Patents by Inventor Katsuyoshi Orita

Katsuyoshi Orita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7125260
    Abstract: A connector mounting structure on a circuit board is presented. A connector has a plurality of terminals comprising first terminals separated with a predetermined pitch and second terminals separated with a pitch larger than the predetermined pitch. The first and second terminals have respectively a first tail part facing toward the circuit board and a second tail part bent toward the circuit board after extending in the lateral direction from the connector housing. The first tail part is reflow-soldered to a land part formed on a surface of the circuit board, and the bent top end of the second tail part is inserted into a mounting hole penetrating another land part formed on the circuit board and reflow-soldered. In this mounting structure of the connector, it is simultaneously possible to narrow a pitch between terminals and to increase the peeling strength.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: October 24, 2006
    Assignees: Taiko Denki Co., Ltd., Sony Corporation
    Inventors: Katsuyoshi Orita, Keiji Kawaguchi, Takashi Miyajima, Satoru Teruki
  • Publication number: 20060089018
    Abstract: A connector mounting structure on a circuit board is presented. A connector has a plurality of terminals comprising a first terminal separated with a predetermined pitch and a second terminal separated with a pitch larger than the predetermined pitch. The first and second terminals have respectively a first tail part facing toward the circuit board and a second tail part bent on the circuit board side after extended in the lateral direction of the connector housing. The first tail part is reflow-soldered to a land part formed on the surface of the circuit board, and the bent top end of the second tail part is inserted into a mounting hole penetrating the other land part formed on the circuit board and reflow-soldered. In this mounting structure of the connector, it is simultaneously possible to narrow a pitch between terminals and to increase the peeling strength.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 27, 2006
    Applicants: Sony Corporation, Taiko Denki Co., Ltd.
    Inventors: Katsuyoshi Orita, Keiji Kawaguchi, Takashi Miyajima, Satoru Teruki
  • Patent number: 6385050
    Abstract: A housing device 100 for plural components that can be arrayed one on top of another includes a support 101 for housing the components on introducing the latter into the support, and a locking unit 102 configured for preventing the components housed in the support 101 from being moved out of the support 101. The housing device 100 also includes a base member 103 having an unlocking support 101 which is adapted to release the state of the locking unit 102 prohibiting the movement of the components housed in the support 101. The components to be housed are usually locked by the locking unit 102. The locked state of the components is established by simply placing the components into the support and is released by the unlocking support 101. A larger number of the components can be housed on top of each other if so desired.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: May 7, 2002
    Assignees: Sony Corporation, Yazaki Industrial Chemical Co., LTD
    Inventors: Katsuyoshi Orita, Masamichi Morioka, Hiroshi Yoneyama