Patents by Inventor Katsushi OIKAWA

Katsushi OIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILM FORMING APPARATUS AND FILM FORMING METHOD
    Publication number: 20250059640
    Abstract: A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Inventors: Koji MAEDA, Atsushi SHIMADA, Katsushi OIKAWA, Tetsuya MIYASHITA
  • Film forming apparatus and film forming method
    Patent number: 12163215
    Abstract: A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: December 10, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Koji Maeda, Atsushi Shimada, Katsushi Oikawa, Tetsuya Miyashita
  • FILM FORMING APPARATUS AND FILM FORMING METHOD
    Publication number: 20220178014
    Abstract: A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.
    Type: Application
    Filed: July 2, 2020
    Publication date: June 9, 2022
    Inventors: Koji MAEDA, Atsushi SHIMADA, Katsushi OIKAWA, Tetsuya MIYASHITA