Abstract: Suppliable power per unit time from a secondary battery (4) to a DC communication device load (3) during an output suppression time zone (TS) is stored in a memory (2B) as a threshold (W1). A current power consumption (W2) of the DC communication device load (3) is measured. An output control unit (2D) is provided with a function of, during the output suppression time zone (TS), comparing the current power consumption (W2) of the DC communication device load (3) with the threshold (W1) in the memory (2B), if W2?W1, stopping power supply from a rectifying unit (2-1) to the DC communication device load (3) and covering the power consumption (W2) only by power accumulated in the secondary battery (4), and if W2>W1, covering the power consumption up to the threshold (W1) by the power accumulated in the secondary battery (4) and covering the power consumption more than the threshold (W1) by power from the rectifying unit (2-1).

Abstract: The present invention has an object of providing an electronic apparatus storing container capable of facilitating mounting of an electronic apparatus and having improved productivity. The electronic apparatus storing container according to the present invention includes: a base including an electronic apparatus mounting area of a planar shape in which an electronic apparatus is mountable, and a packing groove formed in an outer peripheral portion of the electronic apparatus mounting area; a waterproof packing fit in a corresponding manner in the packing groove; and a case joined with the base with the waterproof packing sandwiched therebetween, the case storing the electronic apparatus mounted in the electronic apparatus mounting area. This improves the productivity of the electronic apparatus storing container.

Abstract: This method for assaying copper in silicon wafers includes the steps of: forming a polysilicon layer on the surface of a p-type silicon wafer having the same characteristics as the silicon wafers being assayed; heat treating the p-type silicon wafer after it has been polished; dissolving the polysilicon layer on the heat-treated p-type silicon wafer with a mixed acid composed of at least hydrofluoric acid and nitric acid; and quantitatively determining the copper components within the mixed acid following dissolution of the polysilicon layer.

Abstract: A wafer etching and impurity analysis method is presented in which a wafer is held in a vessel having gas introduction and exhaust ports, a solution including a mixture of hydrofluoric acid and nitric acid alone or together with sulfuric acid is bubbled with a carrier gas without being heated, which generates a gas containing vaporized hydrofluoric acid and nitric acid, and the inside of the vessel is purged so that the amount of gas supplied is kept constant at all times. All or a specific portion of the wafer is cooled to a specific temperature. Consequently, the gas is condensed on the surface of the wafer, which allows the required portion of the wafer to be etched. The method reduces the amount of liquid needed for residue recovery, the amount of admixed silicon during impurity analysis, and the concentration time.

Abstract: A therapeutic agent for subarachnoid hemorrhage or a drug for improving prognosis of subarachnoid hemorrhage, comprising a compound having a PAR1 inhibitory effect, its pharmaceutically acceptable salt or a hydrate thereof

Abstract: A cooling apparatus is disclosed for cooling and dehumidifying the inside of a device such as an electronic device installed outdoors The cooling apparatus of the invention comprises a set of dehumidifying parts, each arranged at an open air intake side and an air exhaust side of a housing of the device respectively, and having filtering members for removing humidity from the open air. When air in the housing is saturated with humidity by air blowing from a fan, the rotational direction of the fan is reversed to thereby change the air flowing direction towards the dehumidification part. A dehumidification material thus receives heated and dried exhaust-air from a heating material and discharges moisture accumulated within the material to the outside, thereby recovering moisture absorption capability of the dehumidification material.

Abstract: A therapeutic agent for subarachnoid hemorrhage or a drug for improving prognosis of subarachnoid hemorrhage, comprising a compound having a PAR1 inhibitory effect, its pharmaceutically acceptable salt or a hydrate thereof.

Abstract: A wafer etching and impurity analysis method is presented in which a wafer is held in a vessel having gas introduction and exhaust ports, a solution including a mixture of hydrofluoric acid and nitric acid alone or together with sulfuric acid is bubbled with a carrier gas without being heated, which generates a gas containing vaporized hydrofluoric acid and nitric acid, and the inside of the vessel is purged so that the amount of gas supplied is kept constant at all times. All or a specific portion of the wafer is cooled to a specific temperature. Consequently, the gas is condensed on the surface of the wafer, which allows the required portion of the wafer to be etched. The method reduces the amount of liquid needed for residue recovery, the amount of admixed silicon during impurity analysis, and the concentration time.

Abstract: This method for assaying copper in silicon wafers includes the steps of: forming a polysilicon layer on the surface of a p-type silicon wafer having the same characteristics as the silicon wafers being assayed; heat treating the p-type silicon wafer after it has been polished; dissolving the polysilicon layer on the heat-treated p-type silicon wafer with a mixed acid composed of at least hydrofluoric acid and nitric acid; and quantitatively determining the copper components within the mixed acid following dissolution of the polysilicon layer.

Abstract: A cooling apparatus is disclosed for cooling and dehumidifying the inside of a device such as an electronic device installed outdoors The cooling apparatus of the invention comprises a set of dehumidifying parts, each arranged at an open air intake side and an air exhaust side of a housing of the device respectively, and having filtering members for removing humidity from the open air. When air in the housing is saturated with humidity by air blowing from a fan, the rotational direction of the fan is reversed to thereby change the air flowing direction towards the dehumidification part. A dehumidification material thus receives heated and dried exhaust-air from a heating material and discharges moisture accumulated within the material to the outside, thereby recovering moisture absorption capability of the dehumidification material.

Abstract: At access from the orderer terminal, an order support server sends to the orderer terminal an order input form to order a concealing item to conceal a radio base station of cellulars. Upon receipt of order information from the orderer terminal, the information including the order input form containing at least orderer information, environmental conditions regarding a radio base station of cellular phones and an item name of the radio base station, and image data being attached thereto and showing an installation state of the radio base station, the order support server selects a designing maker according to the item name of the radio base station in the order information. The order support server then transmits the order information to the order receiver terminal of the designing maker thus selected. Therefore, the business area manager can easily order a concealing item of a radio base station of cellular phones.

Abstract: A wafer etching and impurity analysis method is presented where a wafer is held in a vessel having gas introduction and exhaust ports, a solution including a mixture of hydrofluoric acid and nitric acid alone or together with sulfuric acid is bubbled with a carrier gas without being heated, which generates a gas containing vaporized hydrofluoric acid and nitric acid, and the inside of the vessel is purged so that the amount of gas supplied is kept constant at all times. The molar ratio of the hydrofluoric acid and nitric acid (and sulfuric acid if used) in the solution is set to a specific value. The amount of gas introduced is specified. All or a specific portion of the wafer is cooled to a specific temperature between 0 and 20° C. Consequently, the gas is condensed on the surface of the wafer, which allows the required portion of the wafer to be etched and the amount of required in-plane etching to be uniform.

Abstract: A hermetic enclosure having an air pressure adjustable function, which can adjust inside air pressure of the hermetic enclosure, is provided. In order to prevent devices in the hermetic enclosure from corroding, the hermetic enclosure having an air pressure adjustable function provides a main body having a clearance part and a packing fixing groove, a door, and packing that is fixed to the packing fixing groove of the main body. And the door is jointed with the main body by placing the packing between the door and the main body in a state that the door is able to slide on the packing. And when inside and outside air pressure of the hermetic enclosure becomes different, the door moves on the packing and the clearance part of the main body is changed, and the inside and outside air pressure is adjusted to be almost equal.

Abstract: A hermetic enclosure having an air pressure adjustable function, which can adjust inside air pressure of the hermetic enclosure, is provided. In order to prevent devices in the hermetic enclosure from corroding, the hermetic enclosure having an air pressure adjustable function provides a main body having a clearance part and a packing fixing groove, a door, and packing that is fixed to the packing fixing groove of the main body. And the door is jointed with the main body by placing the packing between the door and the main body in a state that the door is able to slide on the packing. And when inside and outside air pressure of the hermetic enclosure becomes different, the door moves on the packing and the clearance part of the main body is changed, and the inside and outside air pressure is adjusted to be almost equal.