Abstract: Since a ferroelectric memory device cannot employ a VCC/2 precharge scheme widely used in DRAM, its array noise and power consumption are large. Further, a ferroelectric capacitor is deteriorated in its characteristics due to its fatigue and imprint. To avoid this, data line pairs are precharged to two voltages VCC and VSS. As a result, a voltage on a data line in a memory cell array MCA varies symmetrically with respect to VCC/2 as its center to thereby reduce the array noise. Further, when early sense and early precharge operations are carried out based on charge share between data lines of different precharge voltages, the power consumption can be reduced. Furthermore, when the precharge voltages are switched for respective data lines, reverse and non-reverse polarization are alternately carried out in the ferroelectric capacitor in the memory cell to suppress its fatigue and imprint.

Abstract: A control of a flash memory includes control for supplying a pulse-shaped voltage to each of non-volatile memory cells until a threshold voltage of the non-volatile memory cell having a first threshold voltage is changed to a second threshold voltage. The control involves a first write mode (coarse write) in which the amount of change in threshold voltage of each non-volatile memory cell, which is varied each time the pulse-shaped voltage is applied, is relatively rendered high, and a second write mode (high-accuracy write) in which the amount of change in threshold voltage thereof is relatively rendered low. As compared with the high-accuracy mode, the number of pulses required to change the threshold voltage of each memory cell is smaller than that in the coarse write mode. Therefore, the number of verify operations at the time that the coarse write mode is used, is small and hence the entire write operation can be speeded up.

Abstract: To enable one non-volatile memory cell to store four-value information, three different kinds of threshold voltages are serially applied to a word line in a verify operation to execute a write operation, the threshold voltages of the memory cell are controlled, and two-value (one-bit) information corresponding to the four-value (two-bit) information to be written are synthesized by a write data conversion circuit for each of the write operations carried out three times. In this way, the four-value (two-bit) information are written into one memory cell, and the memory capacity of the memory cell can be increased. In the information read operation, three different kinds of voltages are applied to a word line, three kinds of two-value (one-bit) information so read out are synthesized by a read conversion circuit and the memory information of the memory cell are converted to the two-bit information.

Abstract: Disclosed is a semiconductor memory having memory cells, each containing a selection transistor and a capacitor using a ferroelectric film, which memory can be operated in both volatile and nonvolatile modes (e.g., a shadow RAM). A common plate electrode is used for the capacitors of the plurality of memory cells, and this common plate electrode is held at a fixed (constant) voltage. The memory has two data lines for each memory cell, and a sense amplifier connected between the two data lines. Volatile or nonvolatile operation is established depending on the voltage applied to the amplifier. The voltage applied to the amplifier is increased and the ferroelectric capacitor is completely polarized to write nonvolatile information; to write volatile information, this voltage is decreased and polarization reversal is minimized.

Abstract: Each memory cell of a non-volatile semiconductor memory essentially consisting of a one-transistor type memory cell comprising only of an MOSFET having a floating gate electrode. When an electric programming operation is carried out, a positive voltage is applied to an n type drain region, a negative voltage is applied to a control gate and a source region is grounded. When an erasing operation is carried out, the positive voltage is applied to the control gate while all the other electrodes and a semiconductor substrate are grounded. Low power consumption can be accomplished because both of the programming operation and erasing operations are carried out by utilizing a tunneling mechanism. Particularly because the negative voltage is used for the word line, a drain voltage at the time of programming of data can be lowered, so that degradation of a gate oxide film at a channel portion can be mitigated.

Abstract: The memory mat is divided in two banks, which share the sense & latch circuit. As an example of the circuit operation, the information contained in the memory cells in a block of four bit lines BL11a-BL14a connected to a word line WL1a in the memory array MAa of the bank A is temporarily stored in the sense & latch circuits SL11-SL14. The information of bit lines is latched to the sense & latch circuit SLa through the sub-input/output signal lines IO1a and IO2a by the switches YS1a and YS2a that alternately operates at a cycle two times that of the external clock. The latched information is then output onto the input/output signal line IOa by the switch SWa in synchronism with the clock. After the four bit lines BL11a-SB14a have been read out, the sense & latch circuits SL11-S114 in that block are reset and the bit lines on the bank B are precharged while the information on the bank A is being output.

Abstract: Herein disclosed is a data processing system having a memory packaged therein for realizing a largescale and high-speed parallel distributed processing and, especially, a data processing system for the neural network processing. The neural network processing system according to the present invention comprises: a memory circuit for storing neuron output values, connection weights, the desired values of outputs, and data necessary for learning; an input/output circuit for writing or reading data in or out of said memory circuit; a processing circuit for performing a processing for determining the neuron outputs such as the product, sum and nonlinear conversion of the data stored in said memory circuit, a comparison of the output value and its desired value, and a processing necessary for learning; and a control circuit for controlling the operations of said memory circuit, said input/output circuit and said processing circuit.

Abstract: A semiconductor nonvolatile memory device including transistors whose threshold voltages can be electrically rewritten (erased, written). A read-selected word line voltage Vrw, lower than the supply voltage Vcc applied from the outside, is applied, and the threshold voltage difference between the higher threshold voltage VthH and the lower threshold voltage VthL in the two states of nonvolatile memory cells is reduced to bring the higher threshold voltage VthH close to the lower threshold voltage VthL. Moreover, a threshold voltage Vthi in the thermally equilibrium state of the memory cell, corresponding to the two threshold voltages of the two states, is set between the higher threshold voltage VthH and the lower threshold voltage VthL.

Abstract: To enable one non-volatile memory cell to store four-value information, three different kinds of threshold voltages are serially applied to a word line in a verify operation to execute a write operation, the threshold voltages of the memory cell are controlled, and two-value (one-bit) information corresponding to the four-value (two-bit) information to be written are synthesized by a write data conversion circuit for each of the write operations carried out three times. In this way, the four-value (two-bit) information are written into one memory cell, and the memory capacity of the memory cell can be increased. In the information read operation, three different kinds of voltages are applied to a word line, three kinds of two-value (one-bit) information so read out are synthesized by a read conversion circuit and the memory information of the memory cell are converted to the two-bit information.

Abstract: A semiconductor nonvolatile memory device including transistors whose threshold voltages can be electrically rewritten (erased, written). A read-selected word line voltage Vrw, lower than the supply voltage Vcc applied from the outside, is applied, and the threshold voltage difference between the higher threshold voltage VthH and the lower threshold voltage VthL in the two states of the nonvolatile memory cells is reduced to bring the higher threshold voltage VthH close to the lower threshold voltage VthL. Moreover, a threshold voltage Vthi in the thermally equilibrium state of the memory cell, corresponding to the two threshold voltages of the two states, is set between the higher threshold voltage VthH and the lower threshold voltage VthL.

Abstract: This invention provides a nonvolatile semiconductor memory device having a word line, a plurality of bit lines crossing the word line, and a plurality of memory cells including MOS transistors. Each of control gates of the MOS transistors are coupled to the word line and each of drains thereof are coupled to the bit lines, respectively. Each of the MOS transistors also has a floating gate. Further, the non-volatile semiconductor memory device comprises latch circuits, first switches, a sense amplifier coupled to the plurality of bit lines in common, and second switches. The latch circuits are coupled to the plurality of bit lines through the first switches which are coupled between the plurality of bit lines and the latch circuits, respectively. The second switches are respectively coupled between the plurality of bit lines and the sense amplifier, thereby coupling the sense amplifier to the bit lines.

Abstract: A data processing system has a memory for realizing large-scale and high-speed parallel distributed processing and, especially, a data processing system for neural network processing. The neural network processing system comprises: a memory circuit for storing neuron output values, connection weights, the desired values of outputs, and data necessary for learning; an input/output circuit for writing or reading data in or out of said memory circuit; a processing circuit for performing a processing for determining the neuron outputs such as the product, sum and nonlinear conversion of the data stored in said memory circuit, a comparison of the output value and its desired value, and a processing necessary for learning; and a control circuit for controlling the operation of the memory circuit, the input/output circuit and the processing circuit.

Abstract: Each memory cell of a non-volatile semiconductor memory essentially consisting of a one-transistor type memory cell comprising only of an MOSFET having a floating gate electrode. When an electric programming operation is carried out, a positive voltage is applied to an n type drain region, a negative voltage is applied to a control gate and a source region is grounded. When an erasing operation is carried out, the positive voltage is applied to the control gate while all the other electrodes and a semiconductor substrate are grounded. Low power consumption can be accomplished because both of the programming operation and erasing operations are carried out by utilizing a tunneling mechanism. Particularly because the negative voltage is used for the word line, a drain voltage at the time of programming of data can be lowered, so that degradation of a gate oxide film at a channel portion can be mitigated.

Abstract: A memory cartridge having a plurality of dynamic memory units includes an access conversion circuit which converts a static access signal into its inverted signal and an access control circuit which controllably switches between a signal for refreshing each dynamic unit and a signal for external access. The memory cartridge also includes a power switching circuit which switches power from an internal power supply to an external power supply when the memory cartridge is mounted to an external device.

Abstract: An arrangement is provided to enhance the speed in the operation of erasing and programming of a nonvolatile semiconductor memory that is driven by a single supply voltage and to reduce the number of transistors making up the subword decoder circuit thereby minimizing the size of the device. For this purpose, in the subword decoder circuits WDi1-WDij that drive the word lines Wi1-Wij, the block selection address lines Bip and Bin generated from the first address line group are used as supply voltages for the inverter circuit that controls the voltage of the word line, and the gate selection address line Gj generated from the second address line group is used a gate input line.

Abstract: In an address multiplexed dynamic random access memory (RAM) which has both a normal operation mode and a test mode capability, the test mode is initiated in response to particular signal level combinations of both the row address strobe (RAS) and column address strobe (CAS) signals and the write enable (WE) signal. Since the signal level combinations employed in connection with implementing the test mode are unused in the normal operating mode of the dynamic RAM, additional external terminals are unneeded. This dynamic RAM employs multiplexing circuitry on both the input side as well as on the output side of the dynamic RAM, which multiplexing circuitry is controlled during normal operation by select signals from a decoder and during the test mode by a test signal which allows accessing of data at all of the common complementary data lines by the testing circuitry so as to determine whether there is consistency or inconsistency of the data being read out for testing.

Abstract: A memory cartridge having a plurality of dynamic memory units includes an access conversion circuit which converts a static access signal into its inverted signal and an access control circuit which controllably switches between a signal for refreshing each dynamic unit and a signal for external access. The memory cartridge also includes a power switching circuit which switches power from an internal power supply to an external power supply when the memory cartridge is mounted to an external device.

Abstract: Herein disclosed is a data processing system having a memory packaged therein for realizing a large-scale and high-speed parallel distributed processing and, especially, a data processing system for the neural network processing. The neural network processing system according to the present invention comprises: a memory circuit for storing neuron output values, connection weights, the desired values of outputs, and data necessary for learning; an input/output circuit for writing or reading data in or out of said memory circuit; a processing circuit for performing a processing for determining the neuron outputs such as the product, sum and nonlinear conversion of the data stored in said memory circuit, a comparison of the output value and its desired value, and a processing necessary for learning; and a control circuit for controlling the operations of said memory circuit, said input/output circuit and said processing circuit.

Abstract: Signals are simultaneously read out from a plurality of memory cells connected to one selected word line onto respective data lines. By successively making a selection out of data lines, signals read simultaneously onto respective data lines are serially and successively sensed by means of one signal sensing means. As for restoring operation as well, restoring is successively performed via the signal transferring means on the basis of the result sensed by the signal sensing means. By thus making a plurality of data lines share either signal sensing means or both signal sensing means and restoring means, the number of these means can be reduced and the layout pitch of these means can be relaxed. Therefore, a semiconductor memory having a higher density can be realized.

Abstract: An address multiplexed dynamic random access memory (RAM) which has both a normal operation mode and a test mode capability is provided. The test mode is initiated in response to particular signal level combinations of both the row address strobe (RAS) and column address strobe (CAS) signals and the write enable (WE) signal. Since the signal level combinations employed in connection with implementing the test mode are unused in the normal operating mode of the dynamic RAM, additional external terminals are unneeded. This dynamic RAM employs multiplexing circuitry on both the input side as well as on the output side of the dynamic RAM, which multiplexing circuitry is controlled during normal operation by select signals from a decoder and during the test mode by a test signal which allows accessing of data at all of the common complementary data lines by the testing circuitry so as to determine whether there is consistency or inconsistency of the data being read out for testing.