Patents by Inventor Katsuyuki EBISAWA

Katsuyuki EBISAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116090
    Abstract: Provided are a tank support jig and a tank cleaning method. The tank support jig for supporting a cylindrical tank includes a curved body having a first end and a second end that face with an interval in between; and a connecting member disposed across the interval, the connecting member connecting the first end and the second end of the curved body such that the interval is adjustable, in which the curved body and the connecting member form an annular structure for the tank that is to be placed horizontally inside the annular structure with the curved body in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Inventors: Chun Cheng Chen, Chi Hsing Fu, Katsuyuki Ebisawa, Bo Yu Lin
  • Patent number: 10312125
    Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb??(1) Ta<Tb??(2) (Ga*Ta+Gb*Tb)/(Ta+Tb)?1.4E+06 Pa.??(3) Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: June 4, 2019
    Assignee: DEXERIALS CORPORATION
    Inventors: Hironobu Moriyama, Hidekazu Yagi, Tomoyuki Ishimatsu, Katsuyuki Ebisawa, Keiji Honjyo, Junichi Kaneko
  • Publication number: 20180151405
    Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb??(1) Ta<Tb??(2) (Ga*Ta+Gb*Tb)/(Ta+Tb)?1.4E+06 Pa.??(3) Ga represents a shear storage modulus of the first thermoplastic resin layer at a pasting temperature at which the protective tape is pasted; Gb represents a shear storage modulus of the second thermoplastic resin layer at the pasting temperature at which the protective tape is pasted; Ta represents a thickness of the first thermoplastic resin layer; and Tb represents a thickness of the second thermoplastic resin layer.
    Type: Application
    Filed: June 3, 2016
    Publication date: May 31, 2018
    Applicant: DEXERIALS CORPORATION
    Inventors: Hironobu MORIYAMA, Hidekazu YAGI, Tomoyuki ISHIMATSU, Katsuyuki EBISAWA, Keiji HONJYO, Junichi KANEKO