Abstract: Provided is an organic EL panel. A first conductive film, an organic functional film, a second conductive film, and a sealing film are provided on a substrate. The first conductive film includes a first main body, a first electrode pad, and a second electrode pad. The second conductive film includes a second main body, and a second electrode pad region extending from the second main body toward the first vertex. The second electrode pad region extends to a stretched region exposed from the sealing film which covers a light-emitting region. A first electrode conduction path surrounds at least half of the light-emitting region and connects the electrode pads. A circuit board is fixed near the first vertex. A first electrode wire is configured to adhere to the electrode pads. A second electrode wire is configured to adhere to the second electrode pad region in the stretched region.

Abstract: Provided is an organic EL panel. A first conductive film, an organic functional film, a second conductive film, and a sealing film are provided on a substrate. The first conductive film includes a first main body, a first electrode pad, and a second electrode pad. The second conductive film includes a second main body, and a second electrode pad region extending from the second main body toward the first vertex. The second electrode pad region extends to a stretched region exposed from the sealing film which covers a light-emitting region. A first electrode conduction path surrounds at least half of the light-emitting region and connects the electrode pads. A circuit board is fixed near the first vertex. A first electrode wire is configured to adhere to the electrode pads. A second electrode wire is configured to adhere to the second electrode pad region in the stretched region.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: An object of the present invention is to provide a curable composition made mainly of an organic polymer having a reactive silicon group, exhibits a good curability without using any organic tin compound substantially, and gives a cured product having a sufficient strength; and to provide a catalyst composition. The object is solved by a curable composition, comprising a polymer (A) having a silicon-containing group which can be crosslinked by forming a siloxane bond, and a fluoride salt compound (B).

Abstract: An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Abstract: An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same.

Abstract: Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same.

Abstract: A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.

Abstract: An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Abstract: An object of the present invention is to provide a curable composition made mainly of an organic polymer having a reactive silicon group, exhibits a good curability without using any organic tin compound substantially, and gives a cured product having a sufficient strength; and to provide a catalyst composition. The object is solved by a curable composition, comprising a polymer (A) having a silicon-containing group which can be crosslinked by forming a siloxane bond, and a fluoride salt compound (B).

Abstract: The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials. A curing agent, which comprises at least two SiH groups, is obtainable by subjecting an aliphatic organic compound (?1) and an acyclic and/or cyclic polyorganosiloxane (?1) to hydrosilylation reaction. The curing agent is also obtainable by subjecting an organic compound (?2) and a cyclic polyorganosiloxane (?2) to hydrosilylation reaction.

Abstract: A curable composition comprising: component (A), which is an aliphatic organic compound including at least two carbon-carbon double bonds within one molecule, the at least two carbon-carbon double bonds having reactivity with an SiH group; component (B), which is a compound including at least two SiH groups within one molecule; and component (C), which is a hydrosilylation catalyst. The curable composition can be made into an optical material by being previously mixed so as to allow the carbon-carbon double bonds having reactivity with an SiH group to react with some or all of the SiH groups in the composition, thereby causing curing. There is provided a curable composition having a high heat-resistance, a low birefringence, a small coefficient of photoelasticity, a high optical transparency, and toughness; an optical material; a method for producing the same; and a liquid crystal display device incorporating the same.

Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

Abstract: The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C.

Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

Abstract: The invention aims at a curing agent, curable compositions or compositions for optical materials, capable of providing for cured artifacts having laudable heat resistance, optical transparency, and light resistance; optical materials and methods for their production; and liquid crystal displays and LED's made by using the materials.