Abstract: A plasma processing device includes: a plurality of processing chambers; a junction exhaust pipe into which a plurality of exhaust flow paths for evacuating interiors of the plurality of processing chambers joins; and a plurality of branch exhaust pipes disposed between the plurality of exhaust flow paths and the junction exhaust pipe and connecting the junction exhaust pipe to the plurality of exhaust flow paths, respectively, wherein each of the plurality of branch exhaust pipes includes a mechanism, which is disposed in a flow path of the branch exhaust pipe, to deactivate energy of hot electrons flowing through the flow path.

Abstract: Sticking of a substrate occurs in a reaction chamber for processing the substrate placed on a surface of a substrate-supporting device provided with lift pins for moving the substrate up and down with respect to the surface of the substrate-supporting device. A method of detecting the occurrence of the sticking of the substrate includes: monitoring a vibration propagating in or through the reaction chamber by a sensor, which vibration is indicative of or specific to sticking of the substrate on the surface of the substrate-supporting device when being moved up from the surface of the substrate-supporting device with the lift pins; and initiating a pre-designated sequence if the vibration is detected while processing the substrate in the reaction chamber.

Abstract: Sticking of a substrate occurs in a reaction chamber for processing the substrate placed on a surface of a substrate-supporting device provided with lift pins for moving the substrate up and down with respect to the surface of the substrate-supporting device. A method of detecting the occurrence of the sticking of the substrate includes: monitoring a vibration propagating in or through the reaction chamber by a sensor, which vibration is indicative of or specific to sticking of the substrate on the surface of the substrate-supporting device when being moved up from the surface of the substrate-supporting device with the lift pins; and initiating a pre-designated sequence if the vibration is detected while processing the substrate in the reaction chamber.