Abstract: The present invention is a CVD process for forming a thin film which includes a step of recovering an organometallic compound component from an exhaust gas which has been conventionally discarded, and a purifying step of purifying the recovered organometallic compound to thereby eliminate a by-product formed in a film forming step by CVD. According to this process, the organometallic compound is recycled. As a recovering technique, any of the followings is employed: a technique in which the exhaust gas is cooled and is recovered as a recovered content; a technique in which the exhaust gas is brought into contact with a solvent to dissolve the organometallic compound in the solvent; and a technique in which the exhaust gas is brought into contact with an adsorbent to thereby adsorb the organometallic compound.

Abstract: The present invention relates to a plating solution of palladium alloy and has an object to provide a plating solution of palladium alloy highly stable and capable of stably forming a plated film of a given alloy composition. The present invention relates to a plating solution of palladium alloy containing a palladium complex and a metal salt, wherein the palladium complex is coordinated with at least one neutral amino acid selected from the group consisting of glycine, alanine, valine, leucine, serine, threonine, asparagine, glutamine and tyrosine as a ligand.

Abstract: The present invention is a CVD process for forming a thin film which includes a step of recovering an organometallic compound component from an exhaust gas which has been conventionally discarded, and a purifying step of purifying the recovered organometallic compound to thereby eliminate a by-product formed in a film forming step by CVD. According to this process, the organometallic compound is recycled. As a recovering technique, any of the followings is employed: a technique in which the exhaust gas is cooled and is recovered as a recovered content; a technique in which the exhaust gas is brought into contact with a solvent to dissolve the organometallic compound in the solvent; and a technique in which the exhaust gas is brought into contact with an adsorbent to thereby adsorb the organometallic compound.

Abstract: The present invention is a CVD process for forming a thin film which includes a step of recovering an organometallic compound component from an exhaust gas which has been conventionally discarded, and a purifying step of purifying the recovered organometallic compound to thereby eliminate a by-product formed in a film forming step by CVD. According to this process, the organometallic compound is recycled. As a recovering technique, any of the followings is employed: a technique in which the exhaust gas is cooled and is recovered as a recovered content; a technique in which the exhaust gas is brought into contact with a solvent to dissolve the organometallic compound in the solvent; and a technique in which the exhaust gas is brought into contact with an adsorbent to thereby adsorb the organometallic compound.

Abstract: The present invention provides a process for producing cyclopentadiene or a derivative thereof by heating a mixture containing at least one of dicyclopentadiene or a derivative thereof, the process comprising: a first step comprising heating the mixture into vapor; a second step comprising maintaining while heating the vapor at a temperature higher than the boiling point of the desired cyclopentadiene or derivative thereof to condense and remove high-boiling components and simultaneously collect residual vapor; and a third step comprising maintaining while heating the collected vapor at a temperature lower than the boiling point of the desired cyclopentadiene or derivative thereof to condense and collect the cyclopentadiene or derivative thereof. In the third step, the vapor may be contact with nitrogen gas to improve the yield of the cyclopentadiene or derivative thereof.

Abstract: The present invention provides a non-cyanide electrolytic gold plating solution comprising a gold compound, as a source material for gold, selected from the group consisting of a gold salt and a gold complex, a buffering agent, an organic brightener, and a conductive salt, wherein 1,2-ethanediamine is contained in the gold plating solution. The gold plating solution has excellent liquid stability in a bath and causes no change in the physical properties of the deposited gold or no decomposition of the solution during the operation of gold plating. The gold plating solutions include both a type in which a bis(1,2-ethanediamine) gold complex is used as a source material for gold, and a type in which a gold salt is used as a source material for gold. The gold plating solution is an unprecedentedly good electrolytic gold plating solution in which the hardness, purity, state of the deposited crystals and so on can be controlled.

Abstract: The present invention provides a process for producing bis(alkyl cyclopentadienyl ruthenium comprising reacting alkyl cyclopentadiene with ruthenium chloride and zinc powder in an alcohol solvent, the reaction being effected at a temperature within from −30° C. to −80° C. In the process, the alkyl cyclopentadiene may be first mixed with zinc powder in the alcohol solvent and subsequently the ruthenium chloride may be added thereto to produce bis(alkyl cyclopentadienyl) ruthenium with higher purity.

Abstract: The present invention provides a process for producing cyclopentadiene or a derivative thereof by heating a mixture containing at least one of dicyclopentadiene or a derivative thereof, the process comprising: a first step comprising heating the mixture into vapor; a second step comprising maintaining while heating the vapor at a temperature higher than the boiling point of the desired cyclopentadiene or derivative thereof to condense and remove high-boiling components and simultaneously collect residual vapor; and a third step comprising maintaining while heating the collected vapor at a temperature lower than the boiling point of the desired cyclopentadiene or derivative thereof to condense and collect the cyclopentadiene or derivative thereof. In the third step, the vapor may be contact with nitrogen gas to improve the yield of the cyclopentadiene or derivative thereof.

Abstract: The present invention is a CVD process for forming a thin film which includes a step of recovering an organometallic compound component from an exhaust gas which has been conventionally discarded, and a purifying step of purifying the recovered organometallic compound to thereby eliminate a by-product formed in a film forming step by CVD. According to this process, the organometallic compound is recycled. As a recovering technique, any of the followings is employed: a technique in which the exhaust gas is cooled and is recovered as a recovered content; a technique in which the exhaust gas is brought into contact with a solvent to dissolve the organometallic compound in the solvent; and a technique in which the exhaust gas is brought into contact with an adsorbent to thereby adsorb the organometallic compound.

Abstract: The present invention provides a process for producing bis(1,2-ethanediamine)gold chloride at high yield within a short reaction time and allows use of a safe solvent, as well as a gold-plating solution containing the gold chloride. Bis(1,2-ethanediamine)gold chloride can be produced at high yield through reaction of sodium chloroaurate and ethylenediamine anhydrate by use of a solvent. According to one characteristic feature of the process of the present invention, a safe solvent; i.e., at least one of acetonitrile, methanol, and ethanol, is used.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size utilizing an electrolyte bath comprising at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum; a hydroxylated alkali metal, 20-100 g/l; and a soluble carboxylate.

Abstract: The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.