Abstract: A heat treating apparatus for mounting objects to be treated on an object-to-be-treated boat (wafer boat) provided on a heat insulating cylinder, and loading the object-to-be-treated boat into a processing vessel for a heat treatment, a temperature detecting sensor is provided in a film depositing area of a relatively large heat capacity, which is a lower part of a gap defined between an inner tube of the processing vessel and an outer tube thereof so as to detect temperatures of those of the objects to be treated located there and control temperatures of the heating unit. Thus heat response is improved, and temperatures of the objects to be treated can be accurately detected.

Abstract: An ECR plasma CVD apparatus includes a plasma generation chamber to which a microwave and a plasma source gas are introduced. An excitation solenoid is arranged around the plasma generation chamber to form an electron cyclotron resonance magnetic field with the microwave in the plasma generation chamber. A plasma reaction chamber to which a reactive gas is introduced is provided in communication with the plasma generation chamber. A substrate holder for holding a silicon wafer is set in the plasma reaction chamber. A leakage-type butterfly valve whose opening degree can be freely controlled is arranged in communication with the plasma reaction chamber. A turbo molecular pump is formed in the outlet of the butterfly valve. A subpump is arranged in the outlet of the turbo molecular pump.

Abstract: A heat-treating apparatus for heat treating a plurality of objects-to-be-treated (semiconductor wafers) by loading the objects-to-be-treated into a heat treatment vessel having the lower end opened, mounted on a heat-treatment boat vertically spaced from each other, and sealing the opened end includes a heat insulator disposed on the lower end portion of the heat-treatment boat for heat-insulating the interior of the reaction vessel. The heat-insulator includes heat transmission preventing plates of opaque quartz for preventing the transmission of heat rays from a heater, and a support for supporting the heat transmission preventing plates. Thus sufficient heat-insulating effect for a heat-treating operation can be achieved, and stable heat-treatment can be conducted without impairing the function of sealing the heat-insulating unit. Furthermore, particle formation can be prevented, with a result of improved yields of the heat-treatment.

Abstract: This invention relates to a combustion device for feeding hydrogen gas and oxygen gas into a combustion vessel, while heating the same, to generate water vapor. The combustion device comprises a hydrogen gas injection nozzle for feeding hydrogen gas into the combustion vessel, and an oxygen gas injection nozzles for feeding oxygen gas into the combustion vessel. The oxygen nozzles are projected further upward in the combustion vessel beyond the forward end of the hydrogen gas injection nozzle, and opened at a plurality of positions, whereby to diffuse oxygen widely around. The combustion device of this structure can feed a large amount of hydrogen gas for the combustion, whereby a large amount of water vapor can be generated without enlarging the combustion vessel, and troubles, such as the devitrification of the forward ends of the nozzles, abnormal heating in the combustion vessel.

Abstract: The vertical treating apparatus according to this invention comprises as major units a process tube for receiving objects to be treated through an opening in a lower part thereof, a lift mechanism (boat elevator) for mounting a wafer boat holding the wafers to load the wafers into the process tube, and a wafer transfer device for transferring the wafers to the lift mechanism. The lift mechanism flexibly supports a cap for closing the opening of the process tube by way of an urging force provided by coil springs, and mounts the wafer boat for holding the wafers on the upper surface thereof. A cap restricting member is provided for restricting the urging force of the coil springs. The cap is provided at a lowermost position of the lift mechanism. Thus, the cap is restricted by the cap restricting member when the wafers are transferred by the transfer device, whereby the wafer boat, etc.

Abstract: A vertical heat treating apparatus includes a cap body, which is movable up and down, for sealing a treatment vessel that holds objects to be treated. A rotary loading device is provided with a rotary shaft which extends into a through hole provided in the cap body, and a magnetic fluid seal member is provided around the rotary shaft. Heat-exchange media, such as water or ethylene glycol, is circulated within the rotary shaft, preferably to cool the rotary shaft. A temperature sensor may be provided in a housing for the rotary shaft, such that when the temperature exceeds a set temperature, the flow rate of the heat exchange medium is increased. Baffle plates may be provided above an upper surface of the cap body and opposed to the through-hole in the cap body. In one preferred embodiment of the invention, nitrogen gas is circulated through the through-hole in the cap body to prevent corrosive gas from contacting the shaft.

Abstract: A double cylinder shaped multilayer structural member comprising ring shaped thin plate small diameter discs and large diameter discs respectively layered via spacers is disposed in the enclosure vessel of a trap device for a vapor phase reaction apparatus. Gas from the intake opening section of the enclosure vessel is introduced into the outer side space of the multilayer structural member of the enclosure vessel, passes through the spaces between the large diameter discs and also passes through the spaces between the small diameter discs, then exits via the inner side space of the multilayer structural member from the outlet opening section of enclosure vessel to the system exterior. As a result of this construction, in comparison to conventional devices, the collection efficiency of reactive components can be increased, the equipment life extended, and maintenance frequency reduced, thereby providing a trap device for a vapor phase reaction apparatus capable of improving productivity.

Abstract: A heat treatment apparatus having a heat treatment boat with a plurality of wafers held thereon, which is to be loaded in a reaction vessel which has one end opened. Once loaded, the boat effects a seal of the reaction vessel, in preparation for subjecting the wafers to heat treatment. The boat also has a heat-insulator disposed on its lower end for heat-insulating the interior of the reaction vessel during the heat-treatment. The heat-insulator includes composite plates having a metal film layer on an upper surface for reflecting heat rays generated during the heat treatment of the reaction vessel, and a cylinder enclosing the composite plates. Thus, sufficient heat-insulating effect for the heat treatment can be obtained, and stable heat-treatment can be conducted with the sufficient heat-insulating effect secured. Furthermore, the generation of particles can be suppressed, and yields of the heat treatment can be improved.

Abstract: A heat processing apparatus comprises a heating furnace, a process tube located in the heating furnace and having an open bottom, a manifold connected to the open bottom of the process tube, a sealing member sandwiched between the process tube and the manifold to air-tightly seal the process tube, a fixing member for fixing the process tube to the manifold, a heat transmitting member made of metal and sandwiched between the fixing member and the process tube to radiate heat at that area of the process tube, which is opposed to the fixing member, to the fixing member by heat conduction, and a heat exchange conduit arranged in the fixing member and having a passage through which heat exchanging medium flows to cool the fixing member by heat exchange.