Patents by Inventor Katsutoshi Yamamoto
Katsutoshi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11890797Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.Type: GrantFiled: November 11, 2019Date of Patent: February 6, 2024Assignee: CHONGQING BOMAN NEW MATERIAL CO., LTD.Inventors: Katsutoshi Yamamoto, Michiko Sawai, Asami Masuda, Shigemi Oikawa
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Patent number: 11554458Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.Type: GrantFiled: February 13, 2019Date of Patent: January 17, 2023Assignee: SUMCO CORPORATIONInventors: Yuki Nakano, Katsuhisa Sugimori, Kazuaki Kozasa, Jiro Kajiwara, Katsutoshi Yamamoto, Takayuki Kihara, Ryoya Terakawa
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Publication number: 20210402665Abstract: A method for preparing an unsintered PTFE film capable of being continuously formed and with uniform density distribution and high density. The method for preparing the unsintered PTFE film includes filling a mixture obtained by adding a forming aid to PTFE fine powder in an extrusion forming die, extruding the filled mixture from the extrusion forming die to produce an extrusion forming body, rolling the extrusion forming body with a roll to produce a forming aid-removed film without the forming aid, and pinching the forming aid-removed film into a pinch roll made of a rubber roll formed by coating rubber on a metal shaft core at room temperature and compressing the forming aid-removed film so that thickness of the forming aid-removed film is reduced and density thereof is above 2.0 g/cm3.Type: ApplicationFiled: November 11, 2019Publication date: December 30, 2021Inventors: Katsutoshi YAMAMOTO, Michiko SAWAI, Asami MASUDA, Shigemi OIKAWA
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Publication number: 20210331285Abstract: A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.Type: ApplicationFiled: February 13, 2019Publication date: October 28, 2021Applicant: SUMCO CORPORATIONInventors: Yuki NAKANO, Katsuhisa SUGIMORI, Kazuaki KOZASA, Jiro KAJIWARA, Katsutoshi YAMAMOTO, Takayuki KIHARA, Ryoya TERAKAWA
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Patent number: 10547147Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.Type: GrantFiled: October 10, 2016Date of Patent: January 28, 2020Assignee: HOSIDEN CORPORATIONInventors: Keiichi Taniguchi, Katsutoshi Yamamoto
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Patent number: 10340169Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.Type: GrantFiled: February 11, 2016Date of Patent: July 2, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventor: Katsutoshi Yamamoto
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Patent number: 9809531Abstract: A method for producing a fatty acid ester through desulfurization of sulfur from a fatty acid ester using a catalyst, wherein the catalyst carries a catalyst metal on a support, (a) the catalyst contains as the catalyst metal one or more elements selected from the elements of group 9, group 10 and group 11 of the periodic table, (b) the total pore volume of the catalyst is 0.05 mL/g or more, and (c) the volume of pores with a pore size of 0.1 ?m or more and 500 ?m or less is 50% or more of the total pore volume of the catalyst. A desulfurization method using the desulfurization and a method for producing an alcohol through hydrogenation of the fatty acid ester obtained through the desulfurization are also provided.Type: GrantFiled: November 17, 2015Date of Patent: November 7, 2017Assignee: KAO CORPORATIONInventors: Nobuhiko Okada, Katsutoshi Yamamoto, Taichi Homma, Kazuyuki Harima
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Publication number: 20170275231Abstract: A method for producing a fatty acid ester through desulfurization of sulfur from a fatty acid ester using a catalyst, wherein the catalyst carries a catalyst metal on a support, (a) the catalyst contains as the catalyst metal one or more elements selected from the elements of group 9, group 10 and group 11 of the periodic table, (b) the total pore volume of the catalyst is 0.05 mL/g or more, and (c) the volume of pores with a pore size of 0.1 ?m or more and 500 ?m or less is 50% or more of the total pore volume of the catalyst. A desulfurization method using the desulfurization and a method for producing an alcohol through hydrogenation of the fatty acid ester obtained through the desulfurization are also provided.Type: ApplicationFiled: November 17, 2015Publication date: September 28, 2017Applicant: Kao CorporationInventors: Nobuhiko OKADA, Katsutoshi YAMAMOTO, Taichi HOMMA, Kazuyuki HARIMA
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Publication number: 20170117173Abstract: According to one embodiment, there is provided an antireflection member including a first plate part, a second plate part, and a third plate part. The first plate part has a first end and a second end. The second end is arranged at a side opposite to the first end. The second plate part extends from a vicinity of the first end. A first notch part is arranged on the second plate part. The second plate part has an antireflection surface. The third plate part extends from a vicinity of the second end to be opposed to the second plate part A second notch part is arranged at a position corresponding to the first notch part on the third plate part. The third plate part has an antireflection surface directed to the antireflection surface of the second plate part.Type: ApplicationFiled: February 11, 2016Publication date: April 27, 2017Applicant: Kabushiki Kaisha ToshibaInventor: Katsutoshi YAMAMOTO
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Publication number: 20170110837Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.Type: ApplicationFiled: October 10, 2016Publication date: April 20, 2017Inventors: Keiichi Taniguchi, Katsutoshi Yamamoto
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Patent number: 8545712Abstract: In a method of manufacturing semiconductor wafers, front and back surfaces of the semiconductor wafers are simultaneously polished with a double-side polishing machine that includes: a carrier for accommodating the semiconductor wafer; and an upper press platen and a lower press platen for sandwiching the carrier. The method includes: accommodating the semiconductor wafer in the carrier while a thickness of the semiconductor wafer is set to be larger than a thickness of the carrier by 0 ?m to 5 ?m; and polishing the semiconductor wafer while feeding a polishing slurry to between the surfaces of the semiconductor wafer and surfaces of the press platens. In the polishing, an allowance of both surfaces of the semiconductor wafer is set at 5 ?m or less in total.Type: GrantFiled: September 11, 2008Date of Patent: October 1, 2013Assignee: Sumco Techxiv CorporationInventors: Hiroshi Takai, Kenji Satomura, Yuichi Nakayoshi, Katsutoshi Yamamoto, Kouji Mizowaki
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Patent number: 8252949Abstract: The present invention relates to a process for producing fatty acid alkyl esters from fats/oils and a C1 to C5 lower alcohol as reaction starting materials with a solid catalyst, wherein the starting materials and reaction products in a reaction system where the degree of conversion of fats/oils is 50 mol % or more are reacted in such a state as to be in one-liquid phase, or the starting materials and reaction products in a reaction system at a stage with the highest degree of conversion of fats/oils are reacted in such a state as to be in one-liquid phase.Type: GrantFiled: June 11, 2008Date of Patent: August 28, 2012Assignee: Kao CorporationInventors: Yuichiro Seki, Takanobu Katayama, Katsutoshi Yamamoto
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Publication number: 20100285665Abstract: In a method of manufacturing semiconductor wafers, front and hack surfaces of the semiconductor wafers are simultaneously polished with a double-side polishing machine that includes: a carrier for accommodating the semiconductor wafer; and an upper press platen and a lower press platen for sandwiching the carrier. The method includes: accommodating the semiconductor wafer in the carrier while a thickness of the semiconductor wafer is set to be larger than a thickness of the carrier by 0 ?m to 5 ?m; and polishing the semiconductor wafer while feeding a polishing slurry to between the surfaces of the semiconductor wafer and surfaces of the press platens. In the polishing, an allowance of both surfaces of the semiconductor wafer is set at 5 ?m or less in total.Type: ApplicationFiled: September 11, 2008Publication date: November 11, 2010Applicant: SUMCO TECHXIV CORPORATIONInventors: Hiroshi Takai, Kenji Satomura, Yuichi Nakayoshi, Katsutoshi Yamamoto, Kouji Mizowaki
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Patent number: 7767035Abstract: A metallic magnetic material for magnetic element for magnetic element of a choke coil and an SMD choke power coil for accommodating low voltage and high current in a personal computer, graphic card, high frequency power supply, etc, is prepared by baking a powder of Fe—Si—Al alloy sendust, obtained by an atomization process and having an average particle diameter of 10 to 70 ?m, at 600° C. to 1000° C. in air or in an oxidizing atmosphere and mixing the baked sendust with 3 to 45 wt % of a carbonyl iron powder with an average particle diameter of 1 to 10 ?m. The metallic magnetic material for magnetic element according to the present invention is used in a coil-embedded SMD power choke coil having a square or rectangular shape with a height of 1 mm to 7 mm and with a length of one side being 3 mm to 13 mm.Type: GrantFiled: November 30, 2007Date of Patent: August 3, 2010Assignee: Sekisin Industry Co., Ltd.Inventors: Namio Sato, Yotaro Toyoshima, Katsutoshi Yamamoto
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Publication number: 20100179338Abstract: The present invention relates to a process for producing fatty acid alkyl esters from fats/oils and a C1 to C5 lower alcohol as reaction starting materials with a solid catalyst, wherein the starting materials and reaction products in a reaction system where the degree of conversion of fats/oils is 50 mol % or more are reacted in such a state as to be in one-liquid phase, or the starting materials and reaction products in a reaction system at a stage with the highest degree of conversion of fats/oils are reacted in such a state as to be in one-liquid phase.Type: ApplicationFiled: June 11, 2008Publication date: July 15, 2010Applicant: KAO CORPORATIONInventors: Yuichiro Seki, Takanobu Katayama, Katsutoshi Yamamoto
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Publication number: 20090095380Abstract: A metallic magnetic material for magnetic element for magnetic element of a choke coil and an SMD choke power coil for accommodating low voltage and high current in a personal computer, graphic card, high frequency power supply, etc, is prepared by baking a powder of Fe—Si—Al alloy sendust, obtained by an atomization process and having an average particle diameter of 10 to 70 ?m, at 600° C. to 1000° C. in air or in an oxidizing atmosphere and mixing the baked sendust with 3 to 45 wt % of a carbonyl iron powder with an average particle diameter of 1 to 10 ?m. The metallic magnetic material for magnetic element according to the present invention is used in a coil-embedded SMD power choke coil having a square or rectangular shape with a height of 1 mm to 7 mm and with a length of one side being 3 mm to 13 mm.Type: ApplicationFiled: November 30, 2007Publication date: April 16, 2009Applicant: SEKISIN INDUSTRY CO., LTD.Inventors: Namio SATO, Yotaro TOYOSHIMA, Katsutoshi YAMAMOTO
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Patent number: 6987224Abstract: A polytetrafluoroethylene mixed powder, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000±500,000 and a maximum peak temperature of 327±5° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000±1,000,000 and a maximum peak temperature of 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, and the mixed powder has evident peak temperatures of 327±5° C. and 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter.Type: GrantFiled: May 29, 2001Date of Patent: January 17, 2006Assignee: Daikin Industries, Ltd.Inventors: Katsutoshi Yamamoto, Hiroyuki Yoshimoto, Kazuo Ishiwari, Shinichi Yano
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Publication number: 20050153820Abstract: A needle blade roll (12) for forming short fibers from a material capable of formation of artificial cotton in an artificial cotton fabricating apparatus is disclosed which is made up of a roll main body (13) and a large number of needle blades (14) implanted into a peripheral surface of the roll main body (13). In the needle blade roll (12), each needle blade (14) is arranged at a sloping angle relative to a radial line of the roll main body (13) so that its leading end lies ahead of the radial line with respect to the rotational direction of the roll main body (13). This makes it possible to form short fibers the length of which is longer than conventional, thereby fabricating artificial cotton made of such short fibers which are fully intertwined with one another.Type: ApplicationFiled: March 19, 2003Publication date: July 14, 2005Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Tokumatsu Ohto, Katsutoshi Yamamoto, Isao Ohgami
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Publication number: 20040198127Abstract: A non-woven fabric of the present invention is composed primarily of entangled fluoropolymer fibers. In addition, the non-woven fabric of the present invention may be pressure and heat treated, or may be subject to elongation. This provides the non-woven fabric with superior mechanical characteristics.Type: ApplicationFiled: December 18, 2003Publication date: October 7, 2004Inventors: Seigo Yamamoto, Katsutoshi Yamamoto, Jun Asano, Shinichi Chaen, Tomohisa Konishi
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Publication number: 20040112627Abstract: An insulating layer for high frequency signal transmission device having a low dielectric constant, low dielectric dissipation factor and improved end processability, and a material powder thereof are provided. A polytetrafluoroethylene mixed powder for insulation of a product for high-frequency signal transmission, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000±500,000 and a maximum peak temperature of 327±5° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000±1,000,000 and a maximum peak temperature of 340±7° C.Type: ApplicationFiled: December 13, 2002Publication date: June 17, 2004Inventors: Katsutoshi Yamamoto, Hiroyuki Yoshimoto, Kazuo Ishiwari, Shinichi Yano