Patents by Inventor Katsuyoshi Izawa

Katsuyoshi Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having particular solder interconnection arrangement
    Patent number: 5182628
    Abstract: A semiconductor device which is resistant to cracking during a heat cycle is provided which uses a lead-tin alloy solder having a weight ratio in a range of 45/55 to 55/45 to bond an insulation plate and a heat sink plate of the semiconductor device to one another.
    Type: Grant
    Filed: October 10, 1991
    Date of Patent: January 26, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Katsuyoshi Izawa, Ryoichi Kobayashi, Masayuki Ozawa