Patents by Inventor Katsuya Ohwada

Katsuya Ohwada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7353528
    Abstract: A multi-layered film made of sequentially stacked first dielectric layer, recording layer, record-assist layer, second dielectric layer and first reflection layer on a disc substrate having a concavo-convex structure at least on one surface thereof. An ultraviolet-setting resin layer is formed to cover the multi-layered film. The record-assist layer is controlled in thickness to satisfy the relation d/4<a<3d, or more preferably the relation d/2?a?2d, between the thickness d of the recording layer and the thickness a of the record-assist layer. The stacking order of the multi-layered film may be opposite. In this case, a light-transmitting sheet is provided to cover the multi-layered film via a bonding layer.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: April 1, 2008
    Assignee: Sony Corporation
    Inventors: Kazuya Hayashibe, Katsuya Ohwada
  • Publication number: 20060072435
    Abstract: A multi-layered film made of sequentially stacked first dielectric layer, recording layer, record-assist layer, second dielectric layer and first reflection layer on a disc substrate having a concavo-convex structure at least on one surface thereof. An ultraviolet-setting resin layer is formed to cover the multi-layered film. The record-assist layer is controlled in thickness to satisfy the relation d/4<a<3d, or more preferably the relation d/2?a?2d, between the thickness d of the recording layer and the thickness a of the record-assist layer. The stacking order of the multi-layered film may be opposite. In this case, a light-transmitting sheet is provided to cover the multi-layered film via a bonding layer.
    Type: Application
    Filed: February 19, 2002
    Publication date: April 6, 2006
    Inventors: Kazuya Hayashibe, Katsuya Ohwada
  • Patent number: 6822962
    Abstract: A communication network capable of establishing an SVC bypass route when a failure occurs in a PVC multiplexed line wherein each of ATM switches at both ends of a PVC stores the relations of SVC specifying information and the other party PVC information in association with each PVC in a management table. At the time of bypassing, one of the switches transmits a message including the other party PVC information to another ATM switch for each PVC to be bypassed and another ATM switch specifies a PVC to be switched on the basis of the received message and switches the PVC to an SVC specified by the corresponding SVC specifying information stored in the management table.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: November 23, 2004
    Assignee: Hitachi Telecom Technologies, Ltd.
    Inventors: Toshimichi Noake, Toshiki Ichikawa, Mitsumasa Mori, Katsuya Ohwada, Sadato Ando