Abstract: A pressing which a ram repeats an up-and-down motion for press working machine that performs a continuous operation in by a press die held by a die holding portion of a bolster and a die holding portion of the ram includes: a die positioning portion that positions the press die in a first direction being a moving direction of the ram; a position adjustment mechanism having a servomotor as a drive source and optionally changing a position where the press die is positioned by the die positioning portion; and a drive control unit driving, when position change data is given during the continuous operation, the servomotor such that the position where the press die is positioned by the die positioning portion is changed to a position corresponding to the position change data when reaction force of the press working not applied to the die positioning portion during continuous operation.

Abstract: A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.

Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Abstract: A method for bonding wafers includes forming a first bonding part on a surface of a first wafer by stacking a diffusion preventing layer formed of a material having low wettability with AuSn above the first wafer and forming a bonding layer on a surface of the diffusion preventing layer such that the bonding layer stays back of an edge of the diffusion preventing layer, forming a second bonding part on a surface of a second wafer, and bonding the first bonding part and the second bonding part by eutectic bonding with an AuSn solder under a condition that the first wafer and the second wafer are opposed to each other.

Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Abstract: A semiconductor sensor has a first semiconductor layer as a base, an insulating layer formed on the first semiconductor layer, and a second semiconductor layer formed on the insulating layer. A recess is formed from a bottom surface of the first semiconductor layer up to a top surface of the insulating layer. The second semiconductor layer is covered with the insulating layer in an outer circumference of a top surface of the recess. A sensitive region of the second semiconductor layer is exposed in a region except the outer circumference of the top surface of the recess.

Abstract: A semiconductor sensor has a first semiconductor layer as a base, an insulating layer formed on the first semiconductor layer, and a second semiconductor layer formed on the insulating layer. A recess is formed from a bottom surface of the first semiconductor layer up to a top surface of the insulating layer. The second semiconductor layer is covered with the insulating layer in an outer circumference of a top surface of the recess. A sensitive region of the second semiconductor layer is exposed in a region except the outer circumference of the top surface of the recess.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front pane!.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front pane!.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by a catch and a device coupling device. The coupling includes a slide provided with a slide plate that slides with respect to a bracket embedded in the unit main body, and a holder is provided at a front face of the slide plate for holding the front panel.

Abstract: A monitoring system indicating the condition of a plant at any time and from any place by particularly utilizing a small graphical content such as the display of a handy cellular phone. In particular, necessary equipment information can be quickly extracted from among many pieces of equipment to be monitored in a large-scale plant including a lot of monitored objects. The monitoring system includes a structured equipment information storage part for storing structured equipment information including equipment information on pieces of equipment and relational information describing relations among the pieces of equipment, and a monitored equipment extraction part for extracting a set of pieces of related equipment information associated with a piece of equipment of interest based on the structured equipment information with the equipment of interest, which is separately designated, being set as a base point of extraction.

Abstract: Coupling between a unit main body and a front panel is detachably carried out by catching means and coupling means. The coupling means comprise slide means 33 provided with a slide plate 24 which slides with respect to a bracket hardware 24 embedded in the unit main body, and holding means 28 provided at a front face of the slide plate 24 and for holding the front panel.

Abstract: A monitoring system is provided which is capable of grasping the condition of a plant at any time and from any place by particularly utilizing a small graphical content such as the display of a handy cellular phone, etc. In particular, necessary equipment information can be quickly extracted from among many pieces of equipment to be monitored in a large-scale plant including a lot of monitored objects. The monitoring system includes a structured equipment information storage part for storing structured equipment information including equipment information on a plurality of pieces of equipment and relational information describing relations among the pieces of equipment, and a monitored equipment extraction part for extracting a set of pieces of related equipment information associated with a piece of equipment of interest based on the structured equipment information with the equipment of interest, which is separately designated, being set as a base point of extraction.