Patents by Inventor Katsuya Baba
Katsuya Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140227435Abstract: A method of protecting a transparent nonmetallic electroconductive part formed by, e.g., ITO, on a transparent substrate, e.g., a glass substrate, from electrochemical corrosion, is characterized by coating the transparent nonmetallic electroconductive part with a room-temperature-curable silicone rubber composition that contains from 1 weight-ppm to 30 weight % of a triazole compound, e.g., a 1,2,4-triazole compound or a benzotriazole compound; and thereafter curing the composition.Type: ApplicationFiled: May 11, 2012Publication date: August 14, 2014Applicant: Dow Corning Toray Co., Ltd.Inventors: Katsuya Baba, Masayuki Onishi
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Publication number: 20100239860Abstract: A heat-curable silicone rubber composition that includes a curing agent which is characterized by having a total acid value not exceeding 1.0 mg KOH/g and comprising a mixture of a diorganopolysiloxane with bis(4-methylbenzoyl)peroxide produced from 4-methylbenzoyl chloride of 99.7% or higher purity used as a starting material. Aforementioned silicone rubber composition can provide silicone rubber products having a favorable electrical insulation properties and being free of formation of surface defects such voids and agglomerated particles in the form of white spots.Type: ApplicationFiled: March 28, 2007Publication date: September 23, 2010Applicant: DOW CORNING TORY CO., LTD.Inventors: Chiichiro Hasegawa, Katsuya Baba
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Publication number: 20040259965Abstract: An electroconductive silicone rubber sponge composition comprising: 100 parts by weight of a polyorganosiloxane, 1 to 100 parts by weight of all electroconductive filler such as carbon black, 0.01 to 50 parts by weight of a hollow thermoplastic resin powder, 0.1 to 10 parts by weight of a liquid compound that has a boiling point above room temperature, preferably water or an alcohol and a curing agent in an amount sufficient to cure the composition. An optional reinforcing filler may be added. The composition is capable of forming an electroconductive silicone rubber sponge having uniform and microfine foam cells.Type: ApplicationFiled: March 2, 2004Publication date: December 23, 2004Inventors: Kazuo Higuchi, Hiroshi Honma, Katsuya Baba, Akito Nakamura
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Publication number: 20020077440Abstract: An extrudable silicone rubber composition comprising a silicone rubber base compound comprising a diorganopolysiloxane gum, a treated or untreated reinforcing silica, an organic peroxide represented by the following general formula R—COOOCOO—R1—OOCOOOC—R and a alkyl-type organic peroxide. The composition provides an extrudable silicone rubber composition suitable for rapid curing, the resulting extruded articles are substantially free from of blooming and surface tackiness.Type: ApplicationFiled: October 25, 2001Publication date: June 20, 2002Inventors: Katsuya Baba, Kazuo Hirai, Hiroshi Honma
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Patent number: 6365640Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.Type: GrantFiled: May 23, 2001Date of Patent: April 2, 2002Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Manabu Suto, Hiroshi Honma, Akito Nakamura
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Patent number: 6346556Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for production thereof. The silicone rubber sponge composition comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity at 25° C. of 1,000,000 mPa·s or above, (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.01 to 10 parts by weight a water-in-oil emulsion with silicone oil an oil phase, and (E) a curing agent in an amount sufficient to cure the composition.Type: GrantFiled: April 5, 2001Date of Patent: February 12, 2002Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Manabu Suto, Akito Nakamura
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Publication number: 20020016412Abstract: A silicone rubber composition for extrusion molding applications having a high cure rate and providing silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to limited extent. The silicone rubber composition includes (A) 100 weight parts of a silicone rubber base compound containing (a-1) a diorganopolysiloxane gum, (a-2) reinforcing silica, and (a-3)a silanol-endblocked organosiloxane oligomer or hexaorganodisilazane; and (B) 0.1 to 10 weight parts of an organoperoxide with the formula R—COOOCOO—R1—OOCOOOC—R where R is an alkyl group, an alkoxy group, the group —SiR23, the group —CH2SiR23, or the group -Ph-R3c where R2 is an alkyl or alkoxy group, Ph is phenyl when c is 0, and phenylene when c is 1, 2 or 3, R3 is an alkyl group, an alkoxy group, the group —SiR23, or the group —CH2SiR23; c is 0 to 3, and R1 is a C1 to C10 alkylene group.Type: ApplicationFiled: April 18, 2001Publication date: February 7, 2002Inventors: Kazuo Hirai, Katsuya Baba, Hiroshi Honma
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Publication number: 20010056168Abstract: A silicone rubber composition for extrusion molding applications has a high cure rate and provides silicone rubber extrusion moldings that post-cure and are either free of bubbles or contain bubbles to an extremely limited extent. It contains (A) an organopolysiloxane gum, (B) reinforcing silica, (C) diatomaceous earth powder or quartz powder, and (D) an organoperoxide with the formula R-COOOCOO-R1-OOCOOOC-R, wherein R is a group selected from alkyl, alkoxy, —SiR23, —CH2SiR23, and -Ph-R3c (R2 is alkyl or alkoxy; Ph is phenyl when c is 0, and phenylene when c is 1,2 or 3; R3 is alkyl, alkoxy, SiR23, or —CH2SiR23; and c is 0 to 3) and R1 is C1 to C10 alkylene. A method is described for fabricating silicone rubber extrusion moldings by curing the silicone rubber composition in a hot gas.Type: ApplicationFiled: April 18, 2001Publication date: December 27, 2001Inventors: Hiroshi Honma, Kazuo Hirai, Katsuya Baba
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Publication number: 20010044478Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for production thereof. The silicone rubber sponge composition comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity at 25° C. of 1,000,000 mPa·s or above, (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.01 to 10 parts by weight a water-in-oil emulsion with silicone oil an oil phase, and (E) a curing agent in an amount sufficient to cure the composition.Type: ApplicationFiled: April 5, 2001Publication date: November 22, 2001Inventors: Katsuya Baba, Manabu Suto, Akito Nakamura
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Publication number: 20010044479Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.Type: ApplicationFiled: May 23, 2001Publication date: November 22, 2001Inventors: Katsuya Baba, Manabu Suto, Hiroshi Honma, Akito Nakamura
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Patent number: 6300383Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making the silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity of 1,000,000 mPa·s or above at 25° C., (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.1 to 10 parts by weight liquid compound with a boiling point above room temperature, and (E) a curing agent in an amount sufficient to cure the composition.Type: GrantFiled: March 29, 2001Date of Patent: October 9, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Hiroshi Honma, Akito Nakamura
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Patent number: 6300382Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.Type: GrantFiled: March 6, 2001Date of Patent: October 9, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Manabu Suto, Hiroshi Honma, Akito Nakamura
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Patent number: 6300384Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for production thereof. The silicone rubber sponge composition, comprises (A) 100 parts by weight organopolysiloxane gum described by average structural unit RaSiO(4−a)/2, where R is a monovalent hydrocarbon group or haloalkyl and a is 1.8 to 2.3 and having a viscosity at 25° C. of 1,000,000 mPa·s or above, (B) 1 to 400 parts by weight inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles, (D) 0.1 to 10 parts by weight thermally decomposable blowing agent, and (E) a curing agent in an amount sufficient to cure the composition.Type: GrantFiled: April 4, 2001Date of Patent: October 9, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Hiroshi Honma, Akito Nakamura
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Publication number: 20010027222Abstract: A silicone rubber sponge composition, a silicone rubber sponge, and a process for making a silicone rubber sponge. The silicone rubber sponge composition comprises (A) 100 parts by weight of an organopolysiloxane gum described by average structural unit RaSiO(4-a)/2, where R is a monovalent hydrocarbon radical or haloalkyl and a is 1.95 to 2.05, (B) 1 to 400 parts by weight of an inorganic filler, (C) 0.01 to 50 parts by weight hollow thermoplastic resin particles (D) a mixture of (a) water-soluble silicone and (b) water in an amount such that the water in the mixture is equivalent to 0.01 to 10 parts by weight per 100 parts by weight of component (A), and (E) a curing agent in an amount sufficient to cure the composition.Type: ApplicationFiled: March 6, 2001Publication date: October 4, 2001Inventors: Katsuya Baba, Manabu Suto, Hiroshi Honma, Akito Nakamura
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Patent number: 6294636Abstract: A silicone rubber composition, comprising: (A) an polyorganosiloxane gum represented by the following average structural formula: RaSiO(4−a)/2 (where R is a substituted or non-substituted monovalent hydrocarbon, and a is a number between 1.8 and 2.3); (B) microparticulate silica; and (C) a methyl-substituted benzoyl peroxide having the maximum grain diameter not exceeding 50 &mgr;m and an average grain diameter of 30 &mgr;m. When cured, the silicone rubber composition has reduced nonuniformity in the physical properties because of fewer voids, resulting in decreased frequency of spark-outs in the insulated wires.Type: GrantFiled: February 26, 1999Date of Patent: September 25, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Kazuo Hirai, Takao Matsushita
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Patent number: 6264865Abstract: A silicone rubber base compound for electrical wire coating such that when it is extruded using an extruding machine having a variable screw with an L/D=10 and a die with a diameter of 1 mm attached thereto at a barrel and head temperature of 70° C., the per-minute extruder output rate at a screw rotation speed of 100 rpm is not less than 1.2 times the extruder output rate at a screw rotation speed of 50 rpm, a silicone rubber composition for electrical wire coating obtained by compounding diacyl organic peroxide consisting of carbon atoms, hydrogen atoms, and oxygen atoms with the silicone rubber base compound for electrical wire coating, and a process for the production of silicone rubber coated electrical wire using the silicone rubber composition for electrical wire coating.Type: GrantFiled: November 30, 1999Date of Patent: July 24, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Katsuya Baba, Kenji Ota
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Patent number: 5973058Abstract: A silicone rubber composition that does not foam or evolve an unpleasant odor during its cure and that cures into low-surface-tack, non-yellowing silicone rubber moldings comprises:(A) polydiorganosiloxane gum with the average component formula R.sub.a SiO.sub.(4-a)/2 where R represents substituted and unsubstituted monovalent hydrocarbon groups and a is from 1.9 to 2.1,(B) microparticulate silica,(C) bis(ortho-methylbenzoyl)peroxide, and(D) bis(para-methylbenzoyl)peroxide,wherein the component (C) to component (D) weight ratio is from 1:9 to 8:2.Type: GrantFiled: October 28, 1997Date of Patent: October 26, 1999Assignee: Dow Corning Toray Silicone Co., LTD.Inventors: Katsuya Baba, Kazuo Hirai, Takao Matsushita
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Patent number: 5849272Abstract: The ultraviolet absorbing composition in accordance with the present invention comprises the following ingredients (A) and (B):(A) 4-tert-butyl-4'-methoxydibenzoylmethane; and(B) a diester which is liquid at 20.degree. C. and has a structure represented by the following general formula (1):R.sub.1 OOC--(CH.sub.2)n--COOR.sub.2 (1)wherein each of R.sub.1 and R.sub.2 is an alkyl group, an alkenyl group, a hydroxyalkyl group, or a hydroxyalkenyl group each having 1 to 19 carbon atoms, and n is an integer of 0 to 6. In the present invention, crystals of (A) are prevented from depositing by using a diester of (B) togetherwith and an ultraviolet absorbing composition in which (A) can be stably compounded in a high concentration and which exhibits excellent feel of use and safety can be obtained thereby.Type: GrantFiled: February 25, 1997Date of Patent: December 15, 1998Assignee: Shiseido Co., Ltd.Inventors: Katsuya Baba, Toshihito Yabu, Shoji Nishiyama, Kenzo Ito
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Patent number: 5519080Abstract: An insulator includes a housing portion. The housing portion is composed a silicone rubber obtained by curing a composition containing diorganopolysiloxane (A) and a fine silicon powder (B) by heating, and a methylalkylpolysiloxane oil (C). The diorganopolysiloxane has at least two silicon atom-bonded alkenyl groups in one molecule. The methylalkyl-polysiloxane oil (C) has each of both terminal ends of each molecular chain blocked with a trialkysiloxy group and possessing a viscosity at 25.degree. C. being 1 to 1,000 centistokes, and is incorporated into the above composition in an amount of 1-100 parts by weight per 100 parts by weight of the component (A).Type: GrantFiled: August 10, 1994Date of Patent: May 21, 1996Assignees: Dow Corning Toray Silicone Co., Ltd., NGK Insulators Ltd.Inventors: Takao Matsushita, Katsuya Baba, Kazuo Hirai, Isao Nakajima, Takayuki Takeda