Patents by Inventor Katsuyoshi Naoi

Katsuyoshi Naoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for analyzing electrolytic copper plating solution
    Patent number: 8440555
    Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. In an embodiment of the present invention, the fillability is judged by obtaining the potential change speed in the initial stage of electrolysis and the potential convergent point from the time-dependent potential change curve for a predetermined period of time after the start of the electrolysis.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: May 14, 2013
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Toshikazu Okubo, Katsuyoshi Naoi, Yuka Yamada
  • METHOD FOR ANALYZING ELECTROLYTIC COPPER PLATING SOLUTION
    Publication number: 20110025294
    Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. In an embodiment of the present invention, the fillability is judged by obtaining the potential change speed in the initial stage of electrolysis and the potential convergent point from the time-dependent potential change curve for a predetermined period of time after the start of the electrolysis.
    Type: Application
    Filed: October 12, 2010
    Publication date: February 3, 2011
    Applicant: Toppan Printing Co., Ltd.
    Inventors: Toshikazu Okubo, Katsuyoshi Naoi, Yuka Yamada
  • Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product
    Patent number: 7820535
    Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2 are obtained to judge the fillability with a plating solution.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: October 26, 2010
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Toshikazu Okubo, Katsuyoshi Naoi, Yuka Yamada
  • Method for analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product
    Publication number: 20060183257
    Abstract: Effective fillability and the uniformity electrodeposition of a copper electroplating solution is judged by determining the time-dependent potential change thereof at a cathode current density of 0.1-20 A/dm2. The potential change is determined at a working electrode rotation of 100-7500 rpm, and the fillability with the solution is judged from the curve profile. The time-dependent potential change curve within a predetermined period of time after the start of electrolysis is approximated according to the Boltzmann's function, and the potential change speed dx and the potential convergent point A2 are obtained to judge the fillability with a plating solution.
    Type: Application
    Filed: March 23, 2004
    Publication date: August 17, 2006
    Inventors: Toshikazu Okubo, Katsuyoshi Naoi, Yuka Yamada