Patents by Inventor Katsuyuki Adachi

Katsuyuki Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7622757
    Abstract: A semiconductor device comprises a plurality of semiconductor elements; and a first wire and a second wire provided to connect the semiconductor elements in parallel. The first wire and the second wire include respective wires formed in multiple wiring layers. Each wiring layer includes the first wire and the second wire formed alternately and in parallel. The wires are formed as to intersect each other in adjacent wiring layers. The first wires are connected with each other through a via-connection at an intersection of the first wires and the second wires are connected with each other through a via-connection at an intersection of the second wires.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: November 24, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichi Endo, Yasuto Sumi, Katsuyuki Adachi
  • Publication number: 20060264034
    Abstract: A semiconductor device comprises a plurality of semiconductor elements; and a first wire and a second wire provided to connect the semiconductor elements in parallel. The first wire and the second wire include respective wires formed in multiple wiring layers. Each wiring layer includes the first wire and the second wire formed alternately and in parallel. The wires are formed as to intersect each other in adjacent wiring layers. The first wires are connected with each other through a via-connection at an intersection of the first wires and the second wires are connected with each other through a via-connection at an intersection of the second wires.
    Type: Application
    Filed: May 2, 2006
    Publication date: November 23, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichi Endo, Yasuto Sumi, Katsuyuki Adachi