Patents by Inventor Katsuya NAKAZAWA
Katsuya NAKAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230268712Abstract: A method of manufacturing a semiconductor device includes: preparing a bottom plate having an upper surface and a lower surface, wherein the lower surface of the bottom plate comprises a reference part and one or more inclined surfaces that are inclined with respect to the reference part, an upper portion of the one or more inclined surfaces being positioned above the reference part, and wherein a thickness of the bottom plate at the reference part is greater than a thickness of the bottom plate at the upper portion of the one or more inclined surfaces; joining a frame member to the bottom plate, at least a part of the frame member being disposed directly above the one or more inclined surfaces, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the bottom plate.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 11677211Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.Type: GrantFiled: October 5, 2020Date of Patent: June 13, 2023Assignees: NICHIA CORPORATION, SHINIKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Publication number: 20230154818Abstract: A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the eyelet in a plan view. The metal base is spaced apart from the lead. The lead, located at a position overlapping the eyelet in the plan view, is disposed within a thickness range of the metal base in a side view.Type: ApplicationFiled: November 8, 2022Publication date: May 18, 2023Inventor: Katsuya NAKAZAWA
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Publication number: 20210021097Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.Type: ApplicationFiled: October 5, 2020Publication date: January 21, 2021Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 10833473Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.Type: GrantFiled: March 26, 2019Date of Patent: November 10, 2020Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 10522969Abstract: A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.Type: GrantFiled: October 18, 2018Date of Patent: December 31, 2019Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Kazuma Kozuru, Eiichiro Okahisa, Katsuya Nakazawa, Makoto Kubota
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Publication number: 20190305511Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.Type: ApplicationFiled: March 26, 2019Publication date: October 3, 2019Applicants: NICHIA CORPORATION, SHINKO ELECTONIC INDUSTRIES CO., LTD.Inventors: Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara, Suguru Kobayashi, Kazuhito Yumoto
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Patent number: 10404033Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: GrantFiled: April 30, 2018Date of Patent: September 3, 2019Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru Matsushita, Katsuya Nakazawa, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20190123509Abstract: A light-emitting device includes: a package body; a lid body connected to the package body, wherein the package body and the lid body together form a sealed space; and a plurality of light-emitting elements disposed in the sealed space. The lid body includes: a non-transmissive member including an outer frame, and one or more inner frames connected to the outer frame, wherein the outer frame and the one or more inner frames define a plurality of openings, a transmissive member integrally covering the plurality of openings and configured to allow light emitted from the plurality of light-emitting elements to be transmitted through the plurality of openings, and an adhesive member fixing the transmissive member to the non-transmissive member. The adhesive member is located on the outer frame and is not located on the one or more inner frames.Type: ApplicationFiled: October 18, 2018Publication date: April 25, 2019Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takuya HASHIMOTO, Kazuma KOZURU, Eiichiro OKAHISA, Katsuya NAKAZAWA, Makoto KUBOTA
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Patent number: 10164403Abstract: A cap member comprises a cylindrical part, an annular top plate part having an opening formed at a central portion thereof and being configured to cover one end of the cylindrical part, a window glass disposed inside the cylindrical part, and an adhesion member configured to adhere the top plate part and the window glass each other. The top plate part is depressed so that an opening end of the opening enters an inside of the cylindrical part, and an inner surface of the top plate part is configured as a flat inclined surface from a coupling part between the cylindrical part and the top plate part to the opening end.Type: GrantFiled: December 13, 2017Date of Patent: December 25, 2018Assignee: Shinko Electric Industries Co., Ltd.Inventor: Katsuya Nakazawa
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Publication number: 20180254604Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: ApplicationFiled: April 30, 2018Publication date: September 6, 2018Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru MATSUSHITA, Katsuya NAKAZAWA, Eiichiro OKAHISA, Kazuma KOZURU
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Publication number: 20180175584Abstract: A cap member comprises a cylindrical part, an annular top plate part having an opening formed at a central portion thereof and being configured to cover one end of the cylindrical part, a window glass disposed inside the cylindrical part, and an adhesion member configured to adhere the top plate part and the window glass each other. The top plate part is depressed so that an opening end of the opening enters an inside of the cylindrical part, and an inner surface of the top plate part is configured as a flat inclined surface from a coupling part between the cylindrical part and the top plate part to the opening end.Type: ApplicationFiled: December 13, 2017Publication date: June 21, 2018Inventor: Katsuya Nakazawa
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Patent number: 9985411Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: GrantFiled: May 17, 2017Date of Patent: May 29, 2018Assignees: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru Matsushita, Katsuya Nakazawa, Eiichiro Okahisa, Kazuma Kozuru
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Publication number: 20170338628Abstract: A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.Type: ApplicationFiled: May 17, 2017Publication date: November 23, 2017Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeru MATSUSHITA, Katsuya NAKAZAWA, Eiichiro OKAHISA, Kazuma KOZURU