Patents by Inventor Katsushi Terajima
Katsushi Terajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10325841Abstract: According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member.Type: GrantFiled: February 10, 2016Date of Patent: June 18, 2019Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kazuyuki Nakagawa, Katsushi Terajima, Keita Tsuchiya, Yoshiaki Sato, Hiroyuki Uchida, Yuji Kayashima, Shuuichi Kariyazaki, Shinji Baba
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Publication number: 20180374788Abstract: According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor component which are mounted on a wiring substrate. The first semiconductor component has a first terminal for transmitting a first signal between the first semiconductor component and the outside and a second terminal for transmitting a second signal between the first semiconductor component and the second semiconductor component. In addition, the second semiconductor component has a third terminal for transmitting the second signal between the second semiconductor component and the first semiconductor component. Further, the first signal is transmitted at a higher frequency than the second signal. Furthermore, the second terminal of the first semiconductor component and the third terminal of the second semiconductor component are electrically connected to each other via the first wiring member.Type: ApplicationFiled: February 10, 2016Publication date: December 27, 2018Inventors: Kazuyuki NAKAGAWA, Katsushi TERAJIMA, Keita TSUCHIYA, Yoshiaki SATO, Hiroyuki UCHIDA, Yuji KAYASHIMA, Shuuichi KARIYAZAKI, Shinji BABA
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Patent number: 7799852Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.Type: GrantFiled: June 30, 2006Date of Patent: September 21, 2010Assignees: NEC Corporation, Sumitomo Bakelite Company LimitedInventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
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Publication number: 20060247393Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.Type: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Applicants: NEC CORPORATION, SUMITOMO BAKELITE COMPANY LIMITEDInventors: Yukihiro Kiuichi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
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Patent number: 7098276Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.Type: GrantFiled: October 20, 1999Date of Patent: August 29, 2006Assignees: NEC Corporation, Sumitomo Bakelite CompanyInventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
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Patent number: 5527992Abstract: A metal cap involved in a cavity down mounting package to be subjected to a seam welding with at least a roller electrode, wherein the metal cap has a square like external shape with four corners being so rounded that each corner has a radius of curvature in the range from 1/10 to 3/8 of a length on each side of the square like shaped metal cap thereby the seam welding is carried out by a combination of a straight movement of the roller electrode along straight sides of the metal cap and adjacent part of the rounded corners to the straight sides and a rotary movement of the roller electrode around a center axis of the metal cap and the roller electrode moves along the rounded corners except adjacent portions to the straight side of the metal cap.Type: GrantFiled: December 30, 1994Date of Patent: June 18, 1996Assignee: NEC CorporationInventor: Katsushi Terajima
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Patent number: 5284899Abstract: A resin paste for tight sealing, comprising(A) at least one filler selected from the group consisting of Ag, Au, Cu, diamond, high-temperature sintered graphite and beryllia,(B) at least one metal filler selected from the group consisting of Al, Fe and Mg,(C) a polyimide resin having an imidization degree of 80% or more, obtained by reacting 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride or 3,3',4,4'-oxydiphthalic acid dianhydride with a diamine, and(D) an organic solvent, wherein the weight proportions of (A), (B) and (C) are(A)/[(B)+(C)]=10/90 to 90/10(B)/[(A)+(C)]=5/95 to 90/10and the weight proportion of (D) is(D)/[(A)+(B)+(C)]=0.01/100 to 50/100.Type: GrantFiled: September 9, 1992Date of Patent: February 8, 1994Assignees: Sumitomo Bakelite Company Limited, NEC CorporationInventors: Sueo Morishige, Kenichi Kaneda, Katsushi Terajima, Toshiro Takeda, Yushi Sakamoto, Takashi Suzuki