Patents by Inventor Katsuyoshi Aikawa
Katsuyoshi Aikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220189813Abstract: There is provided a mounting table. The mounting table comprises: a dielectric plate having a through-hole at an outer peripheral portion thereof and having a substrate support on which a substrate is placed; a support member; a first heat insulating member disposed between the dielectric plate and the support member; a first biasing member disposed between the first heat insulating member and the support member, and a fastening member configured to detachably fix the dielectric plate to the support member by way of penetrating through the through-hole of the dielectric plate, the first heat insulating member, and the first biasing member.Type: ApplicationFiled: December 13, 2021Publication date: June 16, 2022Inventors: Katsuyoshi AIKAWA, Hiroshi SONE, Shinji ORIMOTO
-
Patent number: 11085113Abstract: A film forming apparatus includes a rotary table having a loading area at a first surface side thereof and revolving a substrate loaded on the loading area, a rotation mechanism rotating the loading area such that the substrate rotates around its axis, a processing gas supply mechanism supplying a processing gas to a processing gas supply area so that a thin film is formed on the substrate which repeatedly passes through the processing gas supply area the revolution of the substrate, and a control part configured to perform a calculation of a rotation speed of the substrate based on a parameter including a rotation speed of the rotary table to allow an orientation of the substrate to be changed whenever the substrate is positioned in the processing gas supply area, and to output a control signal for rotating the substrate at a calculated rotation speed.Type: GrantFiled: June 28, 2018Date of Patent: August 10, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Hitoshi Kato, Shigehiro Miura, Hiroyuki Kikuchi, Katsuyoshi Aikawa
-
Patent number: 10683573Abstract: A film forming apparatus of forming a film by supplying a process gas onto a substrate includes a rotation table having a loading region and is configured to revolve the substrate loaded on the loading region; a process gas supply mechanism configured to supply the process gas to a gas supply region to perform film formation on the substrate repeatedly passing through the gas supply region a plurality of times by revolution of the substrate; a first gear disposed on the other surface side of the rotation table and rotated in a rotation direction of the rotation table; a second gear configured with planetary gears engaging with the first gear, disposed to be revolved together with the loading region, and configured to rotate the loading region so as to allow the substrate to be rotated.Type: GrantFiled: November 10, 2015Date of Patent: June 16, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Hitoshi Kato, Shigehiro Miura, Hiroyuki Kikuchi, Katsuyoshi Aikawa
-
Patent number: 10428425Abstract: A film deposition apparatus for sequentially supplying reaction gases, which mutually react, into a chamber to deposit a film on a substrate includes a turntable rotatable and including a concave portion on an upper surface, a bottom portion of the concave portion having a through hole, a substrate supporting member attachable to and detachable from the concave portion, an upper surface of the substrate supporting member mounting the substrate, a lower surface of the substrate supporting member having a first protruding portion, a drive mechanism moving up and down the turntable and revolving the turntable, a lid member located lower than the turntable, an upper surface of the lid member having a second protruding portion, and a control unit revolving the turntable to cause the first protruding portion to contact the second protruding portion and cause the substrate supporting member to be spun a predetermined angle relative to the turntable.Type: GrantFiled: January 24, 2017Date of Patent: October 1, 2019Assignee: Tokyo Electron LimitedInventors: Katsuhiko Oyama, Kiichi Takahashi, Yasushi Takeuchi, Katsuyoshi Aikawa
-
Publication number: 20180327906Abstract: A film forming apparatus includes a rotary table having a loading area at a first surface side thereof and revolving a substrate loaded on the loading area, a rotation mechanism rotating the loading area such that the substrate rotates around its axis, a processing gas supply mechanism supplying a processing gas to a processing gas supply area so that a thin film is formed on the substrate which repeatedly passes through the processing gas supply area the revolution of the substrate, and a control part configured to perform a calculation of a rotation speed of the substrate based on a parameter including a rotation speed of the rotary table to allow an orientation of the substrate to be changed whenever the substrate is positioned in the processing gas supply area, and to output a control signal for rotating the substrate at a calculated rotation speed.Type: ApplicationFiled: June 28, 2018Publication date: November 15, 2018Inventors: Hitoshi KATO, Shigehiro MIURA, Hiroyuki KIKUCHI, Katsuyoshi AIKAWA
-
Patent number: 10072336Abstract: A film forming apparatus includes a rotary table having a loading area at a first surface side thereof and revolving a substrate loaded on the loading area, a rotation mechanism rotating the loading area such that the substrate rotates around its axis, a processing gas supply mechanism supplying a processing gas to a processing gas supply area so that a thin film is formed on the substrate which repeatedly passes through the processing gas supply area the revolution of the substrate, and a control part configured to perform a calculation of a rotation speed of the substrate based on a parameter including a rotation speed of the rotary table to allow an orientation of the substrate to be changed whenever the substrate is positioned in the processing gas supply area, and to output a control signal for rotating the substrate at a calculated rotation speed.Type: GrantFiled: October 29, 2015Date of Patent: September 11, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Hitoshi Kato, Shigehiro Miura, Hiroyuki Kikuchi, Katsuyoshi Aikawa
-
Publication number: 20170241018Abstract: A film deposition apparatus includes a chamber and a turntable provided in the chamber. The turntable includes a concave portion in its upper surface. A bottom portion of the concave portion has a through hole. A substrate supporting member is detachably placed on the concave portion so that a lower surface thereof is exposed from the through hole, and includes a substrate receiving portion. A drive mechanism moves up and down and rotates the turntable. A rotary unit rotatable by air is provided under the turntable. An air supply unit is provided. A controller causes the drive mechanism to rotate and move down the turntable so that the rotary unit supports the exposed lower surface of the substrate supporting member. The controller causes the air supply unit to supply air to the rotary unit so that the substrate supporting member rotates a predetermined angle relative to the turntable.Type: ApplicationFiled: February 16, 2017Publication date: August 24, 2017Inventors: Katsuhiko OYAMA, Kiichi TAKAHASHI, Yasushi TAKEUCHI, Katsuyoshi AIKAWA
-
Publication number: 20170211181Abstract: A film deposition apparatus for sequentially supplying reaction gases, which mutually react, into a chamber to deposit a film on a substrate includes a turntable rotatable and including a concave portion on an upper surface, a bottom portion of the concave portion having a through hole, a substrate supporting member attachable to and detachable from the concave portion, an upper surface of the substrate supporting member mounting the substrate, a lower surface of the substrate supporting member having a first protruding portion, a drive mechanism moving up and down the turntable and revolving the turntable, a lid member located lower than the turntable, an upper surface of the lid member having a second protruding portion, and a control unit revolving the turntable to cause the first protruding portion to contact the second protruding portion and cause the substrate supporting member to be spun a predetermined angle relative to the turntable.Type: ApplicationFiled: January 24, 2017Publication date: July 27, 2017Inventors: Katsuhiko OYAMA, Kiichi TAKAHASHI, Yasushi TAKEUCHI, Katsuyoshi AIKAWA
-
Patent number: 9404184Abstract: A substrate position detecting apparatus detects a position of a substrate inside a chamber from an image of a target inside the chamber. The apparatus includes an image pickup device to pick up the image of the target inside the chamber through a window, an illumination device to irradiate light upwards, an illumination reflecting plate provided above the illumination device and including a reflecting surface to reflect the light from the illumination device towards the window, and a reflection restricting part provided on the reflecting surface to form a shadow in a predetermined region that includes the target inside the chamber.Type: GrantFiled: December 12, 2013Date of Patent: August 2, 2016Assignee: Tokyo Electron LimitedInventor: Katsuyoshi Aikawa
-
Publication number: 20160138159Abstract: A film forming apparatus of forming a film by supplying a process gas onto a substrate includes a rotation table having a loading region and is configured to revolve the substrate loaded on the loading region; a process gas supply mechanism configured to supply the process gas to a gas supply region to perform film formation on the substrate repeatedly passing through the gas supply region a plurality of times by revolution of the substrate; a first gear disposed on the other surface side of the rotation table and rotated in a rotation direction of the rotation table; a second gear configured with planetary gears engaging with the first gear, disposed to be revolved together with the loading region, and configured to rotate the loading region so as to allow the substrate to be rotated.Type: ApplicationFiled: November 10, 2015Publication date: May 19, 2016Inventors: Hitoshi KATO, Shigehiro MIURA, Hiroyuki KIKUCHI, Katsuyoshi AIKAWA
-
Publication number: 20160122872Abstract: A film forming apparatus includes a rotary table having a loading area at a first surface side thereof and revolving a substrate loaded on the loading area, a rotation mechanism rotating the loading area such that the substrate rotates around its axis, a processing gas supply mechanism supplying a processing gas to a processing gas supply area so that a thin film is formed on the substrate which repeatedly passes through the processing gas supply area the revolution of the substrate, and a control part configured to perform a calculation of a rotation speed of the substrate based on a parameter including a rotation speed of the rotary table to allow an orientation of the substrate to be changed whenever the substrate is positioned in the processing gas supply area, and to output a control signal for rotating the substrate at a calculated rotation speed.Type: ApplicationFiled: October 29, 2015Publication date: May 5, 2016Inventors: Hitoshi KATO, Shigehiro MIURA, Hiroyuki KIKUCHI, Katsuyoshi AIKAWA
-
Patent number: 8854449Abstract: A substrate position detection method includes rotating the susceptor so that the substrate receiving portion is moved into an image taking area of a imaging apparatus; detecting first two position detection marks provided in the process chamber so that the first two position detection marks are within the image taking area, wherein a first perpendicular bisector of the first two position detection marks passes through a rotational center of the susceptor; detecting second two position detection marks provided in the susceptor so that the second two position detection marks can be within the image taking area, wherein a second perpendicular bisector of the second two position detection marks passes through the rotational center of the susceptor and a center of the substrate receiving portion; and determining whether the substrate receiving portion is positioned in a predetermined range in accordance with the detected first two and second two position detection marks.Type: GrantFiled: September 20, 2011Date of Patent: October 7, 2014Assignee: Tokyo Electron LimitedInventors: Katsuyoshi Aikawa, Manabu Honma
-
Publication number: 20140174351Abstract: A substrate position detecting apparatus detects a position of a substrate inside a chamber from an image of a target inside the chamber. The apparatus includes an image pickup device to pick up the image of the target inside the chamber through a window, an illumination device to irradiate light upwards, an illumination reflecting plate provided above the illumination device and including a reflecting surface to reflect the light from the illumination device towards the window, and a reflection restricting part provided on the reflecting surface to form a shadow in a predetermined region that includes the target inside the chamber.Type: ApplicationFiled: December 12, 2013Publication date: June 26, 2014Applicant: Tokyo Electron LimitedInventor: Katsuyoshi AIKAWA
-
Patent number: 8394200Abstract: A vertical plasma processing apparatus for a semiconductor process includes an airtight auxiliary chamber defined by a casing having an insulative inner surface and integrated with a process container. The auxiliary chamber includes a plasma generation area extending over a length corresponding to a plurality of target substrates in a vertical direction. A partition plate having an insulative surface is located between a process field and the plasma generation. The partition plate includes a gas passage disposed over a length corresponding to the plurality of target substrates in a vertical direction. A process gas is exited while passing through the plasma generation area, and is then supplied through the gas passage to the process field.Type: GrantFiled: November 25, 2008Date of Patent: March 12, 2013Assignee: Tokyo Electron LimitedInventors: Hiroyuki Matsuura, Toshiki Takahashi, Jun Sato, Katsuyoshi Aikawa, Katsutoshi Ishii
-
Publication number: 20130047923Abstract: A disclosed film deposition apparatus which forms a film on a substrate inside a vacuum chamber including a turntable having a substrate mounting area, includes an antenna facing the substrate mounting area for converting the plasma generating gas to plasma, a Faraday shield intervening between the antenna and the substrate to prevent an electric field of an electromagnetic field from passing therethrough, the Faraday shield including slits arranged on the conductive plate parallel to the antenna, the slits being opened on the conductive plate in perpendicular to a direction of arranging the slits to enable a magnetic field to reach the substrate, a window opened in an area of the conductive plate surrounded by the slits, an inner conductive path between the slits and the window and grounded, and an outer conductive path on a side opposite to the window relative to the slits and surrounds the slits.Type: ApplicationFiled: August 17, 2012Publication date: February 28, 2013Applicant: Tokyo Electron LimitedInventors: Hitoshi KATO, Takeshi KOBAYASHI, Shigehiro USHIKUBO, Katsuyoshi AIKAWA
-
Publication number: 20120075460Abstract: A substrate position detection method includes rotating the susceptor so that the substrate receiving portion is moved into an image taking area of a imaging apparatus; detecting first two position detection marks provided in the process chamber so that the first two position detection marks are within the image taking area, wherein a first perpendicular bisector of the first two position detection marks passes through a rotational center of the susceptor; detecting second two position detection marks provided in the susceptor so that the second two position detection marks can be within the image taking area, wherein a second perpendicular bisector of the second two position detection marks passes through the rotational center of the susceptor and a center of the substrate receiving portion; and determining whether the substrate receiving portion is positioned in a predetermined range in accordance with the detected first two and second two position detection marks.Type: ApplicationFiled: September 20, 2011Publication date: March 29, 2012Applicant: Tokyo Electron LimitedInventors: Katsuyoshi AIKAWA, Manabu HONMA
-
Publication number: 20100124610Abstract: A disclosed substrate position detection apparatus includes an imaging portion configured to take an image of a substrate subject to a position detection; a panel member provided between the imaging portion and the substrate and including a first opening that ensures a field of view for the imaging portion with respect to the substrate, the panel member having a light scattering property; a first illuminating portion configured to illuminate the panel member; and a processing portion capable of determining a position of the substrate in accordance with the image taken through the first opening by the imaging portion.Type: ApplicationFiled: November 13, 2009Publication date: May 20, 2010Inventors: KATSUYOSHI AIKAWA, MANABU HONMA
-
Publication number: 20100055312Abstract: In a film deposition apparatus which deposits a thin film on a substrate by supplying first and second reactive gases in a vacuum chamber, there are provided a turntable, a first reactive gas supplying portion and a second reactive gas supplying portion which are arranged to extend from circumferential positions of the turntable to a center of rotation of the turntable, a first separation gas supplying portion arranged between the first and second reactive gas supplying portions, a first space having a first height and including the first separation gas supplying portion, a second space having a second height and including the second reactive gas supplying portion, a third space having a height lower than the first height and the second height and including the first separation gas supplying portion, a position detecting unit detecting a rotation position of the turntable, and a detection part arranged at a circumferential portion of the turntable and detected by the position detecting unit.Type: ApplicationFiled: September 2, 2009Publication date: March 4, 2010Inventors: HITOSHI KATO, Manabu Honma, Tomoki Haneishi, Katsuyoshi Aikawa
-
Publication number: 20090078201Abstract: A vertical plasma processing apparatus for a semiconductor process includes an airtight auxiliary chamber defined by a casing having an insulative inner surface and integrated with a process container. The auxiliary chamber includes a plasma generation area extending over a length corresponding to a plurality of target substrates in a vertical direction. A partition plate having an insulative surface is located between a process field and the plasma generation. The partition plate includes a gas passage disposed over a length corresponding to the plurality of target substrates in a vertical direction. A process gas is exited while passing through the plasma generation area, and is then supplied through the gas passage to the process field.Type: ApplicationFiled: November 25, 2008Publication date: March 26, 2009Inventors: Hiroyuki Matsuura, Toshiki Takahashi, Jun Sato, Katsuyoshi Aikawa, Katsutoshi Ishii
-
Publication number: 20070240644Abstract: A vertical plasma processing apparatus for a semiconductor process includes an airtight auxiliary chamber defined by a casing having an insulative inner surface and integrated with a process container. The auxiliary chamber includes a plasma generation area extending over a length corresponding to a plurality of target substrates in a vertical direction. A partition plate having an insulative surface is located between a process field and the plasma generation. The partition plate includes a gas passage disposed over a length corresponding to the plurality of target substrates in a vertical direction. A process gas is exited while passing through the plasma generation area, and is then supplied through the gas passage to the process field.Type: ApplicationFiled: March 22, 2007Publication date: October 18, 2007Inventors: Hiroyuki Matsuura, Toshiki Takahashi, Jun Sato, Katsuyoshi Aikawa, Katsutoshi Ishii