Patents by Inventor Katsutoshi Kitagawa

Katsutoshi Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200294700
    Abstract: A transformer includes a transformer body, a tank, a conservator, a plurality of support fittings, and at least one mounting seat. Transformer body includes an iron core and a winding. Tank includes an upper tank, a middle tank, and a lower tank that are bonded together to form an internal space accommodating transformer body. Conservator is arranged at a position above tank. The plurality of support fittings are arranged side by side at intervals to support conservator. At least one mounting seat is bonded to both a peripheral wall of upper tank and a peripheral wall of middle tank, and fixed to tank, and the plurality of support fittings are attached.
    Type: Application
    Filed: January 17, 2018
    Publication date: September 17, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takayuki IMAZU, Keita TONOIKE, Katsutoshi OKADA, Hiroshi KINOSHITA, Yoshinobu KITAGAWA
  • Patent number: 10219383
    Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: February 26, 2019
    Assignee: IBIDEN CO. , LTD.
    Inventors: Katsutoshi Kitagawa, Takema Adachi
  • Publication number: 20180270958
    Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.
    Type: Application
    Filed: March 19, 2018
    Publication date: September 20, 2018
    Applicant: IBIDEN CO. , LTD.
    Inventors: Katsutoshi KITAGAWA, Takema ADACHI
  • Patent number: 10051734
    Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: August 14, 2018
    Assignee: IBIDEN CO., LTD.
    Inventor: Katsutoshi Kitagawa
  • Publication number: 20170265299
    Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.
    Type: Application
    Filed: March 8, 2017
    Publication date: September 14, 2017
    Applicant: IBIDEN CO., LTD.
    Inventor: Katsutoshi KITAGAWA
  • Patent number: 9750136
    Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 29, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Katsutoshi Kitagawa
  • Publication number: 20170171974
    Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 15, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: MICHIMASA TAKAHASHI, KATSUTOSHI KITAGAWA
  • Patent number: 9554462
    Abstract: A printed wiring board includes a multilayer core substrate, a first buildup layer formed on the multilayer core substrate and including an interlayer insulation layer and a conductive layer, a second buildup layer formed on the multilayer core substrate and including an interlayer resin insulation layer and a conductive layer, and an end-surface through hole conductor formed on side surfaces of the first and second buildup layers and core substrate such that the through hole conductor connects the conductive layers of the first and second buildup layers. The core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer, a first insulation layer between the first and middle conductive layers and a second insulation layer between the second and middle conductive layers, and the middle conductive layer is connected to the through-hole conductor and has thickness greater than thicknesses of the first and second conductive layers.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 24, 2017
    Assignee: IBIDEN CO., LTD.
    Inventor: Katsutoshi Kitagawa
  • Publication number: 20150257261
    Abstract: A printed wiring board includes a multilayer core substrate, a first buildup layer formed on the multilayer core substrate and including an interlayer insulation layer and a conductive layer, a second buildup layer formed on the multilayer core substrate and including an interlayer resin insulation layer and a conductive layer, and an end-surface through hole conductor formed on side surfaces of the first and second buildup layers and core substrate such that the through hole conductor connects the conductive layers of the first and second buildup layers. The core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer, a first insulation layer between the first and middle conductive layers and a second insulation layer between the second and middle conductive layers, and the middle conductive layer is connected to the through-hole conductor and has thickness greater than thicknesses of the first and second conductive layers.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventor: Katsutoshi KITAGAWA
  • Publication number: 20150257268
    Abstract: A printed wiring board includes a core substrate, and a buildup layer formed on the core substrate and including an interlayer resin insulation layer and a conductive layer. The core substrate includes a metal core, a first insulation layer on first surface of the metal core, a first conductive layer on the first insulation layer, a second insulation layer on second surface of the metal core, and a second conductive layer on the second insulation layer, the metal core has a penetrating hole penetrating from the first surface to the second surface and a resin portion filling the penetrating hole, the resin portion includes resin material from the first insulation layer, the core substrate has a through-hole conductor formed in the resin portion through the metal core, the interlayer resin insulation layer has a core material, and the first insulation layer does not have a core material.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Katsutoshi KITAGAWA, Tomoya Sawamura
  • Patent number: 7621242
    Abstract: The present invention provides a variable valve operating mechanism which includes two valve operating members for opening and closing two valves individually, a drive cam provided on a single camshaft, two swing arms for transmitting a power of the drive cam to the valve operating members individually by swinging about a different axis to the camshaft, and a variable device for modifying a displacement of the swing arm per rotation of the drive cam in accordance with an operating condition of an internal combustion engine. The variable device includes a single control shaft, an actuator for driving the control shaft, and a cam device that operates in conjunction with the control shaft to dissimilate the displacement of the two swing arms.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: November 24, 2009
    Assignee: OTICS Corporation
    Inventors: Katsutoshi Kitagawa, Akira Sugiura, Tomiyasu Hirano, Tamotsu Yamamoto, Tetsuya Niwa
  • Patent number: 7451729
    Abstract: The present invention provides a variable valve mechanism which includes a rotating cam provided on a camshaft, a swing arm that contacts with the rotating cam to swing, a drive arm that drives a valve in conjunction with the swing arm, a variable arm that turns the drive arm around a swing axis of the swing arm, an actuator that drives the variable arm, and cam device that is provided between the swing arm and the drive arm. The variable arm is provided so as to be able to rotate relatively around the same axis as the swing arm, and the cam device changes the initial position of the drive arm with respect to the swing arm accompanying the turning of the drive arm.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: November 18, 2008
    Assignee: Otics Corporation
    Inventors: Akira Sugiura, Tetsuya Niwa, Tamotsu Yamamoto, Katsutoshi Kitagawa, Tomiyasu Hirano, Tomoki Miyoshi
  • Publication number: 20070295292
    Abstract: The present invention provides a variable valve mechanism which includes a rotating cam provided on a camshaft, a swing arm that contacts with the rotating cam to swing, a drive arm that drives a valve in conjunction with the swing arm, a variable arm that turns the drive arm around a swing axis of the swing arm, an actuator that drives the variable arm, and cam device that is provided between the swing arm and the drive arm. The variable arm is provided so as to be able to rotate relatively around the same axis as the swing arm, and the cam device changes the initial position of the drive arm with respect to the swing arm accompanying the turning of the drive arm.
    Type: Application
    Filed: March 12, 2007
    Publication date: December 27, 2007
    Applicant: OTICS CORPORATION
    Inventors: Akira Sugiura, Tetsuya Niwa, Tamotsu Yamamoto, Katsutoshi Kitagawa, Tomiyasu Hirano, Tomoki Miyoshi
  • Publication number: 20070144474
    Abstract: The present invention provides a variable valve operating mechanism which includes two valve operating members for opening and closing two valves individually, a drive cam provided on a single camshaft, two swing arms for transmitting a power of the drive cam to the valve operating members individually by swinging about a different axis to the camshaft, and a variable device for modifying a displacement of the swing arm per rotation of the drive cam in accordance with an operating condition of an internal combustion engine. The variable device includes a single control shaft, an actuator for driving the control shaft, and a cam device that operates in conjunction with the control shaft to dissimilate the displacement of the two swing arms.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 28, 2007
    Applicant: OTICS CORPORATION
    Inventors: Katsutoshi Kitagawa, Akira Sugiura, Tomiyasu Hirano, Tamotsu Yamamoto, Tetsuya Niwa
  • Patent number: 4644916
    Abstract: This four stroke V-configuration engine has two cylinder banks which have equal numbers of cylinders, angled with respect to one another at a bank angle .alpha. different from 90.degree.. For each bank of cylinders, the angular positions of the crank shaft crank pins therefor are evenly spaced apart around the central axis of the crank shaft, and between the banks of cylinders the angular positions of a pair of corresponding cylinders are separated by a crank angle of 90.degree.-.alpha.. A first set of balance weights is provided so as to rotate about an axis parallel to the rotational axis of the crank shaft in the same direction and at the same speed as the crank shaft, and a second set of balance weights is provided so as to rotate about an axis parallel to the rotational axis of the crank shaft in the opposite direction and at the same speed as the crank shaft.
    Type: Grant
    Filed: July 17, 1985
    Date of Patent: February 24, 1987
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Katsutoshi Kitagawa
  • Patent number: 4500099
    Abstract: An elastic supporting and sealing member, for mutually supporting a first body and a second body, and for sealing the gap between the first body and the second body, includes a first portion and a second portion of wire net and a piece of thermal foaming material, between the first and the second wire net portion, which expands and foams when it is heated up. A method of making such a member includes the steps of flattening a tubular shaped piece of wire net, and of introducing a strip shaped piece of such thermal foaming material between the two sides of the flattened tube of wire net, so that the longitudinal directions of the strip shaped piece of thermal foaming material and of the flattened wire net tube substantially coincide.
    Type: Grant
    Filed: March 4, 1983
    Date of Patent: February 19, 1985
    Assignees: Toyota Jidosha Kabushiki Kaisha, Chuo Spring Co., Ltd.
    Inventors: Katsutoshi Kitagawa, Kiyoshi Isogai, Nobuo Ohmori, Naka Takita, Makoto Okamoto, Itsuo Koga, Kazuo Ito
  • Patent number: 4192263
    Abstract: A valve drive device for an internal combustion engine characterized in a movably pivoted rocker arm, at either a cam-contacting part or a valve stem-contacting part thereof, having installed therein a built-in oil pressure tappet for automatically absorbing a gap created at such contacting part. Between the oil pressure tappet and the cam or the valve stem, in contact with the oil pressure tappet, a movable plate is provided, having a curved surface where the movable plate and/or the oil pressure tappet contact each other, thereby lubricating the contacting part to prevent its abrasion.
    Type: Grant
    Filed: July 26, 1977
    Date of Patent: March 11, 1980
    Assignee: Toyota Jidosha Kogyo Kabushiki Kaisha
    Inventors: Katsutoshi Kitagawa, Hiroki Yamauchi