Patents by Inventor Katsuyuki Fukutome

Katsuyuki Fukutome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder material, junctioning method, junction material, and semiconductor device
    Patent number: 5609287
    Abstract: A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material-having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprise putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: March 11, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Goro Izuta, Shunichi Abe, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi, Yoshihiro Kashiba, Masaaki Namatame
  • Solder material, junctioning method, junction material, and semiconductor device
    Patent number: 5372295
    Abstract: A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder.A junctioning method comprises putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other.
    Type: Grant
    Filed: October 1, 1992
    Date of Patent: December 13, 1994
    Assignee: Ryoden Semiconductor System Engineering Corporation
    Inventors: Shunichi Abe, Katunori Asai, Yoshihiro Tomita, Hideyuki Ichiyama, Seizou Ohumae, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi