Patents by Inventor Katsutoshi Iwata

Katsutoshi Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having two or more bonding option pads
    Patent number: 5982043
    Abstract: Two or more bonding option pads are aligned in a predetermined direction on a semiconductor chip. Leads on higher and lower potential sides are provided on both sides of the bonding option pads such that the leads are extended in the direction passing across the predetermined direction. At least one of the bonding option pads is connected to at least one of the leads by means of a bonding wire.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: November 9, 1999
    Assignee: NEC Corporation
    Inventor: Katsutoshi Iwata