Patents by Inventor Katsushi Wada

Katsushi Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing method
    Patent number: 11647593
    Abstract: A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: May 9, 2023
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Kazuki Sasao, Katsushi Wada
  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN
    Publication number: 20210345496
    Abstract: A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 4, 2021
    Applicant: Sony Interactive Entertainment Inc.
    Inventors: Kazuki Sasao, Katsushi Wada