Abstract: There is disclosed a photosensitive resin composition solution for formation of a printed wiring board permanent mask to be coated on a substrate to be coated according to the curtain flow coating method or the roll coating method, which comprises (A) an oligomer having at least one epoxy group and at least one polymerizable vinyl group in the side chain, (B) a photopolymerization initiator, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent, characterized in that (1) the solvent (E) contains 10 to 20% by weight of at least one low boiling point solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone and ethyl acetate based on the total amount of the solvent, and (2) the composition solution has a viscosity at 25.degree. C. of 100 mPas or more and 200 mPas or less.

Abstract: A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask.

Abstract: A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.

Abstract: A photosensitive resin composition comprising (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, (b) a phosphate compound having photopolymeric unsaturated bonds, (c), if necessary, an organic thermoplastic polymer, (d) a photopolymerizable unsaturated compound having at least one terminal ethylene group and (e) a sensitizer and/or a sensitizer system, and a photosensitive element comprising a layer of said photosensitive resin composition and a support film therefor, are provided. The photosensitive resin composition can form a protective coating film with excellent adhesiveness to the substrate surface, and such a protective coating film or, photosensitive element obtained therefrom can be advantageously used as a resist for soldering mask, etc.

Abstract: A photosensitive resin composition comprising (a) a linear polymer or copolymer having tetrahydrofurfuryl groups at side chains, (b) one or more photopolymerizable unsaturated compounds having at least two terminal ethylene groups, and (c) one or more sensitizers which initiate polymerization of said unsaturated compounds by irradiation of active light, has excellent storage stability and photosensitivity. The composition can produce permanent protective films having excellent resistance to solvents, heat resistance and the like and can be used as a solder resist and the like.

Abstract: A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.

Abstract: It is herein proposed to laminate a film onto a convex-concaved solid surface in a vacuum to accomplish tight contact between the film and the solid surface. The apparatus includes an air tight housing in which lamination press rolls are arranged, wherein feeding-in and feeding-out of materials such as a base plate and a film for lamination are effected through air tight roll assemblies incorporated in the wall structure of the air tight housing.

Abstract: A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured.An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group.

Abstract: A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.

Abstract: A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.