Abstract: Provided is a method for removing a linear object, a device for removing a linear object, and a method for processing electronic/electrical equipment component waste, which can improve separation efficiency.

Abstract: Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

Abstract: A raw material supply device and a device for processing electronic and electrical device part scraps, which can control dropping positions of a raw material containing substances having different shapes and specific gravities, and a method for processing electronic and electrical device part scraps using those devices. The raw material supply device includes a receiving port, a discharge port, a first guide surface, and a second guide surface on a surface opposing to the first guide surface. The processing device includes a first conveying unit, a raw material supply device, a second conveying unit, and a pyramid-shaped disperser. The processing method comprises a sorting step, wherein the sorting step comprises dropping the electronic and electrical device part scraps onto a plurality of dispersion surfaces of a pyramid-shaped disperser, and dispersing the electronic and electrical device part scraps in a plurality of directions on a conveying surface.

Abstract: Provided is a method for removing a linear object, a device for removing a linear object, and a method for processing electronic/electrical equipment component waste, which can improve separation efficiency.

Abstract: Provided is a method for processing electronic and electrical device component scrap, which can accurately and efficiently sort electronic and electrical device component scrap. The method for processing electronic and electrical device component scrap includes a separation step of separating non-metal objects 1b or metal objects 1a1, 1a2 from electronic and electrical device component scrap 1 containing the metal objects 1a1, 1a2 and the non-metal objects 1b using a sorter 10 comprising a metal sensor 2, a color camera 3, an air valve 4, and a conveyor 5, wherein a fixed distance is provided between the metal objects 1a1, 1a2 adjacent to each other so as to prevent the non-metal objects 1b between the metal objects 1a1, 1a2 from being erroneously detected, when detecting the metal objects 1a1, 1a2 in the electronic and electrical device component scrap 1 by the metal sensor 2.

Abstract: Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

Abstract: Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes.

Abstract: Provided are a raw material discharge device, a method of processing an electronic and electrical device component scrap, and a raw material discharging method of an electronic and electrical device component scrap, which are capable of efficiently discharging the raw material having various shapes, specific gravities and shapes in each fixed amount.

Abstract: Provided is a method for processing electronic and electrical device component scrap according to an embodiment of the present invention includes a smelting raw material sorting step of sorting a processing raw material containing valuable metals processable in a smelting step from the electronic and electrical device component scrap, wherein the method comprises removing lump copper wire scrap contained in the electronic and electrical device component scrap using a parallel link robot.

Abstract: Provided is a sorting machine capable of more easily and efficiently sorting specific parts having a specific shape from raw materials containing various substances having different shapes, and a method for treating electronic and electric device component scraps using the sorting machine. The sorting machine includes a conveying device 1 having a conveying surface 13 which conveys raw materials containing substances having different shapes from a raw material inlet 11 to a receiving port 12; and a gate device 2 provided with a cylindrical roll portion 21 having a rotating function arranged at a certain distance d on the conveying surface to allow at least a part of the raw materials 100 to pass through to the receiving port 12.

Abstract: Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes removing powdery objects contained in electronic and electrical device component scrap prior to a step of separating non-metal objects or metal objects from the electronic and electrical device component scrap containing the metal objects and the non-metal objects, using a metal sorter including: a metal sensor, a color camera, an air valve, and a conveyor.

Abstract: Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.

Abstract: Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

Abstract: Provided is a raw material supply device and a device for processing electronic and electrical device part scraps, which can control dropping positions of a raw material containing substances having different shapes and specific gravities, as well as a method for processing electronic and electrical device part scraps using those devices.

Abstract: Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes.

Abstract: Provided is a method for processing electronic and electrical device component scrap, which can accurately and efficiently sort electronic and electrical device component scrap. The method for processing electronic and electrical device component scrap includes a separation step of separating non-metal objects 1b or metal objects 1a1, 1a2 from electronic and electrical device component scrap 1 containing the metal objects 1a1, 1a2 and the non-metal objects 1b using a sorter 10 comprising a metal sensor 2, a color camera 3, an air valve 4, and a conveyor 5, wherein a fixed distance is provided between the metal objects 1a1, 1a2 adjacent to each other so as to prevent the non-metal objects 1b between the metal objects 1a1, 1a2 from being erroneously detected, when detecting the metal objects 1a1, 1a2 in the electronic and electrical device component scrap 1 by the metal sensor 2.

Abstract: Provided is a method for processing electronic/electrical device component waste, which can increase an amount of electronic/electrical device component waste processed in a smelting step and efficiently recover valuable metals.

Abstract: Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

Abstract: Provided is a method for processing electronic and electrical device component scrap, which can increase an amount of electronic and electrical device component scrap processed in a smelting step and efficiently recover valuable metals. The method for processing electronic and electrical device component scrap includes: a step 1 of removing powdery materials and film-shaped component scrap from the electronic and electrical device component scrap; a step 2 of concentrating synthetic resins and substrates from the electronic and electrical device component scrap from which the powdery materials and film-shaped component scrap have been removed; and a step 3 of concentrating the substrates containing valuable metals from a concentrate obtained in the step 2.

Abstract: A semiconductor integrated circuit design apparatus includes: an association information creating unit which creates association information for associating wiring information of a signal line with wiring information of a shield line placed for the signal line; an association information storage unit which stores the thus created association information; and a shield wiring unit which, when the placement of the signal line is changed, changes in interlinking fashion with the changed placement the placement of the shield line that is associated with the signal line by the association information.