Patents by Inventor Katsutoshi Yamamoto

Katsutoshi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191328
    Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si. The oxide layer has a first oxide layer, a second oxide layer, a third oxide layer, and a fourth oxide layer. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Fe content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, the third oxide layer is a layer where Si content takes a local maximum value, and the fourth oxide layer is a layer where Fe content takes a local maximum value.
    Type: Application
    Filed: February 21, 2024
    Publication date: June 13, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takuya ISHIDA, Makoto YAMAMOTO, Katsutoshi UJI, Yuya ISHIDA, Mitsuru ODAHARA
  • Patent number: 11965229
    Abstract: A metal magnetic particle provided with an oxide layer on a surface of an alloy particle containing Fe and Si. The oxide layer has a first oxide layer, a second oxide layer, a third oxide layer, and a fourth oxide layer. Also, in line analysis of element content by using a scanning transmission electron microscope-energy dispersive X-ray spectroscopy, the first oxide layer is a layer where Fe content takes a local maximum value, the second oxide layer is a layer where Fe content takes a local maximum value, the third oxide layer is a layer where Si content takes a local maximum value, and the fourth oxide layer is a layer where Fe content takes a local maximum value.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: April 23, 2024
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuya Ishida, Makoto Yamamoto, Katsutoshi Uji, Yuya Ishida, Mitsuru Odahara
  • Publication number: 20240117517
    Abstract: Disclosed is an Fe-based electroplated steel sheet including: a Si-containing cold-rolled steel sheet containing Si in an amount of 0.1 mass % or more and 3.0 mass % or less; and an Fe-based electroplating layer formed on at least one surface of the Si-containing cold-rolled steel sheet with a coating weight per surface of 5.0 g/m2 or more, in which in an intensity profile measured by glow discharge optical emission spectrometry, a peak of emission intensity at wavelengths indicating Si is detected within a range from a surface of the Fe-based electroplating layer to more than 0.2 ?m in a thickness direction and not more than a thickness of the Fe-based electroplating layer, and an average value of C concentration in a region ranging from 10 ?m to 20 ?m in the thickness direction from the surface of the Fe-based electroplating layer is 0.10 mass % or less.
    Type: Application
    Filed: November 5, 2021
    Publication date: April 11, 2024
    Applicant: JFE STEEL CORPORATION
    Inventors: Shunsuke YAMAMOTO, Katsutoshi TAKASHIMA, Yusuke OKUMURA, Tomomi KANAZAWA, Katsuya HOSHINO, Takashi KAWANO, Takako YAMASHITA, Hiroshi MATSUDA, Yoichi MAKIMIZU
  • Patent number: 11890797
    Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 6, 2024
    Assignee: CHONGQING BOMAN NEW MATERIAL CO., LTD.
    Inventors: Katsutoshi Yamamoto, Michiko Sawai, Asami Masuda, Shigemi Oikawa
  • Patent number: 11554458
    Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: January 17, 2023
    Assignee: SUMCO CORPORATION
    Inventors: Yuki Nakano, Katsuhisa Sugimori, Kazuaki Kozasa, Jiro Kajiwara, Katsutoshi Yamamoto, Takayuki Kihara, Ryoya Terakawa
  • Publication number: 20210402665
    Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.
    Type: Application
    Filed: November 11, 2019
    Publication date: December 30, 2021
    Inventors: Katsutoshi YAMAMOTO, Michiko SAWAI, Asami MASUDA, Shigemi OIKAWA
  • Publication number: 20210331285
    Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.
    Type: Application
    Filed: February 13, 2019
    Publication date: October 28, 2021
    Applicant: SUMCO CORPORATION
    Inventors: Yuki NAKANO, Katsuhisa SUGIMORI, Kazuaki KOZASA, Jiro KAJIWARA, Katsutoshi YAMAMOTO, Takayuki KIHARA, Ryoya TERAKAWA
  • Patent number: 10547147
    Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: January 28, 2020
    Assignee: HOSIDEN CORPORATION
    Inventors: Keiichi Taniguchi, Katsutoshi Yamamoto
  • Patent number: 10340169
    Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: July 2, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Katsutoshi Yamamoto
  • Patent number: 9809531
    Abstract: A method for producing a fatty acid ester through desulfurization of sulfur from a fatty acid ester using a catalyst, wherein the catalyst carries a catalyst metal on a support, (a) the catalyst contains as the catalyst metal one or more elements selected from the elements of group 9, group 10 and group 11 of the periodic table, (b) the total pore volume of the catalyst is 0.05 mL/g or more, and (c) the volume of pores with a pore size of 0.1 ?m or more and 500 ?m or less is 50% or more of the total pore volume of the catalyst. A desulfurization method using the desulfurization and a method for producing an alcohol through hydrogenation of the fatty acid ester obtained through the desulfurization are also provided.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: November 7, 2017
    Assignee: KAO CORPORATION
    Inventors: Nobuhiko Okada, Katsutoshi Yamamoto, Taichi Homma, Kazuyuki Harima
  • Publication number: 20170275231
    Abstract: A method for producing a fatty acid ester through desulfurization of sulfur from a fatty acid ester using a catalyst, wherein the catalyst carries a catalyst metal on a support, (a) the catalyst contains as the catalyst metal one or more elements selected from the elements of group 9, group 10 and group 11 of the periodic table, (b) the total pore volume of the catalyst is 0.05 mL/g or more, and (c) the volume of pores with a pore size of 0.1 ?m or more and 500 ?m or less is 50% or more of the total pore volume of the catalyst. A desulfurization method using the desulfurization and a method for producing an alcohol through hydrogenation of the fatty acid ester obtained through the desulfurization are also provided.
    Type: Application
    Filed: November 17, 2015
    Publication date: September 28, 2017
    Applicant: Kao Corporation
    Inventors: Nobuhiko OKADA, Katsutoshi YAMAMOTO, Taichi HOMMA, Kazuyuki HARIMA
  • Publication number: 20170117173
    Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.
    Type: Application
    Filed: February 11, 2016
    Publication date: April 27, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Katsutoshi YAMAMOTO
  • Publication number: 20170110837
    Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.
    Type: Application
    Filed: October 10, 2016
    Publication date: April 20, 2017
    Inventors: Keiichi Taniguchi, Katsutoshi Yamamoto
  • Patent number: 8545712
    Abstract: In a method of manufacturing semiconductor wafers, front and back surfaces of the semiconductor wafers are simultaneously polished with a double-side polishing machine that includes: a carrier for accommodating the semiconductor wafer; and an upper press platen and a lower press platen for sandwiching the carrier. The method includes: accommodating the semiconductor wafer in the carrier while a thickness of the semiconductor wafer is set to be larger than a thickness of the carrier by 0 ?m to 5 ?m; and polishing the semiconductor wafer while feeding a polishing slurry to between the surfaces of the semiconductor wafer and surfaces of the press platens. In the polishing, an allowance of both surfaces of the semiconductor wafer is set at 5 ?m or less in total.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: October 1, 2013
    Assignee: Sumco Techxiv Corporation
    Inventors: Hiroshi Takai, Kenji Satomura, Yuichi Nakayoshi, Katsutoshi Yamamoto, Kouji Mizowaki
  • Patent number: 8252949
    Abstract: The present invention relates to a process for producing fatty acid alkyl esters from fats/oils and a C1 to C5 lower alcohol as reaction starting materials with a solid catalyst, wherein the starting materials and reaction products in a reaction system where the degree of conversion of fats/oils is 50 mol % or more are reacted in such a state as to be in one-liquid phase, or the starting materials and reaction products in a reaction system at a stage with the highest degree of conversion of fats/oils are reacted in such a state as to be in one-liquid phase.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: August 28, 2012
    Assignee: Kao Corporation
    Inventors: Yuichiro Seki, Takanobu Katayama, Katsutoshi Yamamoto
  • Publication number: 20100285665
    Abstract: In a method of manufacturing semiconductor wafers, front and hack surfaces of the semiconductor wafers are simultaneously polished with a double-side polishing machine that includes: a carrier for accommodating the semiconductor wafer; and an upper press platen and a lower press platen for sandwiching the carrier. The method includes: accommodating the semiconductor wafer in the carrier while a thickness of the semiconductor wafer is set to be larger than a thickness of the carrier by 0 ?m to 5 ?m; and polishing the semiconductor wafer while feeding a polishing slurry to between the surfaces of the semiconductor wafer and surfaces of the press platens. In the polishing, an allowance of both surfaces of the semiconductor wafer is set at 5 ?m or less in total.
    Type: Application
    Filed: September 11, 2008
    Publication date: November 11, 2010
    Applicant: SUMCO TECHXIV CORPORATION
    Inventors: Hiroshi Takai, Kenji Satomura, Yuichi Nakayoshi, Katsutoshi Yamamoto, Kouji Mizowaki
  • Patent number: 7767035
    Abstract: A metallic magnetic material for magnetic element for magnetic element of a choke coil and an SMD choke power coil for accommodating low voltage and high current in a personal computer, graphic card, high frequency power supply, etc, is prepared by baking a powder of Fe—Si—Al alloy sendust, obtained by an atomization process and having an average particle diameter of 10 to 70 ?m, at 600° C. to 1000° C. in air or in an oxidizing atmosphere and mixing the baked sendust with 3 to 45 wt % of a carbonyl iron powder with an average particle diameter of 1 to 10 ?m. The metallic magnetic material for magnetic element according to the present invention is used in a coil-embedded SMD power choke coil having a square or rectangular shape with a height of 1 mm to 7 mm and with a length of one side being 3 mm to 13 mm.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: August 3, 2010
    Assignee: Sekisin Industry Co., Ltd.
    Inventors: Namio Sato, Yotaro Toyoshima, Katsutoshi Yamamoto
  • Publication number: 20100179338
    Abstract: The present invention relates to a process for producing fatty acid alkyl esters from fats/oils and a C1 to C5 lower alcohol as reaction starting materials with a solid catalyst, wherein the starting materials and reaction products in a reaction system where the degree of conversion of fats/oils is 50 mol % or more are reacted in such a state as to be in one-liquid phase, or the starting materials and reaction products in a reaction system at a stage with the highest degree of conversion of fats/oils are reacted in such a state as to be in one-liquid phase.
    Type: Application
    Filed: June 11, 2008
    Publication date: July 15, 2010
    Applicant: KAO CORPORATION
    Inventors: Yuichiro Seki, Takanobu Katayama, Katsutoshi Yamamoto
  • Publication number: 20090095380
    Abstract: A metallic magnetic material for magnetic element for magnetic element of a choke coil and an SMD choke power coil for accommodating low voltage and high current in a personal computer, graphic card, high frequency power supply, etc, is prepared by baking a powder of Fe—Si—Al alloy sendust, obtained by an atomization process and having an average particle diameter of 10 to 70 ?m, at 600° C. to 1000° C. in air or in an oxidizing atmosphere and mixing the baked sendust with 3 to 45 wt % of a carbonyl iron powder with an average particle diameter of 1 to 10 ?m. The metallic magnetic material for magnetic element according to the present invention is used in a coil-embedded SMD power choke coil having a square or rectangular shape with a height of 1 mm to 7 mm and with a length of one side being 3 mm to 13 mm.
    Type: Application
    Filed: November 30, 2007
    Publication date: April 16, 2009
    Applicant: SEKISIN INDUSTRY CO., LTD.
    Inventors: Namio SATO, Yotaro TOYOSHIMA, Katsutoshi YAMAMOTO
  • Patent number: 6987224
    Abstract: A polytetrafluoroethylene mixed powder, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000±500,000 and a maximum peak temperature of 327±5° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000±1,000,000 and a maximum peak temperature of 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, and the mixed powder has evident peak temperatures of 327±5° C. and 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: January 17, 2006
    Assignee: Daikin Industries, Ltd.
    Inventors: Katsutoshi Yamamoto, Hiroyuki Yoshimoto, Kazuo Ishiwari, Shinichi Yano