Abstract: A surface acoustic wave device including a dielectric substrate having an input electrode and an output electrode and a grounding electrode on a first surface of the dielectric substrate, and an outer electrode on a second surface of the dielectric substrate; and a surface acoustic wave element having an electrode pad and a comb-shaped electrode disposed on a first surface of the surface acoustic wave element. The surface acoustic wave element is bonded to the dielectric substrate via a metal bump and a conductive resin formed on the electrode pad. The surface acoustic wave device further includes an insulating resin deposited on the periphery of the metal bump, and a guard layer shorter in height than the surface acoustic wave element formed adjacent the surface acoustic wave element on the first surface of the dielectric substrate.

Abstract: A high frequency ceramic multi-layer substrate includes a stripline embedded between two dielectric layers having ground electrodes at the top surface and at the bottom surface thereof and an electric circuit formed on another dielectric layer applied to one of the ground electrodes. The stripline is connected to the electric circuit through via holes provided through the dielectric layers. The equivalent length from the stripline to the electric circuit is a fourth of the wavelength of an input high frequency signal, to result in a high frequency attenuation circuit. Another high frequency ceramic multi-layer substrate further includes another electrode provided via another dielectric layer of larger dielectric constant to form a capacitor with one of the ground electrodes, and another dielectric layer for forming an electric circuit thereon is applied to the electrode. The stripline is connected to the electric circuit through via holes provided through dielectric layers.