutually different frequency bands; and a control circuit DEC1 adapted to control the switching of the two or more high-frequency switches SW1 and SW2, in which a common antenna terminal ANT3 and common terminals ANT1 and ANT2 of the respective high-frequency switches SW1 and SW2 are connected via a matching circuit MAT1 having a filtering function capable of allowing passage of direct current. When one path of the high-frequency switch SW1 is turned on, the other paths of the high-frequency switch SW1 and all paths of the high-frequency switch SW2 can be turned off.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 8, 2005
    Inventors: Katsuro Nakamata, Hiroshi Ninomiya, Masafumi Horiuchi, Shinji Isoyama, Tooru Takahashi
  • Publication number: 20040203552
    Abstract: A high-frequency module comprises: a diplexer connected to an antenna terminal for branching a plurality of transmission/reception systems different in pass band from one another; switch circuits for switching the transmission/reception systems to transmission systems and reception systems; power amplifiers for amplifying transmission signals in the pass bands of the transmission systems; and matching circuits for matching the impedances of the power amplifiers to one another. The power amplifiers and the switch circuits are respectively formed by high-frequency semiconductor integrated circuit elements, and these high-frequency semiconductor integrated circuit elements are mounted on the surface of the multi-layer substrate. The high-frequency module is reduced both in size and loss and increased in isolation in its entirety.
    Type: Application
    Filed: March 26, 2004
    Publication date: October 14, 2004
    Applicant: Kyocera Corporation
    Inventors: Masafumi Horiuchi, Katsuro Nakamata, Hiroshi Ninomiya, Yasuhiko Fukuoka, Satoru Iwasaki, Kenta Fukuyama