Abstract: Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

Abstract: Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.

Abstract: The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film (1) according to the invention comprises a support (11), resin layer (12) and protective film (13), where the resin layer (12) is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1).

Abstract: A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

Abstract: The invention provides a photosensitive resin composition that can form resists with excellent adhesiveness for conductive layers and that does not easily produce conductive layer discoloration, as well as a photosensitive film employing the composition. A preferred photosensitive film (1) according to the invention comprises a support (11), resin layer (12) and protective film (13), where the resin layer (12) is composed of a photosensitive resin composition comprising a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a benzotriazole derivative represented by the following general formula (1).

Abstract: A method for packaging a photosensitive film roll, which includes packaging the photosensitive film roll with a resin case. The photosensitive film roll is formed in a step by winding around a core, a photosensitive film comprising a supporting film and a photosensitive resin composition layer formed on the supporting film. The resin case is collapsible without generating any waste materials after the case is collapsed. The photosensitive resin layer includes a photosensitive resin composition containing a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

Abstract: A photosensitive resin composition is here disclosed which satisfies the following (1) and (2): (1) when a 1.0 wt % aqueous sodium carbonate solution is sprayed by a spray on a layer of the photosensitive resin composition having a thickness of 37 to 42 ?m under the following conditions, the photosensitive resin composition layer being able to be removed within 20 seconds, the above conditions being that an internal diameter of a nozzle of the spray is 1.2 mm, a spraying pressure is 0.05 MPa, and a distance between a point of the spray nozzle which is closest to the photosensitive resin composition layer and the photosensitive resin composition layer is 50 mm; and (2) when the 1.

Abstract: A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiatior, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

Abstract: The photosensitive film of the invention is a photosensitive film comprising a photosensitive resin layer (30) on a support film (1), characterized in that the photosensitive resin layer (30) is prepared by laminating two or more layers including a facing photosensitive resin layer (2) having a facing surface that faces one surface of the support film (1) and an opposite photosensitive resin layer (3) having an opposing surface (F2) on the side of the photosensitive resin layer (30) opposite the facing surface, and in that no protective film is present on the photosensitive resin layer (30) and the film can be wound into a roll.

Abstract: A method for packaging a photosensitive film roll, comprising packaging the photosensitive film roll with a resin case.

Abstract: A photosensitive resin composition is here disclosed which satisfies the following (1) and (2):