Abstract: Object: To provide a polishing composition which is capable of polishing a tantalum-containing compound at a high stock removal rate and whereby the copper surface after polishing is scarcely corroded, and to provide a polishing process where dishing can be minimized. Means to accomplish the object: A polishing composition comprising an abrasive, oxalic acid, an ethylenediamine derivative, a benzotriazole derivative and water and not containing an oxidizing agent, and a polishing composition comprising an abrasive, oxalic acid, an ethylenediamine derivative, a benzotriazole derivative, water and hydrogen peroxide.

Abstract: A process for producing a polishing composition, which comprises preliminarily adjusting water to pH 2-4, adding from 40 to 60 wt % of fumed silica to the water under high shearing force, adding water to lower the viscosity to 2-10000 cps, stirring the mixture under low shearing force for at least 5 minutes, adding water to lower the fumed silica concentration to 10-38 wt %, and adding a basic substance under vigorous stirring to raise the pH to 9-12.

Abstract: A polishing composition comprising the following components:(a) an abrasive,(b) an oxidizing agent capable of oxidizing tantalum,(c) a reducing agent capable of reducing tantalum oxide, and(d) water.

Abstract: A method for forming a resist pattern comprising the steps of: exposing a chemically amplified resist film by use of a mask having a given pattern; forming a protective film made of a paraffin having a melting point of not higher than 10.degree. C. and a boiling point of not lower than 50.degree. C. on the surface of the chemically amplified resist film before or after exposing the chemically amplified resist film; and forming the given pattern in the chemically amplified resist film by developing.

Abstract: A photoresist includes a three-layer structure of a lower layer, a middle layer and an upper layer, wherein the lower and upper layers are photoresist layers, the lower layer is sensitive to a light having a longer wavelength than a light to which the upper layer is sensitive, and the middle layer is a light-shielding film formed of an organic substance that has a transmittance such that the lower layer is not exposed to lights to which the lower and upper layers are sensitive.