Abstract: A wafer for a magnetic head includes a magnetic pole which has a design capable of avoiding pole missing due to processing with an improved resistance to the processing during a magnetic pole forming process. Each magnetic head element provided in the wafer has a recording magnetic pole film. The magnetic pole film has a large width part, a small width part and a support part. The small width part projects continuously from the large width part and extends with a constant width W1, while the support part is continuous with an end of the small width part and has a width W2. The width W1 and the width W2 satisfy the relationship of 1<W2/W1<2.

Abstract: A wafer for a magnetic head includes a magnetic pole which has a design capable of avoiding pole missing due to processing with an improved resistance to the processing during a magnetic pole forming process. Each magnetic head element provided in the wafer has a recording magnetic pole film. The magnetic pole film has a large width part, a small width part and a support part. The small width part projects continuously from the large width part and extends with a constant width W1, while the support part is continuous with an end of the small width part and has a width W2. The width W1 and the width W2 satisfy the relationship of 1<W2/W1<2.

Abstract: A thin film magnetic head has a plurality of electrode terminals formed on substantially the same surface as the head formation surface on which magnetic head element is laminated. The plurality of electrode terminals is arranged in an array near and along the second side of the head formation surface that is opposite the first side on the ABS side, from which the functional end of the magnetic head is exposed. The plurality of electrode terminals is formed to include a pad and a protrusion formed along a part of the periphery of the pad.

Abstract: A thin film magnetic head has a plurality of electrode terminals formed on substantially the same surface as the head formation surface on which magnetic head element is laminated. The plurality of electrode terminals is arranged in an array near and along the second side of the head formation surface that is opposite the first side on the ABS side, from which the functional end of the magnetic head is exposed. The plurality of electrode terminals is formed to include a pad and a protrusion formed along a part of the periphery of the pad.

Abstract: To provide a packet transfer apparatus capable of making a competition problem among entries avoidable, reducing entry management costs and improving entry setting processing ability. If an IP packet is inputted, a search process circuit sends packet search information and performs a search of a CAM of a packet search table. In the search of the CAM of the packet search table, a registration position of the entry that was hit is outputted. Address information of each table in which transfer information is set is obtained from a transfer information address table, and the transfer information is read from a policer information table, an application transfer information table, an in-system common transfer information table and an output information table based on the address information respectively.

Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.

Abstract: A first magnetic film is formed in a primary pattern which is larger than its definitive pattern and of which edges are located within frames to be used in a frame-plating method for the second magnetic film after forming the first pole portion and the gap film. Then, the second magnetic film is formed by the frame-plating method, and the first magnetic film is etched into the definitive pattern through the second magnetic film as a mask.

Abstract: A method of manufacturing a thin-film magnetic head allowing dimension control of the width of the magnetic pole and reduction of the time required for formation is provided. A layer of iron nitride formed by sputtering is selectively etched with the RIE to form a top pole tip. In this etching process with RIE, chlorine-type gas is selected as a gas seed for etching, and the process temperature is in a range of 50° C. to 300° C. Subsequently, using part of a first mask and a tip portion of the top pole tip as a mask, part of both the write gap layer and the second bottom pole are etched with the RIE similarly to the above process, to thereby form a magnetic pole. The etching conditions are optimized by performing the process with the RIE under the above conditions, so that both of the top pole tip and the magnetic pole can be formed with high precision, and that the time required for forming both of these elements can be significantly reduced.

Abstract: A first magnetic film is formed in a primary pattern which is larger than its definitive pattern and of which edges are located within frames to be used in a frame-plating method for the second magnetic film after forming the first pole portion and the gap film. Then, the second magnetic film is formed by the frame-plating method, and the first magnetic film is etched into the definitive pattern through the second magnetic film as a mask.

Abstract: A method of manufacturing a thin-film magnetic head allowing dimension control of the width of the magnetic pole and reduction of the time required for formation is provided. A layer of iron nitride formed by sputtering is selectively etched with the RIE to form a top pole tip. In this etching process with RIE, chlorine-type gas is selected as a gas seed for etching, and the process temperature is in a range of 50° C. to 300° C. Subsequently, using part of a first mask and a tip portion of the top pole tip as a mask, part of both the write gap layer and the second bottom pole are etched with the RIE similarly to the above process, to thereby form a magnetic pole. The etching conditions are optimized by performing the process with the RIE under the above conditions, so that both of the top pole tip and the magnetic pole can be formed with high precision, and that the time required for forming both of these elements can be significantly reduced.

Abstract: The invention is a method of manufacturing thin film magnetic heads usable for magnetic recording and reproducing drive devices such as magnetic disk drive devices. The method is characterized by forming a first magnetic film in a primary pattern which is larger than its definitive pattern and of which its edges are located within frames which are used in a frame-plating method for a second magnetic film. The second magnetic film is then formed by the frame-plating method and the first magnetic film is etched into its definitive pattern by using the second magnetic film as a mask.

Abstract: A method of manufacturing a thin-film magnetic head allowing dimension control of the width of the magnetic pole and reduction of the time required for formation is provided. A layer of iron nitride formed by sputtering is selectively etched with the RIE to form a top pole tip. In this etching process with RIE, chlorine-type gas is selected as a gas seed for etching, and the process temperature is in a range of 50° C. to 300° C. Subsequently, using part of a first mask and a tip portion of the top pole tip as a mask, part of both the write gap layer and the second bottom pole are etched with the RIE similarly to the above process, to thereby form a magnetic pole. The etching conditions are optimized by performing the process with the RIE under the above conditions, so that both of the top pole tip and the magnetic pole can be formed with high precision, and that the time required for forming both of these elements can be significantly reduced.

Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.

Abstract: To provide a label switching network in which the network resources and the operation cost can be reduced, and the scalability problem to a large scale network can be solved.

Abstract: The invention provides a thin film magnetic head including a first pole portion having depressed portion that is formed therein. The depressed portion descends, backward within the first pole portion, at a first inclination angle &thgr;1 from a first inclination starting point P1. Then, an insulating film is filled up in the depressed portion so that it can be located up to the upper side of the surface of the first pole and have an inclined surface in the side of a medium opposing surface. Additionally, a first magnetic film of a second pole portion can have a larger saturated magnetic flux density than a second magnetic film of the second pole portion, and can include an inclined portion with a second inclination angle &thgr;2 from a second inclination starting point P2.

Abstract: To provide a packet transfer apparatus capable of making a competition problem among entries avoidable, reducing entry management costs and improving entry setting processing ability. If an IP packet is inputted, a search process circuit sends packet search information and performs a search of a CAM of a packet search table. In the search of the CAM of the packet search table, a registration position of the entry that was hit is outputted. Address information of each table in which transfer information is set is obtained from a transfer information address table, and the transfer information is read from a policer information table, an application transfer information table, an in-system common transfer information table and an output information table based on the address information respectively.

Abstract: A first magnetic film to constitute a first yoke part and a first pole part is formed in a given pattern on a substrate, and a write gap film is formed on the part corresponding to the first pole portion of the first magnetic film. Then, a second magnetic film having a second pole portion and a second yoke part is formed on the write gap film by a photolithography so that the second pole portion can have a width of 1.5-2.5 &mgr;m. Thereafter, the sides of the second pole portion are etched by an ion beam etching method to narrow its width, and the write gap film is removed by using, as a mask, the second pole portion to expose the first magnetic film. Subsequently, the exposed first magnetic film is partially removed to form the first pole portion and thereby a thin film magnetic head having a pole portion with a track width of not more than 1 &mgr;m beyond the limit of the photolithography is produced.

Abstract: A method of manufacturing a thin-film magnetic head allowing dimension control of the width of the magnetic pole and reduction of the time required for formation is provided. A layer of iron nitride formed by sputtering is selectively etched with the RIE to form a top pole tip. In this etching process with RIE, chlorine-type gas is selected as a gas seed for etching, and the process temperature is in a range of 50° C. to 300° C. Subsequently, using part of a first mask and a tip portion of the top pole tip as a mask, part of both the write gap layer and the second bottom pole are etched with the RIE similarly to the above process, to thereby form a magnetic pole. The etching conditions are optimized by performing the process with the RIE under the above conditions, so that both of the top pole tip and the magnetic pole can be formed with high precision, and that the time required for forming both of these elements can be significantly reduced.