Abstract: According to one embodiment, a semiconductor memory device includes a housing and terminals. The housing has a first end edge extending in a first direction and a second end edge opposite to the first end edge. The terminals include signal terminals and include first terminals, second terminals, and third terminals. The first terminals are arranged in the first direction at a position close to the first end edge. The second terminals are arranged in the first direction with intervals at a position closer to the first end edge than the second end edge. The first plurality of terminals are closer to the first end edge than the second plurality of terminals are. The third terminals are arranged in the first direction with intervals at a position closer to the second end edge than the first end edge.

Abstract: According to one embodiment, a semiconductor storage device includes a housing, a plurality of terminals, signal terminals, a controller, signal wiring, and a memory. The housing has a first face and a second face opposite to the first face. The plurality of terminals is exposed to the first face, extends in a first direction, and is spaced apart in a second direction intersecting with the first direction. A signal terminal included in the plurality of terminals has a first end in the first direction, and a second end opposite to the first end in the first direction, the second end being closer to a contact position with a socket contact than the first end. The controller is located in the housing. The signal wiring extends from the first end in the housing and electrically connects the first end and the controller. The memory is electrically connected to the controller in the housing.

Abstract: According to one embodiment, a semiconductor storage device includes a housing, a plurality of terminals, signal terminals, a controller, signal wiring, and a memory. The housing has a first face and a second face opposite to the first face. The plurality of terminals is exposed to the first face, extends in a first direction, and is spaced apart in a second direction intersecting with the first direction. A signal terminal included in the plurality of terminals has a first end in the first direction, and a second end opposite to the first end in the first direction, the second end being closer to a contact position with a socket contact than the first end. The controller is located in the housing. The signal wiring extends from the first end in the housing and electrically connects the first end and the controller. The memory is electrically connected to the controller in the housing.

Abstract: A memory card includes a substrate, a nonvolatile memory on the substrate, a memory controller on the substrate and configured to control access to the nonvolatile memory, an interface terminal for external wired connection, on the substrate, an antenna, a plain region surrounded by the antenna including a first region that overlaps with the substrate and a second region that does not overlap with the substrate, and a communication controller disposed on the substrate, electrically connected to the antenna, and configured to wirelessly communicate with an external device through the antenna, using power generated at the antenna by an electromagnetic induction caused by the external device.

Abstract: There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.

Abstract: There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.

Abstract: There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.

Abstract: A memory card includes a substrate, a nonvolatile memory on the substrate, a memory controller on the substrate and configured to control access to the nonvolatile memory, an interface terminal for external wired connection, on the substrate, an antenna, a plain region surrounded by the antenna including a first region that overlaps with the substrate and a second region that does not overlap with the substrate, and a communication controller disposed on the substrate, electrically connected to the antenna, and configured to wirelessly communicate with an external device through the antenna, using power generated at the antenna by an electromagnetic induction caused by the external device.

Abstract: There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.

Abstract: There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.

Abstract: A farm work management system includes a communication apparatus for transmitting location information of a worker carrying out a farm work and a farm work management apparatus for managing a progress of the farm work based on the location information transmitted from the communication apparatus. The communication apparatus includes a notifying unit for notifying the farm work management apparatus to the effect that the farm work is started or the farm work is finished in a case where an operation unit receives the predetermined operation. The farm work management apparatus includes a work location identifying unit for identifying the work location based on the location information transmitted from the communication apparatus, a calculating unit for calculating an estimated work time from read information, and a transmitting unit for transmitting to the communication apparatus the information about the read work content and the estimated work time having been calculated.

Abstract: A semiconductor memory card includes a lead frame having external connection terminals, a controller chip mounted on the lead frame and a memory chip mounted on the lead frame. The lead frame, the controller chip, and the memory chip are sealed with a sealing resin layer that has a surface at which the external connection terminals are exposed and a recess surrounding the external connection terminals.

Abstract: According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.

Abstract: When the coating object area is positioned on the suction table, the film is stopped and is mounted on the suction table, and is further provided with tension in the longitudinal direction to eliminate slacks or the like, but, curl is caused in the both side end regions in the coating object area. Therefore, the coating object area is mounted on the suction table, and at the same time, the curl correction bars disposed on the both sides of the suction table are moved to the curled portions of the coating object area, and then the curled portions are pressed against the suction surface of the suction table to thereby perform the curl correction. Further, in the coating process with the UV-curing coating material, the UV light from the UV light source formed integrally with the coating head is applied to cure the material. In the vacuum suction section, as the destination, the bubbles or the like in the coating head are sucked.

Abstract: A farm work management system includes a communication apparatus for transmitting location information of a worker carrying out a farm work and a farm work management apparatus for managing a progress of the farm work based on the location information transmitted from the communication apparatus. The communication apparatus includes a notifying unit for notifying the farm work management apparatus to the effect that the farm work is started or the farm work is finished in a case where an operation unit receives the predetermined operation. The farm work management apparatus includes a work location identifying unit for identifying the work location based on the location information transmitted from the communication apparatus, a calculating unit for calculating an estimated work time from read information, and a transmitting unit for transmitting to the communication apparatus the information about the read work content and the estimated work time having been calculated.

Abstract: A film paid out from a feed side film roll is conveyed so that an application target area of the film is located on a suction table in an application portion. Image-capturing cameras are disposed so as to be adjacent to ink-jet application heads so that one application head and one image-capturing camera are integrated with each other in terms of position of installation to form one application head unit portion. Each application head unit portion is moved above the suction table by a three-dimensionally movable XYZ-direction driving unit. A position where application will be performed next is image-captured by each of the image-capturing cameras in advance during the applying operation due to each of the application heads. A result of image capturing by each of the image-capturing cameras is processed by an image processing unit.

Abstract: A semiconductor memory card includes a lead frame having external connection terminals, a controller chip mounted on the lead frame and a memory chip mounted on the lead frame. The lead frame, the controller chip, and the memory chip are sealed with a sealing resin layer that has a surface at which the external connection terminals are exposed and a recess surrounding the external connection terminals.