Abstract: A detection system includes an imaging unit configured to acquire in advance a first distance image indicating a background and acquire a second distance image including at least the background and a target object, and a processing unit configured to calculate a first virtual volume indicating the background from the first distance image, calculate a second virtual volume indicating the target object from the second distance image, and compare the first virtual volume with the second virtual volume to detect the target object.

Abstract: A detection system includes an imaging unit configured to acquire a distance image indicating a distance to a target object, and a processing unit configured to divide pixels included in the distance image into blocks according to a distance relationship, and detects a state of the target object by comparing ratios of pixels included in the respective blocks.

Abstract: A switch device includes: an adhesive base adhered to a surface of a surface member; and an operation assembly connected to the adhesive base. The operation assembly includes: an operation base connected to the adhesive base; and an operation knob that is rotatable with respect to the operation base. The operation knob is connected to the adhesive base and is removable from the adhesive base in an axial direction of the operation knob.

Abstract: A molding mold includes a shell mold provided with a plurality of vacuum suction holes and a backup mold for backing up the shell mold, a back surface of the shell mold and a front surface of the backup mold having the same shape and being fitted to each other. A ventilation groove is formed on the front surface of the backup mold or the back surface of the shell mold, leaving a receiving surface for receiving a mating surface, a plurality of striped grooves and ridges between the striped grooves are formed on the back surface of the shell mold or the front surface of the backup mold, the striped grooves having a feed pitch of 0.5 mm to 5.0 mm and a processing depth of 0.01 mm to 0.4 mm, and the vacuum suction holes and the ventilation groove communicate with each other through the striped grooves.

Abstract: A semiconductor device includes a substrate; a semiconductor chip located on the substrate; a sealing resin covering the substrate and the semiconductor chip; and a mottled pattern located at an interface between the sealing resin and at least one of the substrate or the semiconductor chip.

Abstract: A molding mold includes a shell mold provided with a plurality of vacuum suction holes and a backup mold for backing up the shell mold, a back surface of the shell mold and a front surface of the backup mold having the same shape and being fitted to each other. A ventilation groove is formed on the front surface of the backup mold or the back surface of the shell mold, leaving a receiving surface for receiving a mating surface, a plurality of striped grooves and ridges between the striped grooves are formed on the back surface of the shell mold or the front surface of the backup mold, the striped grooves having a feed pitch of 0.5 mm to 5.0 mm and a processing depth of 0.01 mm to 0.4 mm, and the vacuum suction holes and the ventilation groove communicate with each other through the striped grooves.

Abstract: A semiconductor device includes: a first chip including a first electrode; a wiring member; a second chip located between the first chip and the wiring member, including a second electrode; a first conductive plate located on the first electrode, in a second direction a dimension of the first conductive plate being greater than a dimension of the first chip, the second direction crossing a first direction being from the first chip toward the second chip; a second conductive plate located on the second electrode, in a second direction a dimension of the second conductive plate being greater than a dimension of the second chip; and a first wire being bonded to the wiring member, a portion of the first conductive plate protruding further in the second direction than the first chip, and a portion of the second conductive plate protruding further in the second direction than the second chip.

Abstract: A method for manufacturing a semiconductor device includes: fixing a semiconductor chip to a first part of a leadframe; bonding one connector member to a first terminal of the semiconductor chip, a second terminal of the semiconductor chip, a second part of the leadframe, and a third part of the leadframe; forming a sealing member; and separating a first conductive part of the connector member and a second conductive part of the connector member by removing at least a section of the portion of the connector member exposed outside the sealing member, the first conductive part being bonded to the first terminal and the second part, the second conductive part being bonded to the second terminal and the third part.

Abstract: A method for manufacturing a semiconductor device includes: fixing a semiconductor chip to a first part of a leadframe; bonding one connector member to a first terminal of the semiconductor chip, a second terminal of the semiconductor chip, a second part of the leadframe, and a third part of the leadframe; forming a sealing member; and separating a first conductive part of the connector member and a second conductive part of the connector member by removing at least a section of the portion of the connector member exposed outside the sealing member, the first conductive part being bonded to the first terminal and the second part, the second conductive part being bonded to the second terminal and the third part.

Abstract: A switch device includes: an adhesive base adhered to a surface of a surface member; and an operation assembly connected to the adhesive base. The operation assembly includes: an operation base connected to the adhesive base; and an operation knob that is rotatable with respect to the operation base. The operation knob is connected to the adhesive base and is removable from the adhesive base in an axial direction of the operation knob.

Abstract: A storage control system reads a data set from a storage apparatus if necessary in response to an I/O request. A data set contains data and an address. The storage control system performs an all-type address check which is a check to determine whether one of a first address and second address which correspond to a read-target data set in address translation information, which is information indicating a mapping relationship between one or more first addresses and one or more second addresses, matches the address among the data and address contained in the data set. The one or more first addresses are each an address which belongs to the first address type. The one or more second addresses are each an address which belongs to the second address type. The storage control system performs processing according to the I/O request when the result of the all-type address check is true.

Abstract: A storage control system reads a data set from a storage apparatus if necessary in response to an I/O request. A data set contains data and an address. The storage control system performs an all-type address check which is a check to determine whether one of a first address and second address which correspond to a read-target data set in address translation information, which is information indicating a mapping relationship between one or more first addresses and one or more second addresses, matches the address among the data and address contained in the data set. The one or more first addresses are each an address which belongs to the first address type. The one or more second addresses are each an address which belongs to the second address type. The storage control system performs processing according to the I/O request when the result of the all-type address check is true.

Abstract: A method for manufacturing a mold includes forming a groove in a back surface of a mold body configured to mold a resin or a rubber by cutting or by electrical discharge machining the back surface of the mold body, placing a porous conductive sheet, including a plurality of through holes and being conductive at least at a surface of the porous conductive sheet, on the back surface of the mold body so as to cover the groove, and temporarily fixing the porous conductive sheet to the back surface of the mold body by spot welded portions, wherein a part of the porous conductive sheet which covers the groove has a flat shape, and performing electroforming to cause an electroformed metal to be electrodeposited on the back surface of the mold body and on the porous conductive sheet.

Abstract: In a clamp device, a main clamp body includes an elongated tightening groove delimited by groove-forming wall sections. First and second lobe parts are disposed in the vicinity of end portions of two such tightening grooves. The main clamp body presents a ring shape when bolt and nut are mounted in position on the lobe parts disposed facing each other. Each of the lobe parts includes sidewall sections respectively contiguous to the groove delimiting wall sections that delimit the tightening groove. Each lobe part also includes a curved outer end wall section interconnecting the sidewall sections at an outer end of each lobe part and a seat surface wall section contiguous to the sidewall sections and to the outer end wall section. The seat surface wall section provides a bolt/nut seat surface. An arcuately shaped fulcrum part is formed on the curved outer end wall section of each lobe part.

Abstract: A mold includes a mold body, a porous conductive sheet and an electroformed metal. The porous conductive sheet is placed on a back surface of the mold body, has a plurality of through holes, and is conductive at least at its surface. The electroformed metal is electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet. In the mold, an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.

Abstract: The present invention provides a computer system capable of ensuring a storage capacity to a virtual volume within a pool. According to the present invention, a pool capacity of a block storage is reserved in a specific address range of the virtual volume, and a reserved capacity is allocated during writing of data to a specific address range. Further, when the reserved capacity is not allocated for a given period of time, reservation is freed.

Abstract: In a clamp device, a main clamp body includes an elongated tightening groove delimited by groove-forming wall sections. First and second lobe parts are disposed in the vicinity of end portions of two such tightening grooves. The main clamp body presents a ring shape when bolt and nut are mounted in position on the lobe parts disposed facing each other. Each of the lobe parts includes sidewall sections respectively contiguous to the groove delimiting wall sections that delimit the tightening groove. Each lobe part also includes a curved outer end wall section interconnecting the sidewall sections at an outer end of each lobe part and a seat surface wall section contiguous to the sidewall sections and to the outer end wall section. The seat surface wall section provides a bolt/nut seat surface. An arcuately shaped fulcrum part is formed on the curved outer end wall section of each lobe part.

Abstract: In a clamp device, a main clamp body includes an elongated tightening groove delimited by groove-forming wall sections. First and second lobe parts are disposed in the vicinity of end portions of two such tightening grooves. The main clamp body presents a ring shape when bolt and nut are mounted in position on the lobe parts disposed facing each other. Each of the lobe parts includes sidewall sections respectively contiguous to the groove delimiting wall sections that delimit the tightening groove. Each lobe part also includes a curved outer end wall section interconnecting the sidewall sections at an outer end of each lobe part and a seat surface wall section contiguous to the sidewall sections and to the outer end wall section. The seat surface wall section provides a bolt/nut seat surface. An arcuately shaped fulcrum part is formed on the curved outer end wall section of each lobe part.

Abstract: The present invention comprises a virtual volume 50, which is a virtual storage area comprising multiple virtual page groups, a pool 60, which is a storage area comprising multiple pool page groups having different access performance, and a controller 13, which comprises a corresponding relationship between the virtual page and the pool page, and accesses the pool page corresponding to the virtual page based on accesses to the virtual page from other apparatuses, and the controller 13, based on an access load trend with respect to each virtual page in each time slot, executes processing for deciding an ideal pool page allocation destination for each virtual page in each time slot, and reallocating a virtual page to the ideal pool page at a time, which is prior to a start time, so that the ideal pool page can be allocated to each virtual page by the start time of each time slot.