Patents by Inventor Katsuya Komuro

Katsuya Komuro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator
    Patent number: 5399906
    Abstract: A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced labor. A coupling dielectric substrate bearing conducting films as a circuit pattern is joined to a main dielectric substrate mounted on a heat radiating plate and bearing elements for high frequency amplification to a heat sink. The coupling dielectric substrate should have the same circuit constants at the high-frequency circuit as the main dielectric substrate.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: March 21, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Katsuya Komuro