Patents by Inventor Katsutoshi Nagi

Katsutoshi Nagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device for radio communication device, and radio communication device using said semiconductor device
    Patent number: 7088983
    Abstract: A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: August 8, 2006
    Assignee: Rohm Co., Ltd.
    Inventors: Junichi Hikita, Hiroo Mochida, Katsutoshi Nagi
  • Communication device
    Patent number: 6869019
    Abstract: In a communication device, electric circuits other than an antenna are enclosed in a shielding member made of a material that shuts off radio waves, and the antenna is enclosed by disposing in front thereof a radio wave absorbing member that attenuates radio waves in a predetermined frequency band. Thus, unnecessary electromagnetic emission is alleviated while satisfactory communication quality is secured.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: March 22, 2005
    Assignee: Rohm Co., Ltd.
    Inventors: Katsutoshi Nagi, Takashi Ueda
  • Semiconductor device for radio communication device, and radio communication device using said semiconductor device
    Publication number: 20040043732
    Abstract: A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.
    Type: Application
    Filed: September 5, 2003
    Publication date: March 4, 2004
    Inventors: Junichi Hikita, Hiroo Mochida, Katsutoshi Nagi