Abstract: An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.

Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.

Abstract: A wound unit of an electronic components series comprises a cylindrical core and a tape-shaped electronic components series wound in layers on its circumferential surface. On the periphery of the core, there is formed a slit. The electronic components series include a carrier tape made of a cardboard or the like on which not only the feeding holes having a certain pitch are formed but also many through holes responding to the shape of electronic components to be contained therein are distributed in a longitudinal direction. In each of these through holes are contained electronic components and on both of the main surfaces of the carrier tape, cover tapes are adhered to seal off the through holes. The tip of the electronic components series is inserted into the slit of the core and the electronic components series is wound in layers on the circumferential surface of the core.

Abstract: A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts.