Patents by Inventor Katsushi YOSHIMITSU

Katsushi YOSHIMITSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a semiconductor package
    Patent number: 10079161
    Abstract: An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: September 18, 2018
    Assignee: J-DEVICES CORPORATION
    Inventors: Toshiyuki Inaoka, Yuichiro Yoshikawa, Atsuhiro Uratsuji, Katsushi Yoshimitsu
  • SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME
    Publication number: 20180174975
    Abstract: An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.
    Type: Application
    Filed: January 31, 2018
    Publication date: June 21, 2018
    Inventors: Toshiyuki INAOKA, Yuichiro YOSHIKAWA, Atsuhiro URATSUJI, Katsushi YOSHIMITSU
  • SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME
    Publication number: 20170373012
    Abstract: An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.
    Type: Application
    Filed: May 3, 2017
    Publication date: December 28, 2017
    Inventors: Toshiyuki INAOKA, Yuichiro YOSHIKAWA, Atsuhiro URATSUJI, Katsushi YOSHIMITSU
  • METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
    Publication number: 20170256453
    Abstract: A manufacturing method of a semiconductor package which improves productivity and can manufacture high-quality semiconductor packages is provided.
    Type: Application
    Filed: January 19, 2017
    Publication date: September 7, 2017
    Inventors: Takahiro YADA, Katsushi YOSHIMITSU