Patents by Inventor Katsutoshi NOMURA

Katsutoshi NOMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076142
    Abstract: This conveyance device comprises: a suction head which suctions and conveys an electronic component; a movement control unit which moves the suction head; a rotation control unit which controls a rotation position of the suction head centered on a predetermined axis of rotation; and a suction control unit which causes the suction head to suction the electronic component such that a load exerted on the electronic component from the suction head in conjunction with the movement of the suction head is less than or equal to a predetermined pressure. The movement control unit sets a correction amount of the predetermined pressure based on the self-weight of the suction head on the basis of the rotation position of the suction head. Using a conveyance device such as the foregoing makes it possible to improve the accuracy of load control during suction or suction release of an electronic component.
    Type: Application
    Filed: March 16, 2021
    Publication date: March 7, 2024
    Applicant: SHINKAWA LTD.
    Inventor: Katsutoshi Nomura
  • Patent number: 11848219
    Abstract: A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: December 19, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Yuichiro Noguchi, Katsutoshi Nomura
  • Publication number: 20210242051
    Abstract: A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.
    Type: Application
    Filed: January 21, 2019
    Publication date: August 5, 2021
    Applicant: SHINKAWA LTD.
    Inventors: Yuichiro NOGUCHI, Katsutoshi NOMURA