Abstract: A non-aqueous electrolyte rechargeable battery includes a positive electrode, a negative electrode, and a non-aqueous electrolyte. The negative electrode has a sodium concentration of greater than 532 ppm and less than 71100 ppm. The non-aqueous electrolyte rechargeable battery includes a LiBOB equivalent. The LiBOB equivalent is lithium bis(oxalato)borate in the non-aqueous electrolyte or a substance formed when the lithium bis(oxalato)borate reacts with another substance. The non-aqueous electrolyte has a hypothetical concentration of the LiBOB equivalent of 0.35 wt % or greater and 0.56 wt % or less when an amount of the LiBOB equivalent is converted into a weight of the lithium bis(oxalato)borate.

Abstract: The present invention provides a transceiver apparatus that permits miniaturization even when the antenna thereof is an unbalanced circuit and the transmitter circuit section and receiver circuit section thereof are balanced circuits. The transceiver apparatus is constituted comprising: a semiconductor integrated circuit device that mounts on the same semiconductor chip a balanced receiver circuit 41 for receiving a received signal as a differential input and balanced transmitter circuit 52 for outputting a transmitted signal as a differential output, and that has at least two terminals 71,72 connected to connecting nodes that connect the balanced receiver circuit 41 and the balanced transmitter circuit 52; first and second capacitors C2,C3 connected to the terminals 71, 72 respectively; an external inductor L1 connected to the first and second capacitors C2, C3; a band pass filter 2 and an antenna 1 coupled to the first capacitor C2; and a third capacitor C1 connected to the second capacitor C3.

Abstract: The present invention provides a transceiver apparatus that permits miniaturization even when the antenna thereof is an unbalanced circuit and the transmitter circuit section and receiver circuit section thereof are balanced circuits.

Abstract: An integrated circuit device having a chip-on-chip structure comprises a first IC chip, a second IC chip arranged on the first IC chip with surfaces of the first and second IC chips facing each other and electrically connected to the first IC chip by way of bonding, one or more conductor materials, and a substrate to which an electric potential is given and on which the first and second IC chips are mounted, wherein the conductor material is arranged either between the first and second IC chips or on an opposite surface of the second IC chip to the surface facing the first IC chip, and electrically connected to the substrate so as to provide a shielding effect for reducing malfunctions of the device that are caused by noise.