Abstract: An electrical characteristics test for a semiconductor integrated circuit using a Kelvin contact method can be conducted in a pre-process without obstructing the reduction in size of a semiconductor chip or without complicating the circuit design. A probe card in a testing apparatus includes probes for Kelvin contact, the probes for Kelvin contact including a coil probe and a POGO pin probe disposed inside the coil probe, and a probe for two-terminal measurement. Electrode pads formed in each chip area over a wafer are in a relation of A=B<2A, given that the area of one of the electrode pads with which the probe for Kelvin contact comes into contact is B and the area of the other electrode pad with which the probe for two-terminal measurement comes into contact is A.

Abstract: An electrical characteristics test for a semiconductor integrated circuit using a Kelvin contact method can be conducted in a pre-process without obstructing the reduction in size of a semiconductor chip or without complicating the circuit design. A probe card in a testing apparatus includes probes for Kelvin contact, the probes for Kelvin contact including a coil probe and a POGO pin probe disposed inside the coil probe, and a probe for two-terminal measurement. Electrode pads formed in each chip area over a wafer are in a relation of A=B<2A, given that the area of one of the electrode pads with which the probe for Kelvin contact comes into contact is B and the area of the other electrode pad with which the probe for two-terminal measurement comes into contact is A.

Abstract: The present invention provides compounds which have, particularly, an inhibitory activity on production of melanin, a cell activating activity and an anti-bacterial activity, are derived from natural sources, and are safe and not harmful. One or more compounds represented by the following general formula are contained: wherein R1 represents —CH2OH, —COOR6 or —COOX, whereupon X is a group capable forming a salt and R6 represents hydrogen or a C1 to C3 lower alkyl group; R2 to R5 each represent hydrogen or a methyl group; and . . . A . . . represents ═C(CH3)—, —C(CH3)═, —C(═CH2)—, —CH(CH3)— or —C(OH)(CH3)—.

Abstract: The present invention provides compounds which have, particularly, an inhibitory activity on production of melanin, a cell activating activity and an anti-bacterial activity, are derived from natural sources, and are safe and not harmful. One or more compounds represented by the following general formula are contained: wherein R1 represents —CH2OH, —COOR6 or —COOX, whereupon X is a group capable forming a salt and R6 represents hydrogen or a C1 to C3 lower alkyl group; R2 to R5 each represent hydrogen or a methyl group; and . . . A . . . represents ═C(CH3)—, —C(CH3)═, —C(═CH2)—, —CH(CH3)— or —C(OH) (CH3)—.

Abstract: A process for distilling a crude acrylic silane solution particularly containing impurities in a commercial scale for separating acrylic silane in the presence of a hindered phenol and/or amine as polymerization inhibitor, the process being improved by using simultaneously a dialkyldithiocarbamic acid copper and/or N-nitrosophenylhydroxylamine salt as synergistic polymerization inhibitor.

Abstract: A process is disclosed for producing a diorganopolysiloxane by polymerizing a cyclic siloxane expressed by the following general formula (2) ##STR1## wherein R.sup.3 represents methyl group, ethyl group, or phenyl group, and p is an integer of 3 or 4,by an anion living polymerization using a lithium trialkylsilonolate or an alkyl lithium as a polymerization initiator and then terminating the anion living polymerization with an acid or a chlorosilane derivative, the improvement comprising treating a diorganopolysiloxane which is modified with a silanol at both its terminals and included in the cyclic siloxane as impurities, with an acetylating agent.

Abstract: A process for producing a rod-form silica from a silicic acid ester according to a sol-gel process, which silica has a rod-form having a high aspect ratio and is advantageously used as a filler for resin sealants for semiconductors, is provided, which process comprises adding 35 to 150 parts by weight of a sol of a silicic acid ester to 100 parts by weight of a hydrophobic medium to form an emulsion, subjecting the emulsion to a temperature rise at two stages, the first temperature rise being by 5.degree. to 30.degree. C. at a rate of 10.degree. to 200.degree. C./min. or less and the second temperature rise being by 3.degree. to 20.degree. C. at a rate of 0.5.degree. to 10.degree. C./min., to form a rod-form silica.