Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.

Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

Abstract: A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.

Abstract: A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.

Abstract: Ground traces are formed to sandwich a write wiring trace. Ground walls are formed on the ground traces. A ground cover is formed so as to couple upper ends of the ground walls. Thus, the ground traces, the ground walls and the ground cover are positioned in a region above and on both sides of the write wiring trace to surround the write wiring trace.

Abstract: A wired circuit board assembly sheet includes a plurality of wired circuit boards spaced to each other, and a plurality of striated portions extending between the respective wired circuit boards along a direction intersecting the lengthwise direction of the wired circuit boards.

Abstract: A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a spacing therebetween. A second insulating layer is formed on the first insulating layer to cover the wiring trace and the ground trace. On the second insulating layer, a wiring trace is formed at a position above the wiring trace. A third insulating layer is formed on the second insulating layer to cover the wiring trace. The width of the wiring trace is set larger than the width of the wiring trace. At least a partial region of the ground trace and at least a partial region of the wiring trace are opposite to each other with part of the second insulating layer sandwiched therebetween.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.

Abstract: A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface.

Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a pressure-sensitive adhesive layer; and a base layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene- (1-butene) copolymer polymerized by using a metallocene catalyst, the amorphous propylene-(1-butene) copolymer having a weight-average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw/Mn) of 2 or less; and the base layer contains an ethylene-vinyl acetate copolymer.

Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25° C. of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

Abstract: A first insulating layer is formed on a suspension body. Wiring traces are formed in parallel at an interval on the first insulating layer. A second insulating layer is formed in a region on the first insulating layer on both sides of the wiring traces. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A third insulating layer is formed on the first and second insulating layers to cover the wiring traces.

Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.

Abstract: A first insulating layer is formed on a suspension body, and a write wiring trace and a read wiring trace are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring traces. A write wiring trace and a read wiring trace are formed on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring traces. The width of the wiring trace is larger than the width of the wiring trace, and the width of the wiring trace is larger than the width of the wiring trace.

Abstract: A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion using the insulating layer as an etching resist, and forming a plurality of wires on the insulating layer.

Abstract: A wired circuit board assembly sheet includes a plurality of wired circuit boards spaced to each other, and a plurality of striated portions extending between the respective wired circuit boards along a direction intersecting the lengthwise direction of the wired circuit boards.

Abstract: A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the first conductive layer in a thickness direction. The terminal formation portion includes the first and second conductive layers formed in parallel in the same plane. The middle portion includes the first conductive layer formed on the first insulating layer, and the second conductive layer formed on a portion of the second insulating layer extending from the wiring formation portion to a mid-point between the wiring formation portion and the terminal formation portion, and formed on a portion of the first insulating layer extending from the mid-point to the terminal formation portion.