Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: The substrate processing method includes a hydrophilization step of hydrophilizing a surface of a substrate, a processing liquid supplying step of supplying a processing liquid to the hydrophilized surface of the substrate, a processing film forming step in which the processing liquid supplied to the surface of the substrate is solidified or cured to form a processing film on the surface of the substrate, and a peeling step in which a peeling liquid is supplied to the surface of the substrate to peel the processing film from the surface of the substrate. The peeling step includes a penetrating hole forming step in which the processing film is partially dissolved in the peeling liquid to form a penetrating hole in the processing film.

Abstract: The substrate processing method includes a hydrophilization step of hydrophilizing a surface of a substrate, a processing liquid supplying step of supplying a processing liquid to the hydrophilized surface of the substrate, a processing film forming step in which the processing liquid supplied to the surface of the substrate is solidified or cured to form a processing film on the surface of the substrate, and a peeling step in which a peeling liquid is supplied to the surface of the substrate to peel the processing film from the surface of the substrate. The peeling step includes a penetrating hole forming step in which the processing film is partially dissolved in the peeling liquid to form a penetrating hole in the processing film.

Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: The substrate processing method includes a hydrophilization step of hydrophilizing a surface of a substrate, a processing liquid supplying step of supplying a processing liquid to the hydrophilized surface of the substrate, a processing film forming step in which the processing liquid supplied to the surface of the substrate is solidified or cured to form a processing film on the surface of the substrate, and a peeling step in which a peeling liquid is supplied to the surface of the substrate to peel the processing film from the surface of the substrate. The peeling step includes a penetrating hole forming step in which the processing film is partially dissolved in the peeling liquid to form a penetrating hole in the processing film.

Abstract: A gas treatment method includes an absorption step in which a gas to be treated containing an acidic compound, such as carbon dioxide, is brought into contact, in an absorber, with a treatment liquid that absorbs the acidic compound; and a regeneration step in which the treatment liquid, having the acidic compound absorbed therein, is sent to a regenerator, and the treatment liquid is then heated to separate the acidic compound from the treatment liquid. In the regeneration step, a gas almost insoluble to the treatment liquid, such as hydrogen gas, is brought into contact with the treatment liquid.

Abstract: The substrate processing method includes a hydrophilization step of hydrophilizing a surface of a substrate, a processing liquid supplying step of supplying a processing liquid to the hydrophilized surface of the substrate, a processing film forming step in which the processing liquid supplied to the surface of the substrate is solidified or cured to form a processing film on the surface of the substrate, and a peeling step in which a peeling liquid is supplied to the surface of the substrate to peel the processing film from the surface of the substrate. The peeling step includes a penetrating hole forming step in which the processing film is partially dissolved in the peeling liquid to form a penetrating hole in the processing film.

Abstract: A substrate processing method includes a preprocessing forming step of forming a preprocessing film on a surface of a substrate having the surface on which a first region and a second region in which different substances are exposed are present, a preprocessing film separating step of separating the preprocessing film from the surface of the substrate with a stripping liquid, a processing film forming step of forming a processing film on the surface of the substrate after the preprocessing film separating step, and a processing film separating step of separating the processing film from the surface of the substrate with the stripping liquid.

Abstract: A gas treatment method includes an absorption step in which a gas to be treated containing an acidic compound, such as carbon dioxide, is brought into contact, in an absorber, with a treatment liquid that absorbs the acidic compound; and a regeneration step in which the treatment liquid, having the acidic compound absorbed therein, is sent to a regenerator, and the treatment liquid is then heated to separate the acidic compound from the treatment liquid. In the regeneration step, a gas almost insoluble to the treatment liquid, such as hydrogen gas, is brought into contact with the treatment liquid.

Abstract: A gas treatment device uses a gas to be treated which contains an acid compound that dissolves into water to produce acid and a treatment liquid which absorbs the acid compound to phase-separate, to separate an acid compound from the gas to be treated. The gas treatment device includes an absorber which brings the gas to be treated into contact with the treatment liquid; a regenerator 14 which heats the treatment liquid contacting the gas to be treated to separate an acid compound; and a liquid feeding portion which feeds the treatment liquid contacting the gas to be treated in the absorber to the regenerator. In the absorber, the treatment liquid contacting the gas to be treated phase-separates into a first phase portion having a high acid compound content and a second phase portion having a low acid compound content. The liquid feeding portion is configured to introduce, into the regenerator, the treatment liquid with the phase-separated first phase portion and second phase portion mixed.

Abstract: A gas treatment device uses a gas to be treated which contains an acid compound that dissolves into water to produce acid and a treatment liquid which absorbs the acid compound to phase-separate, to separate an acid compound from the gas to be treated. The gas treatment device includes an absorber which brings the gas to be treated into contact with the treatment liquid; a regenerator 14 which heats the treatment liquid contacting the gas to be treated to separate an acid compound; and a liquid feeding portion which feeds the treatment liquid contacting the gas to be treated in the absorber to the regenerator. In the absorber, the treatment liquid contacting the gas to be treated phase-separates into a first phase portion having a high acid compound content and a second phase portion having a low acid compound content. The liquid feeding portion is configured to introduce, into the regenerator, the treatment liquid with the phase-separated first phase portion and second phase portion mixed.

Abstract: In order to stably operate a boiler using several kinds of solid fuels including depleted ash as fuels, adhesion of ash is suppressed. A calculator (9) preliminarily collects properties of a solid fuel, such as the content rate of ash and the composition of an ash constituent, as data (8). The calculator (9) uses the mix ratio of solid fuels as a parameter and calculates the composition of an ash constituent of the mixed fuels on the basis of the preliminarily measured composition of the ash constituent of each solid fuel. The calculator (9) determines a reference value of the rate of slug by which the ash deposition ratio is reduced on the basis of the relationship between the preliminarily measured ash deposition ratio and the slag ratio. Further, the calculator (9) calculates the mix ratio of each solid fuel using a thermodynamic equilibrium calculation so as to obtain an ash composition in which the slag ratio is not more than the determined reference value.

Abstract: This method for removing nitrogen oxides brings exhaust gas containing oxygen and at least one nitrogen oxide selected from the group consisting of nitrogen monoxide and nitrogen dioxide into contact with ammonia without the presence of a catalyst, for at least 0.5 seconds under a temperature of no less than 900 DEG C., and breaks down the nitrogen oxide. According to this method, it is possible to remove nitrogen oxides in a highly efficient manner and significantly reduce the amount of unreacted ammonia.

Abstract: This method for removing nitrogen oxides brings exhaust gas containing oxygen and at least one nitrogen oxide selected from the group consisting of nitrogen monoxide and nitrogen dioxide into contact with ammonia without the presence of a catalyst, for at least 0.5 seconds under a temperature of no less than 900 DEG C., and breaks down the nitrogen oxide. According to this method, it is possible to remove nitrogen oxides in a highly efficient manner and significantly reduce the amount of unreacted ammonia.

Abstract: A device for reducing ash adhesion in a boiler, includes: a calculator (9) which, in the case of mixing one or more types of solid fuels, calculates and determines the mixing ratio of the solid fuels so that the resultant solid fuel mixture has a slag viscosity not lower than a reference value at a predetermined atmospheric temperature; and fuel supply amount regulators (3a, 3b) which regulate the amount of the solid fuels to be supplied to the boiler based on the mixing ratio as described above. By using this device, ash adhesion in a boiler can be easily and accurately predicted and, therefore, ash adhesion can be reduced even in the case of using various types of solid fuels including a low-grade coal as fuel.

Abstract: In order to stably operate a boiler using several kinds of solid fuels including depleted ash as fuels, adhesion of ash is suppressed. A calculator (9) preliminarily collects properties of a solid fuel, such as the content rate of ash and the composition of an ash constituent, as data (8). The calculator (9) uses the mix ratio of solid fuels as a parameter and calculates the composition of an ash constituent of the mixed fuels on the basis of the preliminarily measured composition of the ash constituent of each solid fuel. The calculator (9) determines a reference value of the rate of slug by which the ash deposition ratio is reduced on the basis of the relationship between the preliminarily measured ash deposition ratio and the slag ratio. Further, the calculator (9) calculates the mix ratio of each solid fuel using a thermodynamic equilibrium calculation so as to obtain an ash composition in which the slag ratio is not more than the determined reference value.

Abstract: A melt treatment apparatus is provided which obviates an increase in floorspace and in cost and has freedom from a danger of steam explosion and further can control melt discharging with reliability.The welt treatment apparatus 1 is constructed with a furnace body 8 for entry of a material 17 to be heated, a plasma torch 2 that generates a plasma arc 13 so as to melt the material, a melt discharge passage 3 arranged in the furnace body for discharging a hot melt 14 derived by melting the material with the use of the plasma torch, and cooling gas jet means 7 disposed in the melt discharge passage and jetting a cooling gas to cool the hot melt to thereby form a dam 12.